頁 25 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC) | 黑森爾電子
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嵌入式 - 微控制器、微處理器、FPGA 模組

記錄 1,650
頁  25/59
圖片
零件編號
製造商
描述
封裝
庫存
數量
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
TE0600-02IMVF
Trenz Electronic GmbH

SOM GIGABEE XC6SLX150 2X128MB 3I

  • Module/Board Type: FPGA
  • Core Processor: Spartan-6 LX-150
  • Co-Processor: -
  • Speed: 125MHz
  • Flash Size: 16MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存3,872
Spartan-6 LX-150
-
125MHz
16MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
-40°C ~ 85°C
3354-GX-XX7-RC
Critical Link LLC

MITYSOM-335X SOM

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3354
  • Co-Processor: NEON SIMD
  • Speed: 720MHz
  • Flash Size: -
  • RAM Size: 256MB
  • Connector Type: SO-DIMM-204
  • Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存7,008
ARM? Cortex?-A8, AM3354
NEON SIMD
720MHz
-
256MB
SO-DIMM-204
2.66" x 1.5" (67.6mm x 38.1mm)
0°C ~ 70°C
CC-9P-V502-MF
Digi International

MODULE 9P 8MB SDRAM 4MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9215
  • Co-Processor: -
  • Speed: 150MHz
  • Flash Size: 4MB
  • RAM Size: 8MB
  • Connector Type: Board-to-Board (BTB) Socket - 160
  • Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存5,376
ARM926EJ-S, NS9215
-
150MHz
4MB
8MB
Board-to-Board (BTB) Socket - 160
1.97" x 1.97" (50mm x 50mm)
-40°C ~ 85°C
CC-9C-V226-Z6
Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9360
  • Co-Processor: -
  • Speed: 155MHz
  • Flash Size: 64MB
  • RAM Size: 32MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存6,688
ARM926EJ-S, NS9360
-
155MHz
64MB
32MB
SO-DIMM-144
3.59" x 2.06" (91.2mm x 52.2mm)
-40°C ~ 85°C
SOMXOMAPL138-10-1502QHCR
Logic

SYSTEM ON MODULE LP OMAPL138

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM926EJ-S, OMAP-L138
  • Co-Processor: TMS320C6748
  • Speed: 375MHz
  • Flash Size: 8MB
  • RAM Size: 64MB
  • Connector Type: Board-to-Board (BTB) Socket - 300
  • Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存7,360
ARM926EJ-S, OMAP-L138
TMS320C6748
375MHz
8MB
64MB
Board-to-Board (BTB) Socket - 300
1.18" x 1.57" (30mm x 40mm)
0°C ~ 70°C
CC-9C-V212-RJ
Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9360
  • Co-Processor: -
  • Speed: 155MHz
  • Flash Size: 4MB
  • RAM Size: 16MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
庫存2,112
ARM926EJ-S, NS9360
-
155MHz
4MB
16MB
SO-DIMM-144
3.59" x 2.06" (91.2mm x 52.2mm)
-40°C ~ 85°C
FS-352
Digi International

MODULE 7U 16MB SDRAM 8MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 8MB
  • RAM Size: 16MB
  • Connector Type: 48-DIP
  • Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存4,800
ARM7TDMI, NS7520
-
55MHz
8MB
16MB
48-DIP
2.48" x 0.73" (62.9mm x 18.5mm)
0°C ~ 70°C
CENG-LH79520-10-403HC
Logic

CARD ENGINE 32MB SDRAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM720T, LH79520
  • Co-Processor: -
  • Speed: 77.4MHz
  • Flash Size: 16MB
  • RAM Size: 32MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存7,520
ARM720T, LH79520
-
77.4MHz
16MB
32MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
CC-9U-T724-Z1-B
Digi International

MODULE 9U 32MB SDRAM 16MB FLASH

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
庫存6,704
-
-
-
-
-
-
-
-
TE0300-01IBMLP
Trenz Electronic GmbH

SOM SPARTAN-3E 1600K 666MB DDR

  • Module/Board Type: FPGA, USB Core
  • Core Processor: Spartan-3E
  • Co-Processor: Cypress FX2 USB 2.0
  • Speed: 100MHz
  • Flash Size: 4MB
  • RAM Size: 64MB
  • Connector Type: B2B
  • Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存5,248
Spartan-3E
Cypress FX2 USB 2.0
100MHz
4MB
64MB
B2B
1.6" x 1.9" (40.5mm x 47.5mm)
0°C ~ 70°C
TE0726-03-07S-1C
Trenz Electronic GmbH

SBC ZYNQBERRY Z-7007S HDMI USB E

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7007S)
  • Speed: 766MHz
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: CSI, DSI
  • Size / Dimension: 1.57" x 1.18" (40mm x 30mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存7,360
ARM Cortex-A9
Zynq-7000 (Z-7007S)
766MHz
16MB
512MB
CSI, DSI
1.57" x 1.18" (40mm x 30mm)
0°C ~ 70°C
SOMAM3703-10-2780HFCR
Logic

SYSTEM ON MODULE LV AM3703

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A8, AM3703
  • Co-Processor: -
  • Speed: 1GHz
  • Flash Size: 512MB
  • RAM Size: 256MB
  • Connector Type: Board-to-Board (BTB) Socket - 480
  • Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存3,728
ARM? Cortex?-A8, AM3703
-
1GHz
512MB
256MB
Board-to-Board (BTB) Socket - 480
1.23" x 3.01" (31.2mm x 76.5mm)
0°C ~ 70°C
EZ80F916005MODG
Zilog

MODULE EZ80F91 512K 50MHZ

  • Module/Board Type: MCU, Ethernet Core
  • Core Processor: eZ80F91
  • Co-Processor: -
  • Speed: 50MHz
  • Flash Size: 256KB
  • RAM Size: 16KB (Internal), 128KB (External)
  • Connector Type: Mini-Headers 2x56
  • Size / Dimension: 2" x 1.9" (50.8mm x 48.3mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
庫存7,568
eZ80F91
-
50MHz
256KB
16KB (Internal), 128KB (External)
Mini-Headers 2x56
2" x 1.9" (50.8mm x 48.3mm)
0°C ~ 70°C
TE0808-04-06EG-1EE
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
庫存6,480
Zynq UltraScale+ XCZU6EG-1FFVC900E
-
-
128MB
4GB
B2B
2.05" x 2.99" (52mm x 76mm)
0°C ~ 85°C
DC-VA-MPEG2-8B-60-1080-MD00C-A200T
System-On-Chip (SOC) Technologies Inc.

MOD MPEG2 DEC 60FPS 1080 SODIMM

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 XC7A200T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 512MB
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
Request a Quote
Artix-7 XC7A200T
-
200MHz
32MB
512MB
-
-
-
TE0813-01-4DE11-A
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote
Zynq UltraScale+ XCZU4EV-1SFVC784E
-
-
128MB
2GB
Board-to-Board (BTB) Socket - 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0741-05-B2C-1-AF
Trenz Electronic GmbH

MODULE FPGA KINTEX

  • Module/Board Type: FPGA
  • Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
  • Co-Processor: -
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: -
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
封裝: -
Request a Quote
Xilinx Kintex-7 FPGA XC7K160T-2FFG676C
-
-
32MB
-
Board-to-Board (BTB) Socket
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 70°C
TE0782-02-82I33MA
Trenz Electronic GmbH

IC MODULE CORTEX

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7035)
  • Speed: -
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) Socket
  • Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7035)
-
32MB
1GB
Board-to-Board (BTB) Socket
3.350" L x 3.350" W (85.00mm x 85.00mm)
-40°C ~ 85°C
TE0818-01-BBE21-A
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU15EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote
Zynq UltraScale+ XCZU15EG-1FFVC900E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
CC-MX-ZC6D-Z1
Digi

CC 93 SOM SINGLE-CORE ETHERNET

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
  • Co-Processor: -
  • Speed: 250MHz, 1.7GHz
  • Flash Size: 8GB
  • RAM Size: 512MB
  • Connector Type: -
  • Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
ARM® Cortex®-A55, ARM® Cortex®-M33
-
250MHz, 1.7GHz
8GB
512MB
-
1.770" L x 1.570" W (45.00mm x 40.00mm)
-40°C ~ 85°C
FORLINX-FETA40I-C-121GSE8GEA12
Forlinx Embedded

Allwinner A40iSOM,1GB DDR3,8GB e

  • Module/Board Type: MPU
  • Core Processor: ARM® Cortex®-A7
  • Co-Processor: -
  • Speed: 1.2GHz
  • Flash Size: 8GB eMMC
  • RAM Size: 1GB
  • Connector Type: Board-to-Board (BTB) 4 x 80 Pin
  • Size / Dimension: 2.700" L x 1.772" W (68.00mm x 45.00mm)
  • Operating Temperature: -25°C ~ 85°C
封裝: -
Request a Quote
ARM® Cortex®-A7
-
1.2GHz
8GB eMMC
1GB
Board-to-Board (BTB) 4 x 80 Pin
2.700" L x 1.772" W (68.00mm x 45.00mm)
-25°C ~ 85°C
TE0820-05-2BE21ML
Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Pin(s)
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
-
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
TE0808-04-9GI21-AS
Trenz Electronic GmbH

STARTER KIT ZYNQ USCALE+ ZU9 FPG

  • Module/Board Type: FPGA Core
  • Core Processor: Zynq UltraScale+ ZU9
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
Zynq UltraScale+ ZU9
-
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
-40°C ~ 85°C
CC-WMX-FR6D-NN
Digi

CONNECTCORE 8M NANO, SOLOLITE, 8

  • Module/Board Type: MCU Core
  • Core Processor: ARM® Cortex®-A53
  • Co-Processor: ARM® Cortex®-M7
  • Speed: 600MHz, 1.4GHz
  • Flash Size: -
  • RAM Size: 512MB
  • Connector Type: USB
  • Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
ARM® Cortex®-A53
ARM® Cortex®-M7
600MHz, 1.4GHz
-
512MB
USB
1.770" L x 1.570" W (45.00mm x 40.00mm)
-40°C ~ 85°C
TE0813-01-3BE11-A
Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Board-to-Board (BTB) Socket - 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote
Zynq UltraScale+ XCZU3EG-1SFVC784E
-
-
128MB
2GB
Board-to-Board (BTB) Socket - 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0712-02-100-2CA
Trenz Electronic GmbH

IC MOD ARTIX7 A100T 200MHZ 1GB

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
封裝: -
Request a Quote
Artix-7 A100T
-
200MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
S00005
Trenz Electronic GmbH

MOD SOM DDR3L 1GB

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
封裝: -
Request a Quote
-
-
-
-
-
-
-
-
TE0745-03-92I31-A
Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-2I, 1 GBY

  • Module/Board Type: MPU Core
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: -40°C ~ 85°C
封裝: -
Request a Quote
ARM Cortex-A9
Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
-
64MB
1GB
Samtec ST5
2.990" L x 2.050" W (76.00mm x 52.00mm)
-40°C ~ 85°C