頁 146 - 嵌入式 - 系統單晶片 (SoC) | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
5ASTFD5K3F40I3NES	Altera	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.05GHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,328	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.05GHz	FPGA - 462K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA (40x40)
10AS057H1F34E1HG	Altera	IC SOC FPGA 492 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存7,728	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 570K Logic Elements	0°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
5ASXBB3D4F40I5N	Altera	IC FPGA 528 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 350K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存2,768	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 350K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA (40x40)
5CSEBA5U23A7N	Altera	IC FPGA 145 I/O 672UBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 672-FBGA Supplier Device Package: 672-UBGA (23x23)	封裝: 672-FBGA	庫存2,896	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	64KB	DMA, POR, WDT	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	700MHz	FPGA - 85K Logic Elements	-40°C ~ 125°C (TJ)	672-FBGA	672-UBGA (23x23)
M2S060T-1FGG484I	Microsemi Corporation	IC FPGA SOC 60K LUTS Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23)	封裝: 484-BGA	庫存7,360	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 60K Logic Modules	-40°C ~ 100°C (TJ)	484-BGA	484-FPBGA (23x23)
M2S050T-FGG896	Microsemi Corporation	IC FPGA SOC W/TXRX 896-FBGA Architecture: MCU, FPGA Core Processor: ARM? Cortex?-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-FBGA	庫存6,944	ARM? Cortex?-M3	256KB	64KB	DDR, PCIe, SERDES	CAN, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 50K Logic Modules	0°C ~ 85°C (TJ)	896-FBGA	896-FBGA (31x31)
1SX280LN3F43I2VG	Intel	1760-PIN FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存5,792	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2800K Logic Elements	-40°C ~ 100°C (TJ)	-	-
10AS057K2F40E1HG	Intel	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存6,032	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 570K Logic Elements	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA (40x40)
10AS057K2F40E2SG	Intel	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,936	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 570K Logic Elements	0°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
10AS048E2F29I2SG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 480K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存5,568	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 480K Logic Elements	-40°C ~ 100°C (TJ)	-	-
10AS027H1F34E1HG	Intel	IC SOC FPGA 384 I/O 1152FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35x35)	封裝: 1152-BBGA, FCBGA	庫存3,984	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 270K Logic Elements	0°C ~ 100°C (TJ)	1152-BBGA, FCBGA	1152-FBGA (35x35)
10AS032E3F29I2SG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	庫存6,976	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	-40°C ~ 100°C (TJ)	-	-
5CSEBA4U19C6N	Intel	IC FPGA 161 I/O 484FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 925MHz Primary Attributes: FPGA - 40K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA Supplier Device Package: 484-UBGA (19x19)	封裝: 484-FBGA	庫存2,240	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	925MHz	FPGA - 40K Logic Elements	0°C ~ 85°C (TJ)	484-FBGA	484-UBGA (19x19)
5CSEMA5F31I7N	Intel	IC FPGA 288 I/O 896FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 85K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31)	封裝: 896-BGA	庫存7,696	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 85K Logic Elements	-40°C ~ 100°C (TJ)	896-BGA	896-FBGA (31x31)
XCVM1802-2LLIVFVC1760	AMD	IC VERSALPRIME ACAP FPGA 1760BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 450MHz, 1.08GHz Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BFBGA, FCBGA Supplier Device Package: 1760-FCBGA (40x40)	封裝: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	450MHz, 1.08GHz	Versal™ Prime FPGA, 1.9M Logic Cells	-40°C ~ 100°C (TJ)	1760-BFBGA, FCBGA	1760-FCBGA (40x40)
AGIB027R29A2I1VB	Intel	IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2957-BFBGA Exposed Pad Supplier Device Package: 2957-BGA (56x45)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.7M Logic Elements	-40°C ~ 100°C (TJ)	2957-BFBGA Exposed Pad	2957-BGA (56x45)
AGIC040R39A2I2V	Intel	IC Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 4.047M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3948-BFBGA Exposed Pad Supplier Device Package: 3948-BGA (56x56)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 4.047M Logic Elements	-40°C ~ 100°C (TJ)	3948-BFBGA Exposed Pad	3948-BGA (56x56)
M2S010S-1TQG144T2	Microchip Technology	M2S010S-1TQG144T2 Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: -	Request a Quote	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 10K Logic Modules	-40°C ~ 125°C (TJ)	144-LQFP	144-TQFP (20x20)
XCVM1302-2MSENBVB1024	AMD	IC VERSALPRIME ACAP FPGA 1024BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.4GHz Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1024-BFBGA Supplier Device Package: 1024-BGA (31x31)	封裝: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ Prime FPGA, 70k Logic Cells	0°C ~ 100°C (TJ)	1024-BFBGA	1024-BGA (31x31)
XCVM1402-2MLEVSVD1760	AMD	IC VERSALPRIME ACAP FPGA 1760BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: - Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.4GHz Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BFBGA, FCBGA Supplier Device Package: 1760-FCBGA (40x40)	封裝: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	-	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	600MHz, 1.4GHz	Versal™ Prime FPGA, 1.2M Logic Cells	0°C ~ 100°C (TJ)	1760-BFBGA, FCBGA	1760-FCBGA (40x40)
AGID019R31B1I2VB	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.9M Logic Elements	-40°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
AGFA012R24C2I2V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.2M Logic Elements	-40°C ~ 100°C (TJ)	-	-
AGIB027R31B1E2VB	Intel	IC FPGA AGILEX-I 3184BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.7M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 3184-BFBGA Exposed Pad Supplier Device Package: 3184-BGA (56x45)	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.7M Logic Elements	0°C ~ 100°C (TJ)	3184-BFBGA Exposed Pad	3184-BGA (56x45)
WDC6202GJL250X	Texas Instruments	WIRELESS 27MM 6202 WITH XBUS Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-	-	-
BCM47452B0KRFBG	Broadcom Limited	2X2 802.11AC + ARM SOC Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-	-	-
AGFA014R24C2E2V	Intel	IC FPGA AGILEX-F 2340FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.4M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.4M Logic Elements	0°C ~ 100°C (TJ)	-	-
AGFB008R16A2E4X	Intel	IC FPGA AGILEX-F 1546FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 764K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 764K Logic Elements	0°C ~ 100°C (TJ)	-	-
XCVC1802-2HSIVSVD1760	AMD	IC VERSAL AI-CORE FPGA 1760BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz, 1.65GHz Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BFBGA, FCBGA Supplier Device Package: 1760-FCBGA (40x40)	封裝: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz, 1.65GHz	Versal™ AI Core FPGA, 1.5M Logic Cells	-40°C ~ 100°C (TJ)	1760-BFBGA, FCBGA	1760-FCBGA (40x40)

5ASTFD5K3F40I3NES

Altera

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.05GHz
Primary Attributes: FPGA - 462K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,328

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.05GHz

FPGA - 462K Logic Elements

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FBGA (40x40)

10AS057H1F34E1HG

Altera

IC SOC FPGA 492 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存7,728

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 570K Logic Elements

0°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FBGA (35x35)

5ASXBB3D4F40I5N

Altera

IC FPGA 528 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 350K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存2,768

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 350K Logic Elements

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FBGA (40x40)

5CSEBA5U23A7N

Altera

IC FPGA 145 I/O 672UBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 85K Logic Elements
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 672-FBGA
Supplier Device Package: 672-UBGA (23x23)

封裝: 672-FBGA

庫存2,896

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

64KB

DMA, POR, WDT

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

700MHz

FPGA - 85K Logic Elements

-40°C ~ 125°C (TJ)

672-FBGA

672-UBGA (23x23)

M2S060T-1FGG484I

Microsemi Corporation

IC FPGA SOC 60K LUTS

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BGA
Supplier Device Package: 484-FPBGA (23x23)

封裝: 484-BGA

庫存7,360

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 60K Logic Modules

-40°C ~ 100°C (TJ)

484-BGA

484-FPBGA (23x23)

M2S050T-FGG896

Microsemi Corporation

IC FPGA SOC W/TXRX 896-FBGA

Architecture: MCU, FPGA
Core Processor: ARM? Cortex?-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-FBGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-FBGA

庫存6,944

ARM? Cortex?-M3

256KB

64KB

DDR, PCIe, SERDES

CAN, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 50K Logic Modules

0°C ~ 85°C (TJ)

896-FBGA

896-FBGA (31x31)

1SX280LN3F43I2VG

Intel

1760-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,792

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 2800K Logic Elements

-40°C ~ 100°C (TJ)

-

10AS057K2F40E1HG

Intel

IC SOC FPGA 696 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存6,032

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 570K Logic Elements

0°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FBGA (40x40)

10AS057K2F40E2SG

Intel

IC SOC FPGA 696 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,936

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 570K Logic Elements

0°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FCBGA (40x40)

10AS048E2F29I2SG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 480K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,568

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 480K Logic Elements

-40°C ~ 100°C (TJ)

-

10AS027H1F34E1HG

Intel

IC SOC FPGA 384 I/O 1152FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1152-BBGA, FCBGA
Supplier Device Package: 1152-FBGA (35x35)

封裝: 1152-BBGA, FCBGA

庫存3,984

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 270K Logic Elements

0°C ~ 100°C (TJ)

1152-BBGA, FCBGA

1152-FBGA (35x35)

10AS032E3F29I2SG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,976

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 320K Logic Elements

-40°C ~ 100°C (TJ)

-

5CSEBA4U19C6N

Intel

IC FPGA 161 I/O 484FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 925MHz
Primary Attributes: FPGA - 40K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)

封裝: 484-FBGA

庫存2,240

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

925MHz

FPGA - 40K Logic Elements

0°C ~ 85°C (TJ)

484-FBGA

484-UBGA (19x19)

5CSEMA5F31I7N

Intel

IC FPGA 288 I/O 896FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 85K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)

封裝: 896-BGA

庫存7,696

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 85K Logic Elements

-40°C ~ 100°C (TJ)

896-BGA

896-FBGA (31x31)

XCVM1802-2LLIVFVC1760

AMD

IC VERSALPRIME ACAP FPGA 1760BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 450MHz, 1.08GHz
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)

封裝: -

Request a Quote

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

256KB

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

450MHz, 1.08GHz

Versal™ Prime FPGA, 1.9M Logic Cells

-40°C ~ 100°C (TJ)

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AGIB027R29A2I1VB

Intel

IC FPGA AGILEX-I 2957BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2957-BFBGA Exposed Pad
Supplier Device Package: 2957-BGA (56x45)

封裝: -

Request a Quote

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.7M Logic Elements

-40°C ~ 100°C (TJ)

2957-BFBGA Exposed Pad

2957-BGA (56x45)

AGIC040R39A2I2V

Intel

IC

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 4.047M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3948-BFBGA Exposed Pad
Supplier Device Package: 3948-BGA (56x56)

封裝: -

Request a Quote

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 4.047M Logic Elements

-40°C ~ 100°C (TJ)

3948-BFBGA Exposed Pad

3948-BGA (56x56)

M2S010S-1TQG144T2

Microchip Technology

M2S010S-1TQG144T2

Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: -

Request a Quote

ARM® Cortex®-M3

256KB

64KB

DDR, PCIe, SERDES

CANbus, Ethernet, I2C, SPI, UART/USART, USB

166MHz

FPGA - 10K Logic Modules

-40°C ~ 125°C (TJ)

144-LQFP

144-TQFP (20x20)

XCVM1302-2MSENBVB1024

AMD

IC VERSALPRIME ACAP FPGA 1024BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.4GHz
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1024-BFBGA
Supplier Device Package: 1024-BGA (31x31)

封裝: -

Request a Quote

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.4GHz

Versal™ Prime FPGA, 70k Logic Cells

0°C ~ 100°C (TJ)

1024-BFBGA

1024-BGA (31x31)

XCVM1402-2MLEVSVD1760

AMD

IC VERSALPRIME ACAP FPGA 1760BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: -
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.4GHz
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)

封裝: -

Request a Quote

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

600MHz, 1.4GHz

Versal™ Prime FPGA, 1.2M Logic Cells

0°C ~ 100°C (TJ)

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AGID019R31B1I2VB

Intel

IC FPGA AGILEX-I 3184BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

Request a Quote

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 1.9M Logic Elements

-40°C ~ 100°C (TJ)

3184-BFBGA Exposed Pad

3184-BGA (56x45)

AGFA012R24C2I2V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 1.2M Logic Elements

-40°C ~ 100°C (TJ)

-

AGIB027R31B1E2VB

Intel

IC FPGA AGILEX-I 3184BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.7M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 3184-BFBGA Exposed Pad
Supplier Device Package: 3184-BGA (56x45)

封裝: -

Request a Quote

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.7M Logic Elements

0°C ~ 100°C (TJ)

3184-BFBGA Exposed Pad

3184-BGA (56x45)

WDC6202GJL250X

Texas Instruments

WIRELESS 27MM 6202 WITH XBUS

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

-

BCM47452B0KRFBG

Broadcom Limited

2X2 802.11AC + ARM SOC

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

-

AGFA014R24C2E2V

Intel

IC FPGA AGILEX-F 2340FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.4M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 1.4M Logic Elements

0°C ~ 100°C (TJ)

-

AGFB008R16A2E4X

Intel

IC FPGA AGILEX-F 1546FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 764K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 764K Logic Elements

0°C ~ 100°C (TJ)

-

XCVC1802-2HSIVSVD1760

AMD

IC VERSAL AI-CORE FPGA 1760BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz, 1.65GHz
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BFBGA, FCBGA
Supplier Device Package: 1760-FCBGA (40x40)

封裝: -

Request a Quote

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

256KB

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz, 1.65GHz

Versal™ AI Core FPGA, 1.5M Logic Cells

-40°C ~ 100°C (TJ)

1760-BFBGA, FCBGA

1760-FCBGA (40x40)