圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
IC SGNL CONDITIONER 28-SOIC
|
封裝: 28-SOIC (0.295", 7.50mm Width) |
庫存5,168 |
|
Analog | Analog | Serial | 2.6mA | 0°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
|
|
NXP |
IC SENSOR ELECTRIC FIELD 54-SOIC
|
封裝: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存5,280 |
|
Logic | Logic | ISO9141 | 7mA | -40°C ~ 85°C | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOIC W EP |
|
|
NXP |
IC IMAGING DEVICE ELEC 24SOIC
|
封裝: 24-SOIC (0.295", 7.50mm Width) |
庫存5,232 |
|
Logic | Voltage | - | 8mA | 0°C ~ 90°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
|
|
NXP |
IC SMOKE DETECT PHOTOELEC 16-DIP
|
封裝: 16-DIP (0.300", 7.62mm) |
庫存4,640 |
|
Photoelectric | Voltage | - | 12µA | -10°C ~ 60°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
|
NXP |
IC SENSOR ELECTRIC FIELD 44-HSOP
|
封裝: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad |
庫存4,592 |
|
Logic | Logic | ISO9141 | 7mA | -40°C ~ 85°C | Surface Mount | 44-BSSOP (0.433", 11.00mm Width) Exposed Pad | 44-HSOP |
|
|
|
Texas Instruments |
IC 4-20 MA I-TRANSMITTER 16-DIP
|
封裝: 16-DIP (0.300", 7.62mm) |
庫存3,408 |
|
Differential | - | - | 20mA | -40°C ~ 125°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
|
Analog Devices Inc. |
IC CCD SIGNAL PROC 14BIT 28-SOIC
|
封裝: 28-SOIC (0.295", 7.50mm Width) |
庫存27,756 |
|
Logic | Logic | 3-Wire Serial | 80mA | 0°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
|
|
Texas Instruments |
IC PROG SENSOR SGL COND 10-MSOP
|
封裝: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
庫存7,184 |
|
Voltage | Voltage | UART | 1.6mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-VSSOP |
|
|
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存4,944 |
|
Thermocouple (Multiple) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Microchip Technology |
IC TOUCH CTRLR
|
封裝: 28-UFQFN Exposed Pad |
庫存5,472 |
|
Digital | Analog | Serial | 200µA | -40°C ~ 85°C | Surface Mount | 28-UFQFN Exposed Pad | 28-UQFN (4x4) |
|
|
Diodes Incorporated |
PIR CONTROLLER SO-16
|
封裝: - |
庫存2,352 |
|
- | - | - | - | - | - | - | - |
|
|
|
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存5,744 |
|
Thermocouple (Multiple) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Intersil |
IC TOF SIGNAL PROCESSOR 24QFN
|
封裝: 24-VFQFN Exposed Pad |
庫存5,696 |
|
- | - | I2C | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x5) |
|
|
|
ams |
STRAIN GAUGE
|
封裝: Die |
庫存5,664 |
|
- | - | 4-Wire SPI Serial | 150nA | -40°C ~ 125°C | Surface Mount | Die | Die |
|
|
Microchip Technology |
IC HORN DRIVER DUAL 8DIP
|
封裝: 8-DIP (0.300", 7.62mm) |
庫存46,644 |
|
Logic | Logic | Logic | 100nA | 0°C ~ 50°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
|
|
Analog Devices Inc. |
IC LVDT SGNL COND OSC/REF 20SOIC
|
封裝: 20-SOIC (0.295", 7.50mm Width) |
庫存36,540 |
|
Voltage | Voltage | LVDT | 15mA | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
Texas Instruments |
IC SIGNAL COND 16TSSOP
|
封裝: 16-TSSOP (0.173", 4.40mm Width) |
庫存6,336 |
|
Logic | Voltage | 1-Wire?, 2-Wire | 1.2mA | -40°C ~ 125°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
|
|
Maxim Integrated |
IC THERMISTOR TO DGTL 8UMAX
|
封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
庫存32,496 |
|
Logic | Logic | 3-Wire SPI Serial | 29µA | -55°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-uMAX |
|
|
|
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Texas Instruments |
ULTRASONIC SENSOR I/F FOR PARK A
|
封裝: - |
庫存1,260 |
|
Analog, Digital | SPI | - | 13 mA | -25°C ~ 105°C (TA) | Surface Mount | 20-WFQFN Exposed Pad | 20-QFN (4x4) |
|
|
|
Analog Devices Inc./Maxim Integrated |
EMBEDDED MODULE WITH OPTICAL AFE
|
封裝: - |
Request a Quote |
|
Digital | I2C, SPI | - | 4.2 µA | 0°C ~ 70°C | Surface Mount | 38-VFLGA Module | 38-OLGA (4.1x4.5) |
|
|
|
Renesas Electronics Corporation |
TSSOP / 16 / 5X4MM-0
|
封裝: - |
Request a Quote |
|
Digital | 1-Wire® | - | - | -40°C ~ 150°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) Exposed Pad | 16-TSSOP-EP |
|
|
|
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 56-LFCSP
|
封裝: - |
Request a Quote |
|
Logic | Logic | - | 30 mA | -20°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad, CSP | 56-LFCSP-VQ (8x8) |
|
|
|
Renesas Electronics Corporation |
IC SENSOR SIGNAL CONDITIONER
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Analog Devices Inc./Maxim Integrated |
IC INTEGRATED CIRCUIT
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Analog Devices Inc./Maxim Integrated |
SENSOR HUB W/ SPO2, HR & BP ALGO
|
封裝: - |
庫存7,491 |
|
Digital | I2C | - | - | -40°C ~ 105°C (TA) | Surface Mount | 16-WFBGA, WLBGA | 16-WLP (1.55x1.57) |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
封裝: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
