頁 55 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0745-01-35-1C	Trenz Electronic GmbH	SOM SOC Z7 XC7Z035-1FBG676C 1GB Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,896	ARM? Cortex?-A9	Zynq-7000 (Z-7035)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	0°C ~ 70°C
MK67Q5250V-0001YC	Rohm Semiconductor	IC BIOMETRIX MODULE SNAP IN Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,760	-	-	-	-	-	-	-	-
SOMOMAP3503-10-1672IFCR	Logic	SYSTEM ON MODULE LV OMAP3503 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3503 Co-Processor: - Speed: 600MHz Flash Size: 256MB (NAND), 8MB (NOR) RAM Size: 128MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存5,920	ARM? Cortex?-A8, OMAP3503	-	600MHz	256MB (NAND), 8MB (NOR)	128MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
CENGLH7A400-10-504HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,928	ARM922T, LH7A400	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
FS-3005	Digi International	MODULE 128MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存2,544	-	-	-	-	-	-	-	-
FS-3000	Digi International	MODULE 128MB SDRAM 128MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存6,608	-	-	-	-	-	-	-	-
CENGLH7A400-10-403EI	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,344	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
TE0715-04-30-1C	Trenz Electronic GmbH	SOM SOC 7Z030-1SBG485C 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,080	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
3352-HX-X27-RC	Critical Link LLC	MITYSOM-3352 W/ AM3352 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3352 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 256MB RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,328	ARM? Cortex?-A8, AM3352	NEON SIMD	800MHz	256MB	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
TE0714-02-50-2I	Trenz Electronic GmbH	SOM ARTIX-7 XC7A50T-2I 1GB DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A50T Co-Processor: - Speed: - Flash Size: 16MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.57" x 1.18" (40mm x 30mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,680	Artix-7 A50T	-	-	16MB	-	Samtec LSHM	1.57" x 1.18" (40mm x 30mm)	-40°C ~ 85°C
CC-MX-PF47-ZK	Digi International	MOD I.MX287 128MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 128MB RAM Size: 128MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存3,856	ARM926EJ-S i.mx287	-	454MHz	128MB	128MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
BS2PE	Parallax Inc.	MODULE BASIC STAMP 2PE Module/Board Type: MCU Core Core Processor: SX48AC Co-Processor: - Speed: 8MHz Flash Size: 32KB EEPROM RAM Size: 38B Connector Type: - Size / Dimension: 1.2" x 0.6" (30mm x 15mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,032	SX48AC	-	8MHz	32KB EEPROM	38B	-	1.2" x 0.6" (30mm x 15mm)	0°C ~ 70°C
CENGPXA270-520-11-504HCR	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 520MHz Flash Size: 32MB RAM Size: 64MB Connector Type: Edge Connector Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,336	PXA270	-	520MHz	32MB	64MB	Edge Connector	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
20-101-1139	Digi International	RCM4310 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 1MB (Internal), microSD Slot (External) RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5, 1xmicroSD Card Size / Dimension: 1.84" x 2.85" (47mm x 72mm) Operating Temperature: -20°C ~ 85°C	封裝: -	庫存4,912	Rabbit 4000	-	58.98MHz	1MB (Internal), microSD Slot (External)	1MB	IDC Header 2x25, 2x5, 1xmicroSD Card	1.84" x 2.85" (47mm x 72mm)	-20°C ~ 85°C
CC-MX-PF58-ZK	Digi International	MOD I.MX287 256MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 256MB RAM Size: 256MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,608	ARM926EJ-S i.mx287	-	454MHz	256MB	256MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
DC-ME9-01-C-10	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存6,752	-	-	-	-	-	-	-	-
TE0745-02-45-1CA	Trenz Electronic GmbH	SOM ZYNQ 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存2,320	ARM® Cortex®-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	0°C ~ 70°C
TE0803-02-02CG-1EA	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	封裝: -	庫存4,592	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0821-01-3AE31PA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU3CG-1SFVC784E	ARM® Cortex®-A53, ARM® Cortex®-R5	-	128MB	4GB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
ME-XU1-6EG-1I-D11E-R4-2	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU6EG Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
ME-XU9-7EG-2I-D11E-L13-R2-1	Enclustra FPGA Solutions	SOM XU9 ZYNQ 7EG REV2.1 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
TE0820-04-40121FA	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	Request a Quote	-	-	-	-	-	-	-	-
EC-VA-H264-10B-60-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
ME-XU1-15EG-2I-D12E-G1-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU15EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TEM0005-02-010I	Trenz Electronic GmbH	FPGA MODULE WITH MICROCHIP SMART Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: 32MB QSPI RAM Size: 256MB Connector Type: B2B Size / Dimension: 2.205" L x 1.220" W (56.00mm x 31.00mm) Operating Temperature: -	封裝: -	Request a Quote	-	-	-	32MB QSPI	256MB	B2B	2.205" L x 1.220" W (56.00mm x 31.00mm)	-
EDM1-IMX6U10-R10-MSD-9377	Wandboard.Org	IC MODULE CORTEX-A9 1GB Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A9, i.MX6DualLite Co-Processor: - Speed: - Flash Size: - RAM Size: 1GB Connector Type: EDM Connector Size / Dimension: 2.360" L x 3.230" W (60.00mm x 82.00mm) Operating Temperature: -	封裝: -	Request a Quote	ARM® Cortex®-A9, i.MX6DualLite	-	-	-	1GB	EDM Connector	2.360" L x 3.230" W (60.00mm x 82.00mm)	-
TE0741-05-A2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K070T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K070T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0807-03-7DI21-A	Trenz Electronic GmbH	MPSOC ZYNQ USCALE 4GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU7EV-1FBVB900I	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C

TE0745-01-35-1C

Trenz Electronic GmbH

SOM SOC Z7 XC7Z035-1FBG676C 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,896

ARM? Cortex?-A9

Zynq-7000 (Z-7035)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

0°C ~ 70°C

MK67Q5250V-0001YC

Rohm Semiconductor

IC BIOMETRIX MODULE SNAP IN

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,760

-

SOMOMAP3503-10-1672IFCR

Logic

SYSTEM ON MODULE LV OMAP3503

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3503
Co-Processor: -
Speed: 600MHz
Flash Size: 256MB (NAND), 8MB (NOR)
RAM Size: 128MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存5,920

ARM? Cortex?-A8, OMAP3503

-

600MHz

256MB (NAND), 8MB (NOR)

128MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

CENGLH7A400-10-504HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,928

ARM922T, LH7A400

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

FS-3005

Digi International

MODULE 128MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存2,544

-

FS-3000

Digi International

MODULE 128MB SDRAM 128MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存6,608

-

CENGLH7A400-10-403EI

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,344

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

TE0715-04-30-1C

Trenz Electronic GmbH

SOM SOC 7Z030-1SBG485C 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,080

ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

3352-HX-X27-RC

Critical Link LLC

MITYSOM-3352 W/ AM3352

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3352
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,328

ARM? Cortex?-A8, AM3352

NEON SIMD

800MHz

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

TE0714-02-50-2I

Trenz Electronic GmbH

SOM ARTIX-7 XC7A50T-2I 1GB DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A50T
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.57" x 1.18" (40mm x 30mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,680

Artix-7 A50T

-

16MB

-

Samtec LSHM

1.57" x 1.18" (40mm x 30mm)

-40°C ~ 85°C

CC-MX-PF47-ZK

Digi International

MOD I.MX287 128MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 128MB
RAM Size: 128MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存3,856

ARM926EJ-S i.mx287

-

454MHz

128MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

BS2PE

Parallax Inc.

MODULE BASIC STAMP 2PE

Module/Board Type: MCU Core
Core Processor: SX48AC
Co-Processor: -
Speed: 8MHz
Flash Size: 32KB EEPROM
RAM Size: 38B
Connector Type: -
Size / Dimension: 1.2" x 0.6" (30mm x 15mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,032

SX48AC

-

8MHz

32KB EEPROM

38B

-

1.2" x 0.6" (30mm x 15mm)

0°C ~ 70°C

CENGPXA270-520-11-504HCR

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 520MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: Edge Connector
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,336

PXA270

-

520MHz

32MB

64MB

Edge Connector

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

20-101-1139

Digi International

RCM4310 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 1MB (Internal), microSD Slot (External)
RAM Size: 1MB
Connector Type: IDC Header 2x25, 2x5, 1xmicroSD Card
Size / Dimension: 1.84" x 2.85" (47mm x 72mm)
Operating Temperature: -20°C ~ 85°C

封裝: -

庫存4,912

Rabbit 4000

-

58.98MHz

1MB (Internal), microSD Slot (External)

1MB

IDC Header 2x25, 2x5, 1xmicroSD Card

1.84" x 2.85" (47mm x 72mm)

-20°C ~ 85°C

CC-MX-PF58-ZK

Digi International

MOD I.MX287 256MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,608

ARM926EJ-S i.mx287

-

454MHz

256MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

DC-ME9-01-C-10

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存6,752

-

TE0745-02-45-1CA

Trenz Electronic GmbH

SOM ZYNQ 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存2,320

ARM® Cortex®-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

0°C ~ 70°C

TE0803-02-02CG-1EA

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

庫存4,592

Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0821-01-3AE31PA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU3CG-1SFVC784E

ARM® Cortex®-A53, ARM® Cortex®-R5

-

128MB

4GB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

ME-XU1-6EG-1I-D11E-R4-2

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU6EG

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

ME-XU9-7EG-2I-D11E-L13-R2-1

Enclustra FPGA Solutions

SOM XU9 ZYNQ 7EG REV2.1

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

TE0820-04-40121FA

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

Request a Quote

-

EC-VA-H264-10B-60-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

ME-XU1-15EG-2I-D12E-G1-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU15EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TEM0005-02-010I

Trenz Electronic GmbH

FPGA MODULE WITH MICROCHIP SMART

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 32MB QSPI
RAM Size: 256MB
Connector Type: B2B
Size / Dimension: 2.205" L x 1.220" W (56.00mm x 31.00mm)
Operating Temperature: -

封裝: -

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-

32MB QSPI

256MB

B2B

2.205" L x 1.220" W (56.00mm x 31.00mm)

-

EDM1-IMX6U10-R10-MSD-9377

Wandboard.Org

IC MODULE CORTEX-A9 1GB

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A9, i.MX6DualLite
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: 1GB
Connector Type: EDM Connector
Size / Dimension: 2.360" L x 3.230" W (60.00mm x 82.00mm)
Operating Temperature: -

封裝: -

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ARM® Cortex®-A9, i.MX6DualLite

-

1GB

EDM Connector

2.360" L x 3.230" W (60.00mm x 82.00mm)

-

TE0741-05-A2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K070T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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Xilinx Kintex-7 FPGA XC7K070T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0807-03-7DI21-A

Trenz Electronic GmbH

MPSOC ZYNQ USCALE 4GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU7EV-1FBVB900I

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C