圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 40LFCSP
|
封裝: 40-VFQFN Exposed Pad, CSP |
庫存2,720 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad, CSP | 40-LFCSP (6x6) |
|
|
Maxim Integrated |
IC AUTO SNSR SIGNAL COND 16SSOP
|
封裝: 16-SSOP (0.209", 5.30mm Width) |
庫存49,296 |
|
Analog | Analog | - | 6mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
|
|
Maxim Integrated |
IC SFP CONTROLLER 28TQFN
|
封裝: 28-WFQFN Exposed Pad |
庫存6,192 |
|
Analog, Digital | Digital | I2C, LDD, Serial | 2.5mA | -40°C ~ 95°C | Surface Mount | 28-WFQFN Exposed Pad | 28-TQFN (5x5) |
|
|
Analog Devices Inc. |
IC CCD SGNL PROC 12BIT 105CSBGA
|
封裝: 105-LFBGA, CSPBGA |
庫存7,440 |
|
Logic | Logic | 3-Wire Serial | 27mA | -25°C ~ 85°C | Surface Mount | 105-LFBGA, CSPBGA | 105-CSPBGA (8x8) |
|
|
Microchip Technology |
IC DUAL SENSOR 16SOIC
|
封裝: 16-SOIC (0.154", 3.90mm Width) |
庫存2,000 |
|
- | - | - | - | -40°C ~ 95°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SO |
|
|
Maxim Integrated |
IC SIGNAL COND QUAD 68-QFN
|
封裝: 68-VFQFN Exposed Pad |
庫存13,872 |
|
CML | CML | LVTTL | 495mA | 0°C ~ 85°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN Exposed Pad (10x10) |
|
|
Texas Instruments |
IC 4-20MA I-TRANSMITTER 14-DIP
|
封裝: 14-DIP (0.300", 7.62mm) |
庫存4,992 |
|
Differential | Voltage | 3-Wire | 20mA | -40°C ~ 85°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
|
|
Exar Corporation |
SENSOR
|
封裝: 24-WFQFN Exposed Pad |
庫存5,760 |
|
- | - | I2C | 457µA | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (3.5x3.5) |
|
|
Analog Devices Inc. |
IC CCD SIGNAL PROC 10BIT 48LQFP
|
封裝: 48-LQFP |
庫存13,836 |
|
Logic | Logic | 3-Wire Serial | - | -20°C ~ 75°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
|
|
Texas Instruments |
IC SENSOR SIGNAL COND 20VQFN
|
封裝: 20-VQFN Exposed Pad |
庫存7,392 |
|
Logic | Logic | - | 6.8mA | -40°C ~ 125°C | Surface Mount | 20-VQFN Exposed Pad | 20-VQFN (5x5) |
|
|
Texas Instruments |
IC FDC CAPTIVE SENSING 12WSON
|
封裝: 12-WFDFN Exposed Pad |
庫存4,512 |
|
Capacitive | I2C | - | 2.1mA | -40°C ~ 125°C | Surface Mount | 12-WFDFN Exposed Pad | 12-WSON (4x4) |
|
|
Linear Technology |
IC THERMOCOUPLE AMPLIFIER 8-DIP
|
封裝: 8-DIP (0.300", 7.62mm) |
庫存2,160 |
|
Voltage | Thermocouple | - | 800µA | 0°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
|
|
Texas Instruments |
IC SENSOR SIGNAL COND 20SOPWRPAD
|
封裝: 20-SOIC (0.295", 7.50mm Width) Exposed Pad |
庫存5,728 |
|
Logic | Logic | - | 6.8mA | -40°C ~ 125°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) Exposed Pad | 20-SO PowerPad |
|
|
|
Rohm Semiconductor |
IC CAP SENSOR SWITCH 8CH 16-SSOP
|
封裝: 16-LSOP (0.173", 4.40mm Width) |
庫存5,888 |
|
Logic | Logic | Port | 500µA | -40°C ~ 85°C | Surface Mount | 16-LSOP (0.173", 4.40mm Width) | 16-SSOPA |
|
|
|
Microchip Technology |
IC PHOTOELECT SMOKE DETECT 16SOI
|
封裝: 16-SOIC (0.154", 3.90mm Width) |
庫存6,012 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
|
|
Maxim Integrated |
IC SENSOR HALL EFFECT 10-MSOP
|
封裝: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
庫存10,272 |
|
Voltage | Logic | 2-Wire | 1.3mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
|
|
Diodes Incorporated |
PIR CONTROLLER PDIP-16
|
封裝: - |
庫存2,000 |
|
- | - | - | 120µA | -20°C ~ 70°C | - | - | - |
|
|
Analog Devices Inc. |
IC THERMOCOUPLE A W/COMP 8MSOP
|
封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
庫存5,392 |
|
Differential | Analog | - | 250µA | 0°C ~ 50°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
|
|
|
Linear Technology |
IC THERMOCOUPL 2 PIECE KIT 8DIP
|
封裝: 8-DIP (0.300", 7.62mm) |
庫存6,320 |
|
Voltage | Thermocouple | - | 800µA | 0°C ~ 70°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
|
|
Texas Instruments |
IC PROG SNSR COND V-OUT 16-TSSOP
|
封裝: 16-TSSOP (0.173", 4.40mm Width) |
庫存77,856 |
|
Logic | Voltage | 1-Wire?, 2-Wire | 1.2mA | -40°C ~ 125°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
|
|
Texas Instruments |
IC PREC VOLT-CURR CONV/TX 10MSOP
|
封裝: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
庫存8,808 |
|
Voltage | Voltage | 3-Wire | 550µA | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-MSOP-PowerPad |
|
|
Melexis Technologies NV |
AUTOMOTIVE TOF COMPANION CHIP
|
封裝: 84-VFQFN Dual Rows, Exposed Pad |
庫存7,808 |
|
- | - | I²C | - | -40°C ~ 105°C | Surface Mount | 84-VFQFN Dual Rows, Exposed Pad | 84-QFN (7x7) |
|
|
|
Analog Devices Inc. |
MEASUREWARE ENVIRONMENTAL CONDIT
|
封裝: 48-WFQFN Exposed Pad, CSP |
庫存4,480 |
|
Logic | SPI | - | 6mA | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad, CSP | 48-LFCSP-WQ (7x7) |
|
|
|
Diodes Incorporated |
TRIAC DRIVER
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Azoteq (Pty) Ltd |
IC
|
封裝: - |
Request a Quote |
|
Capacitive | I2C | - | 720 µA | -40°C ~ 85°C | Surface Mount | 20-UFQFN Exposed Pad | 20-QFN (3x3) |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
