頁 38 - 嵌入式 - 系統單晶片 (SoC) | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
10AS057K2F35E1SG	Altera	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,664	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 570K Logic Elements	0°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FCBGA (35x35)
10AS048H4F34E3SG	Altera	IC SOC FPGA 492 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存4,304	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 480K Logic Elements	0°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
10AS016E4F29E3SG	Altera	IC SOC FPGA 288 I/O 780FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 160K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-FBGA (29x29)	封裝: 780-BBGA, FCBGA	庫存4,560	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 160K Logic Elements	0°C ~ 100°C (TJ)	780-BBGA, FCBGA	780-FBGA (29x29)
XCZU11EG-1FFVC1156I	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存5,568	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?	-	256KB	DMA, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.5GHz	Zynq?UltraScale+? FPGA, 653K+ Logic Cells	-40°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)
M2S050TS-1VF400I	Microsemi Corporation	IC FPGA SOC 50K LUTS 400VFBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	封裝: 400-LFBGA	庫存5,536	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	-40°C ~ 100°C (TJ)	400-LFBGA	400-VFBGA (17x17)
M2S050-VFG400	Microsemi Corporation	IC FPGA SOC 50K LUTS 400VFBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17)	封裝: 400-LFBGA	庫存6,256	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	0°C ~ 85°C (TJ)	400-LFBGA	400-VFBGA (17x17)
M2S025-1FGG484	Microsemi Corporation	IC FPGA SOC 25K LUTS 484FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	封裝: 484-BGA	庫存4,192	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	484-BGA	484-FPBGA (23x23)
BCM33843EUKFSBG	Broadcom Limited	CABLE MODEM Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存2,256	-	-	-	-	-	-	-	-	-	-
10AS057K2F35I2SG	Intel	IC SOC FPGA 396 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存2,576	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 570K Logic Elements	-40°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FCBGA (35x35)
10AS016E3F27I2SG	Intel	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 160K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	封裝: 672-BBGA, FCBGA	庫存2,336	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 160K Logic Elements	-40°C ~ 100°C (TJ)	672-BBGA, FCBGA	672-FBGA (27x27)
5CSXFC4C6U23I7N	Intel	IC FPGA 224 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 40K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封裝: 672-FBGA	庫存7,184	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 40K Logic Elements	-40°C ~ 100°C (TJ)	672-FBGA	672-UBGA (23x23)
AGIB022R31A2E2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.2M Logic Elements	0°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
XCVC1702-1LSIVSVA1596	AMD	IC VERSAL AI-CORE FPGA 1596BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 400MHz, 1GHz Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1596-BFBGA Supplier Device Package: 1596-BGA (37.5x37.5)	封裝: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	400MHz, 1GHz	Versal™ AI Core FPGA, 1M Logic Cells	-40°C ~ 100°C (TJ)	1596-BFBGA	1596-BGA (37.5x37.5)
5ASXFB3H4F40C5G	Intel	IC SOC CORTEX-A9 800MHZ 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA, FC (40x40)	封裝: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 350K Logic Elements	0°C ~ 85°C (TJ)	1517-BBGA, FCBGA	1517-FBGA, FC (40x40)
MPFS250T-1FCG1152EES	Microchip Technology	IC SOC RISC-V 1152FCBGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128kB RAM Size: 2.2MB Peripherals: DMA, PCI, PWM Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 254K Logic Modules Operating Temperature: 0°C ~ 100°C Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FCBGA (35x35)	封裝: -	Request a Quote	RISC-V	128kB	2.2MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 254K Logic Modules	0°C ~ 100°C	1152-BBGA, FCBGA	1152-FCBGA (35x35)
AGIB027R31B2I2VB	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.7M Logic Elements	-40°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
XCZU48DR-1FFVG1517I	AMD	IC ZUP RFSOC A53 FPGA 1517BGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 500MHz, 1.2GHz Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
XCVC1502-1LLINSVG1369	AMD	IC VERSAL AI-CORE FPGA 1369BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 400MHz, 1GHz Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1369-BFBGA, FCBGA Supplier Device Package: 1369-FCBGA (35x35)	封裝: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	400MHz, 1GHz	Versal™ Prime FPGA, 80k Logic Cells	-40°C ~ 100°C (TJ)	1369-BFBGA, FCBGA	1369-FCBGA (35x35)
AGID041R29D1E1VB	Intel	IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4M Logic Elements	0°C ~ 100°C (TJ)	2957-BFBGA Exposed Pad	2957-BGA (56x45)
AGFA019R25A2I2V	Intel	IC FPGA AGILEX-F 2581FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.9M Logic Elements	-40°C ~ 100°C (TJ)	-	-
AGFC023R31C2I1V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.3M Logic Elements	-40°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
DRA821U2CGBALM	Texas Instruments	IC Architecture: MCU, MPU Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F Flash Size: - RAM Size: 1.5MB Peripherals: DMA, PWM, WDT Connectivity: Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB Speed: 750MHz, 500MHz Primary Attributes: - Operating Temperature: -40°C ~ 105°C (TJ) Package / Case: 433-BFBGA, FCBGA Supplier Device Package: 433-FCBGA (17.2x17.2)	封裝: -	Request a Quote	ARM® Cortex®-A72, ARM® Cortex®-R5F	-	1.5MB	DMA, PWM, WDT	Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB	750MHz, 500MHz	-	-40°C ~ 105°C (TJ)	433-BFBGA, FCBGA	433-FCBGA (17.2x17.2)
R9A06G037GNP-AA0	Renesas Electronics Corporation	SOC PLC MODEM LSI SMART GRID ASS Architecture: DSP, MCU Core Processor: ARM® Cortex®-M3 Flash Size: - RAM Size: 128KB Peripherals: PWM Connectivity: CSI, I2C, UART Speed: 138MHz Primary Attributes: - Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 64-VFQFN Exposed Pad Supplier Device Package: 64-HVQFN (9x9)	封裝: -	庫存675	ARM® Cortex®-M3	-	128KB	PWM	CSI, I2C, UART	138MHz	-	-40°C ~ 85°C (TA)	64-VFQFN Exposed Pad	64-HVQFN (9x9)
1SX165HU2F50I2VG	Intel	IC FPGA STRATIX 10 2397FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 1650K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2397-BBGA, FCBGA Supplier Device Package: 2397-FBGA, FC (50x50)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 1650K Logic Elements	-40°C ~ 100°C (TJ)	2397-BBGA, FCBGA	2397-FBGA, FC (50x50)
AGFA014R24C2E3V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.4M Logic Elements	0°C ~ 100°C (TJ)	-	-
MPFS095TL-FCVG484E	Microchip Technology	IC SOC RISC-V 484FCBGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128kB RAM Size: 857.6kB Peripherals: DMA, PCI, PWM Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 93K Logic Modules Operating Temperature: 0°C ~ 100°C Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	封裝: -	庫存9	RISC-V	128kB	857.6kB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 93K Logic Modules	0°C ~ 100°C	484-BFBGA, FCBGA	484-FCBGA (19x19)
XCVM1402-1MLINBVB1024	AMD	IC VERSALPRIME ACAP FPGA 1024BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.3GHz Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1024-BFBGA Supplier Device Package: 1024-BGA (31x31)	封裝: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.3GHz	Versal™ Prime FPGA, 1.2M Logic Cells	-40°C ~ 100°C (TJ)	1024-BFBGA	1024-BGA (31x31)
MPFS095T-1FCSG325T2	Microchip Technology	IC SOC RISC-V 325BGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128KB RAM Size: 857.6KB Peripherals: DMA, PCI, PWM Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 93K Logic Modules Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11)	封裝: -	Request a Quote	RISC-V	128KB	857.6KB	DMA, PCI, PWM	CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 93K Logic Modules	-40°C ~ 125°C (TJ)	325-TFBGA	325-BGA (11x11)

10AS057K2F35E1SG

Altera

IC SOC FPGA 396 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,664

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 570K Logic Elements

0°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FCBGA (35x35)

10AS048H4F34E3SG

Altera

IC SOC FPGA 492 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 480K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存4,304

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 480K Logic Elements

0°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FBGA (35x35)

10AS016E4F29E3SG

Altera

IC SOC FPGA 288 I/O 780FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 160K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)

封裝: 780-BBGA, FCBGA

庫存4,560

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 160K Logic Elements

0°C ~ 100°C (TJ)

780-BBGA, FCBGA

780-FBGA (29x29)

XCZU11EG-1FFVC1156I

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存5,568

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?

-

256KB

DMA, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.5GHz

Zynq?UltraScale+? FPGA, 653K+ Logic Cells

-40°C ~ 100°C (TJ)

1156-BBGA, FCBGA

1156-FCBGA (35x35)

M2S050TS-1VF400I

Microsemi Corporation

IC FPGA SOC 50K LUTS 400VFBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)

封裝: 400-LFBGA

庫存5,536

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 50K Logic Modules

-40°C ~ 100°C (TJ)

400-LFBGA

400-VFBGA (17x17)

M2S050-VFG400

Microsemi Corporation

IC FPGA SOC 50K LUTS 400VFBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)

封裝: 400-LFBGA

庫存6,256

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 50K Logic Modules

0°C ~ 85°C (TJ)

400-LFBGA

400-VFBGA (17x17)

M2S025-1FGG484

Microsemi Corporation

IC FPGA SOC 25K LUTS 484FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 25K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

封裝: 484-BGA

庫存4,192

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 25K Logic Modules

0°C ~ 85°C (TJ)

484-BGA

484-FPBGA (23x23)

BCM33843EUKFSBG

Broadcom Limited

CABLE MODEM

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,256

-

10AS057K2F35I2SG

Intel

IC SOC FPGA 396 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存2,576

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 570K Logic Elements

-40°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FCBGA (35x35)

10AS016E3F27I2SG

Intel

IC SOC FPGA 240 I/O 672FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 160K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

封裝: 672-BBGA, FCBGA

庫存2,336

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 160K Logic Elements

-40°C ~ 100°C (TJ)

672-BBGA, FCBGA

672-FBGA (27x27)

5CSXFC4C6U23I7N

Intel

IC FPGA 224 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 40K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封裝: 672-FBGA

庫存7,184

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 40K Logic Elements

-40°C ~ 100°C (TJ)

672-FBGA

672-UBGA (23x23)

AGIB022R31A2E2V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.2M Logic Elements

0°C ~ 100°C (TJ)

3184-BFBGA Exposed Pad

3184-BGA (56x45)

XCVC1702-1LSIVSVA1596

AMD

IC VERSAL AI-CORE FPGA 1596BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 400MHz, 1GHz
Primary Attributes: Versal™ AI Core FPGA, 1M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1596-BFBGA
Supplier Device Package: 1596-BGA (37.5x37.5)

封裝: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

400MHz, 1GHz

Versal™ AI Core FPGA, 1M Logic Cells

-40°C ~ 100°C (TJ)

1596-BFBGA

1596-BGA (37.5x37.5)

5ASXFB3H4F40C5G

Intel

IC SOC CORTEX-A9 800MHZ 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA, FC (40x40)

封裝: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 350K Logic Elements

0°C ~ 85°C (TJ)

1517-BBGA, FCBGA

1517-FBGA, FC (40x40)

MPFS250T-1FCG1152EES

Microchip Technology

IC SOC RISC-V 1152FCBGA

Architecture: MPU, FPGA
Core Processor: RISC-V
Flash Size: 128kB
RAM Size: 2.2MB
Peripherals: DMA, PCI, PWM
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed: -
Primary Attributes: FPGA - 254K Logic Modules
Operating Temperature: 0°C ~ 100°C
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FCBGA (35x35)

封裝: -

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RISC-V

128kB

2.2MB

DMA, PCI, PWM

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

-

FPGA - 254K Logic Modules

0°C ~ 100°C

1152-BBGA, FCBGA

1152-FCBGA (35x35)

AGIB027R31B2I2VB

Intel

IC FPGA AGILEX-I 3184BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.7M Logic Elements

-40°C ~ 100°C (TJ)

3184-BFBGA Exposed Pad

3184-BGA (56x45)

XCZU48DR-1FFVG1517I

AMD

IC ZUP RFSOC A53 FPGA 1517BGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 500MHz, 1.2GHz
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

-

256KB

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

500MHz, 1.2GHz

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FCBGA (40x40)

XCVC1502-1LLINSVG1369

AMD

IC VERSAL AI-CORE FPGA 1369BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 400MHz, 1GHz
Primary Attributes: Versal™ Prime FPGA, 80k Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1369-BFBGA, FCBGA
Supplier Device Package: 1369-FCBGA (35x35)

封裝: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

400MHz, 1GHz

Versal™ Prime FPGA, 80k Logic Cells

-40°C ~ 100°C (TJ)

1369-BFBGA, FCBGA

1369-FCBGA (35x35)

AGID041R29D1E1VB

Intel

IC FPGA AGILEX-I 2957BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 4M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2957-BFBGA Exposed Pad
Supplier Device Package: 2957-BGA (56x45)

封裝: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 4M Logic Elements

0°C ~ 100°C (TJ)

2957-BFBGA Exposed Pad

2957-BGA (56x45)

AGFA019R25A2I2V

Intel

IC FPGA AGILEX-F 2581FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 1.9M Logic Elements

-40°C ~ 100°C (TJ)

-

AGFC023R31C2I1V

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.3M Logic Elements

-40°C ~ 100°C (TJ)

3184-BFBGA Exposed Pad

3184-BGA (56x45)

DRA821U2CGBALM

Texas Instruments

IC

Architecture: MCU, MPU
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F
Flash Size: -
RAM Size: 1.5MB
Peripherals: DMA, PWM, WDT
Connectivity: Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB
Speed: 750MHz, 500MHz
Primary Attributes: -
Operating Temperature: -40°C ~ 105°C (TJ)
Package / Case: 433-BFBGA, FCBGA
Supplier Device Package: 433-FCBGA (17.2x17.2)

封裝: -

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ARM® Cortex®-A72, ARM® Cortex®-R5F

-

1.5MB

DMA, PWM, WDT

Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB

750MHz, 500MHz

-

-40°C ~ 105°C (TJ)

433-BFBGA, FCBGA

433-FCBGA (17.2x17.2)

R9A06G037GNP-AA0

Renesas Electronics Corporation

SOC PLC MODEM LSI SMART GRID ASS

Architecture: DSP, MCU
Core Processor: ARM® Cortex®-M3
Flash Size: -
RAM Size: 128KB
Peripherals: PWM
Connectivity: CSI, I2C, UART
Speed: 138MHz
Primary Attributes: -
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 64-VFQFN Exposed Pad
Supplier Device Package: 64-HVQFN (9x9)

封裝: -

庫存675

ARM® Cortex®-M3

-

128KB

PWM

CSI, I2C, UART

138MHz

-

-40°C ~ 85°C (TA)

64-VFQFN Exposed Pad

64-HVQFN (9x9)

1SX165HU2F50I2VG

Intel

IC FPGA STRATIX 10 2397FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 1650K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2397-BBGA, FCBGA
Supplier Device Package: 2397-FBGA, FC (50x50)

封裝: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 1650K Logic Elements

-40°C ~ 100°C (TJ)

2397-BBGA, FCBGA

2397-FBGA, FC (50x50)

AGFA014R24C2E3V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.4M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 1.4M Logic Elements

0°C ~ 100°C (TJ)

-

MPFS095TL-FCVG484E

Microchip Technology

IC SOC RISC-V 484FCBGA

Architecture: MPU, FPGA
Core Processor: RISC-V
Flash Size: 128kB
RAM Size: 857.6kB
Peripherals: DMA, PCI, PWM
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed: -
Primary Attributes: FPGA - 93K Logic Modules
Operating Temperature: 0°C ~ 100°C
Package / Case: 484-BFBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)

封裝: -

庫存9

RISC-V

128kB

857.6kB

DMA, PCI, PWM

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

-

FPGA - 93K Logic Modules

0°C ~ 100°C

484-BFBGA, FCBGA

484-FCBGA (19x19)

XCVM1402-1MLINBVB1024

AMD

IC VERSALPRIME ACAP FPGA 1024BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.3GHz
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1024-BFBGA
Supplier Device Package: 1024-BGA (31x31)

封裝: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.3GHz

Versal™ Prime FPGA, 1.2M Logic Cells

-40°C ~ 100°C (TJ)

1024-BFBGA

1024-BGA (31x31)

MPFS095T-1FCSG325T2

Microchip Technology

IC SOC RISC-V 325BGA

Architecture: MPU, FPGA
Core Processor: RISC-V
Flash Size: 128KB
RAM Size: 857.6KB
Peripherals: DMA, PCI, PWM
Connectivity: CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed: -
Primary Attributes: FPGA - 93K Logic Modules
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 325-TFBGA
Supplier Device Package: 325-BGA (11x11)

封裝: -

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RISC-V

128KB

857.6KB

DMA, PCI, PWM

CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

-

FPGA - 93K Logic Modules

-40°C ~ 125°C (TJ)

325-TFBGA

325-BGA (11x11)