圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Semtech Corporation |
IC DAS ZOOM ADC MLPQ16
|
封裝: - |
庫存4,608 |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR
|
封裝: - |
庫存5,456 |
|
Logic | Logic | 3-Wire Serial | - | -25°C ~ 85°C | - | - | - |
||
Texas Instruments |
IC PREC V-TO-I TRANSMITER 16CDIP
|
封裝: 16-CDIP (0.300", 7.62mm) |
庫存5,456 |
|
Voltage | Current | - | 20mA | -40°C ~ 85°C | Through Hole | 16-CDIP (0.300", 7.62mm) | 16-CDIP Side Brazed |
||
Maxim Integrated |
IC TIME-TO-DIGITAL CNVTR 32TQFN
|
封裝: - |
庫存2,592 |
|
CMOS | CMOS | Serial | - | -40°C ~ 85°C | - | - | - |
||
Melexis Technologies NV |
IC OPTICAL PROXIMITY 24QFN
|
封裝: - |
庫存7,552 |
|
- | - | - | - | - | - | - | - |
||
Rohm Semiconductor |
IC PREAMP HBD PIR SENSOR 14SSOP
|
封裝: - |
庫存3,216 |
|
- | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DRIVER HORN PIEZO W/BO 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存13,728 |
|
Voltage | Voltage | CMOS | 300µA | -10°C ~ 60°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16DIP
|
封裝: 16-DIP (0.300", 7.62mm) |
庫存2,464 |
|
Photoelectric | Voltage | - | 4µA | -25°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Rohm Semiconductor |
IC CAP SENSOR SWITCH 24VQFN
|
封裝: 24-VFQFN Exposed Pad |
庫存20,418 |
|
- | - | Serial | 3.5mA | -20°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | VQFN024V4040 |
||
Maxim Integrated |
IC SENSOR SIGNAL COND 16-SSOP
|
封裝: 16-SSOP (0.209", 5.30mm Width) |
庫存6,024 |
|
Analog | Analog | Serial | 2.5mA | 0°C ~ 70°C | Surface Mount | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP |
||
Maxim Integrated |
IC HALL EFFECT SENSOR 10UMAX
|
封裝: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
庫存19,956 |
|
Logic | Analog, Digital | 2-Wire | 1mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
||
Maxim Integrated |
IC CONV THRMCPLE-DIG T TYPE TDFN
|
封裝: 10-WFDFN Exposed Pad |
庫存17,460 |
|
Thermocouple (Multiple) | Digital | 1-Wire? | 900µA | -40°C ~ 125°C | Surface Mount | 10-WFDFN Exposed Pad | 10-TDFN-EP (3x4) |
||
Analog Devices Inc. |
IC CAP CONV 2CH ULT LP 10MSOP
|
封裝: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
庫存10,128 |
|
Voltage | Digital | 2-Wire Serial | 120µA | -40°C ~ 85°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |
||
Analog Devices Inc. |
IC THRMOCPLE COLD JNC COMP 8MSOP
|
封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
庫存21,672 |
|
Differential | Analog | - | 250µA | 0°C ~ 50°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Renesas Electronics America |
IC BIAS CTRLR UNIV SNSR 14-TSSOP
|
封裝: 14-TSSOP (0.173", 4.40mm Width) |
庫存4,992 |
|
Voltage | Voltage | 2-Wire | 15mA | -40°C ~ 100°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
ISSI, Integrated Silicon Solution Inc |
IC TOUCH SENSOR CAP 4CH 16SOP 6M
|
封裝: 16-SOIC (0.154", 3.90mm Width) |
庫存7,408 |
|
Capacitive | I²C | - | 476µA | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC 10BIT 48-LQFP
|
封裝: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
封裝: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
RESISTIVE 2-CHANNEL SENSOR SIGNA
|
封裝: - |
Request a Quote |
|
Analog, Digital | I2C, SPI | - | 15 mA | -40°C ~ 125°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (5x5) |
||
STMicroelectronics |
Linear IC's
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 40-LFCSP
|
封裝: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad, CSP | 40-LFCSP (6x6) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Motorola |
ELECTRIC FIELD IMAGING DEVICE, P
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
ScioSense |
ULTRASONIC FLOW CONVERTER
|
封裝: - |
Request a Quote |
|
Digital | SPI | - | 3.6 µA | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |