頁 15 - 嵌入式 - 微控制器、微處理器、FPGA 模組 | 積體電路 (IC)

零件編號	製造商	描述	封裝	庫存	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
TE0741-02-325-2IF	Trenz Electronic GmbH	SOM KINTEX-7 325T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 325T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存5,616	Kintex-7 325T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
TE0741-02-160-2IF	Trenz Electronic GmbH	SOM KINTEX-7 160T 32MB FLASH AES Module/Board Type: FPGA Core Processor: Kintex-7 160T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存6,112	Kintex-7 160T	-	200MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
FS-3013	Digi International	MODULE 9P 32MB SDRAM 32MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存7,824	-	-	-	-	-	-	-	-
CC-9P-V526UJ-S-B	Digi International	MOD 9P 9215 CONNCORE 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 8MB RAM Size: 32MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,680	ARM926EJ-S, NS9215	-	150MHz	8MB	32MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
SOMAM1808-10-1502AHCR	Logic	SYSTEM ON MODULE AM1808 Module/Board Type: MPU Core Core Processor: ARM926EJ-S, AM1808 Co-Processor: - Speed: 450MHz Flash Size: 8MB RAM Size: 64MB Connector Type: - Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,256	ARM926EJ-S, AM1808	-	450MHz	8MB	64MB	-	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
CENGLH7A400-10-503HC	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3,248	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
EZ80F915050MODG	Zilog	MODULE EZ80F91 512K 50MHZ Module/Board Type: MCU, Ethernet Core Core Processor: eZ80F91 Co-Processor: - Speed: 50MHz Flash Size: 256KB (Internal), 1MB (External) RAM Size: 8KB (Internal), 512KB (External) Connector Type: Header 2x30 Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存4,400	eZ80F91	-	50MHz	256KB (Internal), 1MB (External)	8KB (Internal), 512KB (External)	Header 2x30	2.5" x 3.1" (63.5mm x 78.7mm)	0°C ~ 70°C
FS-336	Digi International	MODULE MOD520C 16MB FLASH Module/Board Type: MCU Core Core Processor: ElanSC520 Co-Processor: - Speed: 133MHz Flash Size: 16MB RAM Size: 64MB Connector Type: - Size / Dimension: - Operating Temperature: 0°C ~ 70°C	封裝: -	庫存3,536	ElanSC520	-	133MHz	16MB	64MB	-	-	0°C ~ 70°C
CENGLH7A404-11-550HC	Logic	CARD ENGINE 64MB FLASH 64MB RAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,032	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0949	Digi International	MODULE RABBITCORE RCM3360 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 16MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存2,288	Rabbit 3000	-	44.2MHz	512KB (Internal), 16MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
CC-MX-MB69-ZK-B	Digi International	MODULE I.MX51 512MB FLASH 25PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,520	-	-	-	-	-	-	-	-
CC-MX-MB69-ZK	Digi International	MODULE I.MX51 600MHZ 512MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	封裝: -	庫存5,632	-	-	-	-	-	-	-	-
TE0711-01-35-2C	Trenz Electronic GmbH	SOM ARTIX-7 HIGH IO 35T USB 2C Module/Board Type: FPGA Core Processor: Artix-7 A35T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存6,560	Artix-7 A35T	-	100MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
CC-9P-V513-C	Digi International	MODULE 9P 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 8MB RAM Size: 16MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存7,536	ARM926EJ-S, NS9215	-	150MHz	8MB	16MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
20-101-0446	Digi International	MODULE RABBITCORE RCM2130 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 2" x 3.5" (51mm x 89mm) Operating Temperature: -40°C ~ 85°C	封裝: -	庫存4,624	Rabbit 2000	-	22.1MHz	256KB	128KB	2 IDC Headers 2x20	2" x 3.5" (51mm x 89mm)	-40°C ~ 85°C
20-101-0520	Digi International	MODULE RABBITCORE RCM3200 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 768KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 70°C	封裝: -	庫存3,712	Rabbit 3000	-	44.2MHz	512KB	768KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 70°C
TE0713-02-100-2C	Trenz Electronic GmbH	IC MOD ARTIX7 XC7A100T-2F 200MHZ Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A100T-2FGG484C Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 70°C	封裝: -	庫存7,184	Artix-7 XC7A100T-2FGG484C	-	200MHz	32MB	1GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 70°C
TE0716-01-61C32-A	Trenz Electronic GmbH	TE0716 - SOM WITH XILINX ZYNQ-70 Module/Board Type: FPGA Core Processor: Zynq™ 7000 SoC XC7Z020 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket, USB Size / Dimension: 2.559" L x 1.772" W (65.00mm x 45.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	Zynq™ 7000 SoC XC7Z020	-	-	32MB	1GB	Board-to-Board (BTB) Socket, USB	2.559" L x 1.772" W (65.00mm x 45.00mm)	0°C ~ 70°C
TE0813-01-5DI21-A	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU5EV-1SFVC784I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
ME-XU9-7EV-2E-D13E-R2-1	Enclustra FPGA Solutions	SOM XU9 ZYNQ 7EV REV2.1 Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
SOMIMX8MMQ-10-1BE4SMIR	Beacon EmbeddedWorks	IC MOD I.MX 8M MINI QUAD 4GB Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex™-M4 Co-Processor: - Speed: 1.8GHz, 400MHz Flash Size: 32GB RAM Size: 4GB Connector Type: 3 x 100 Pins HD Connectors Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex™-M4	-	1.8GHz, 400MHz	32GB	4GB	3 x 100 Pins HD Connectors	1.100" L x 1.500" W (28.00mm x 38.00mm)	-40°C ~ 85°C
TE0720-03-31C33FA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7014S) Speed: 125MHz Flash Size: 4GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7014S)	125MHz	4GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
XP100200S-05R-J	Lantronix, Inc.	XPORT, EXTENDED TEMPERATURE, ENC Module/Board Type: - Core Processor: DSTni-EX Co-Processor: XPort AR Speed: 25MHz Flash Size: 512KB RAM Size: 256KB Connector Type: RJ-45 Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ-45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
MYS-7Z020-V2-0E1D-766-C-S	MYIR Tech Limited	Zynq-7020 SBC, Z-turn Board V2 Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: - Speed: 667MHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 4.016" x 2.480" (102.00mm x 63.00mm) Operating Temperature: -	封裝: -	Request a Quote	ARM® Cortex®-A9	-	667MHz	-	-	-	4.016" x 2.480" (102.00mm x 63.00mm)	-
EC-V-H264-8B-30-1080-MXC-ZL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0745-03-93E31-AK	Trenz Electronic GmbH	SOM WITH AMD ZYNQ 7045-3E AND HE Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-3FFG676E Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	封裝: -	Request a Quote	ARM Cortex-A9	Xilinx Zynq 7045 SoC XC7Z045-3FFG676E	-	64MB	1GB	Samtec ST5	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
MCV-X6DB	ARIES Embedded	SoM CycloneV SoC-FPGA Module/Board Type: FPGA Core Processor: ARM Cortex-A9 (Dual Core) Co-Processor: - Speed: 800MHz Flash Size: 4GB RAM Size: 1GB Connector Type: 360 Pin Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm) Operating Temperature: 0°C ~ 70°C	封裝: -	Request a Quote	ARM Cortex-A9 (Dual Core)	-	800MHz	4GB	1GB	360 Pin	2.910" L x 1.650" W (74.00mm x 42.00mm)	0°C ~ 70°C
TE0803-04-3BE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	封裝: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C

TE0741-02-325-2IF

Trenz Electronic GmbH

SOM KINTEX-7 325T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 325T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存5,616

Kintex-7 325T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

TE0741-02-160-2IF

Trenz Electronic GmbH

SOM KINTEX-7 160T 32MB FLASH AES

Module/Board Type: FPGA
Core Processor: Kintex-7 160T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存6,112

Kintex-7 160T

-

200MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

FS-3013

Digi International

MODULE 9P 32MB SDRAM 32MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存7,824

-

CC-9P-V526UJ-S-B

Digi International

MOD 9P 9215 CONNCORE 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 8MB
RAM Size: 32MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,680

ARM926EJ-S, NS9215

-

150MHz

8MB

32MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

SOMAM1808-10-1502AHCR

Logic

SYSTEM ON MODULE AM1808

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, AM1808
Co-Processor: -
Speed: 450MHz
Flash Size: 8MB
RAM Size: 64MB
Connector Type: -
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,256

ARM926EJ-S, AM1808

-

450MHz

8MB

64MB

-

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

CENGLH7A400-10-503HC

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3,248

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

EZ80F915050MODG

Zilog

MODULE EZ80F91 512K 50MHZ

Module/Board Type: MCU, Ethernet Core
Core Processor: eZ80F91
Co-Processor: -
Speed: 50MHz
Flash Size: 256KB (Internal), 1MB (External)
RAM Size: 8KB (Internal), 512KB (External)
Connector Type: Header 2x30
Size / Dimension: 2.5" x 3.1" (63.5mm x 78.7mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存4,400

eZ80F91

-

50MHz

256KB (Internal), 1MB (External)

8KB (Internal), 512KB (External)

Header 2x30

2.5" x 3.1" (63.5mm x 78.7mm)

0°C ~ 70°C

FS-336

Digi International

MODULE MOD520C 16MB FLASH

Module/Board Type: MCU Core
Core Processor: ElanSC520
Co-Processor: -
Speed: 133MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: -
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存3,536

ElanSC520

-

133MHz

16MB

64MB

-

0°C ~ 70°C

CENGLH7A404-11-550HC

Logic

CARD ENGINE 64MB FLASH 64MB RAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,032

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0949

Digi International

MODULE RABBITCORE RCM3360

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 16MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存2,288

Rabbit 3000

-

44.2MHz

512KB (Internal), 16MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

CC-MX-MB69-ZK-B

Digi International

MODULE I.MX51 512MB FLASH 25PK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,520

-

CC-MX-MB69-ZK

Digi International

MODULE I.MX51 600MHZ 512MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

封裝: -

庫存5,632

-

TE0711-01-35-2C

Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 35T USB 2C

Module/Board Type: FPGA
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存6,560

Artix-7 A35T

-

100MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

CC-9P-V513-C

Digi International

MODULE 9P 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 8MB
RAM Size: 16MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存7,536

ARM926EJ-S, NS9215

-

150MHz

8MB

16MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

20-101-0446

Digi International

MODULE RABBITCORE RCM2130

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 2" x 3.5" (51mm x 89mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

庫存4,624

Rabbit 2000

-

22.1MHz

256KB

128KB

2 IDC Headers 2x20

2" x 3.5" (51mm x 89mm)

-40°C ~ 85°C

20-101-0520

Digi International

MODULE RABBITCORE RCM3200

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB
RAM Size: 768KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 70°C

封裝: -

庫存3,712

Rabbit 3000

-

44.2MHz

512KB

768KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 70°C

TE0713-02-100-2C

Trenz Electronic GmbH

IC MOD ARTIX7 XC7A100T-2F 200MHZ

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A100T-2FGG484C
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

庫存7,184

Artix-7 XC7A100T-2FGG484C

-

200MHz

32MB

1GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 70°C

TE0716-01-61C32-A

Trenz Electronic GmbH

TE0716 - SOM WITH XILINX ZYNQ-70

Module/Board Type: FPGA
Core Processor: Zynq™ 7000 SoC XC7Z020
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket, USB
Size / Dimension: 2.559" L x 1.772" W (65.00mm x 45.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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Zynq™ 7000 SoC XC7Z020

-

32MB

1GB

Board-to-Board (BTB) Socket, USB

2.559" L x 1.772" W (65.00mm x 45.00mm)

0°C ~ 70°C

TE0813-01-5DI21-A

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU5EV-1SFVC784I

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

ME-XU9-7EV-2E-D13E-R2-1

Enclustra FPGA Solutions

SOM XU9 ZYNQ 7EV REV2.1

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

SOMIMX8MMQ-10-1BE4SMIR

Beacon EmbeddedWorks

IC MOD I.MX 8M MINI QUAD 4GB

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex™-M4
Co-Processor: -
Speed: 1.8GHz, 400MHz
Flash Size: 32GB
RAM Size: 4GB
Connector Type: 3 x 100 Pins HD Connectors
Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM® Cortex®-A53, ARM® Cortex™-M4

-

1.8GHz, 400MHz

32GB

4GB

3 x 100 Pins HD Connectors

1.100" L x 1.500" W (28.00mm x 38.00mm)

-40°C ~ 85°C

TE0720-03-31C33FA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7014S)
Speed: 125MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM Cortex-A9

Zynq-7000 (Z-7014S)

125MHz

4GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

XP100200S-05R-J

Lantronix, Inc.

XPORT, EXTENDED TEMPERATURE, ENC

Module/Board Type: -
Core Processor: DSTni-EX
Co-Processor: XPort AR
Speed: 25MHz
Flash Size: 512KB
RAM Size: 256KB
Connector Type: RJ-45
Size / Dimension: 1.330" L x 0.640" W (33.90mm x 16.25mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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DSTni-EX

XPort AR

25MHz

512KB

256KB

RJ-45

1.330" L x 0.640" W (33.90mm x 16.25mm)

-40°C ~ 85°C

MYS-7Z020-V2-0E1D-766-C-S

MYIR Tech Limited

Zynq-7020 SBC, Z-turn Board V2

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: -
Speed: 667MHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 4.016" x 2.480" (102.00mm x 63.00mm)
Operating Temperature: -

封裝: -

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ARM® Cortex®-A9

-

667MHz

-

4.016" x 2.480" (102.00mm x 63.00mm)

-

EC-V-H264-8B-30-1080-MXC-ZL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0745-03-93E31-AK

Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-3E AND HE

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-3FFG676E
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

封裝: -

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ARM Cortex-A9

Xilinx Zynq 7045 SoC XC7Z045-3FFG676E

-

64MB

1GB

Samtec ST5

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

MCV-X6DB

ARIES Embedded

SoM CycloneV SoC-FPGA

Module/Board Type: FPGA
Core Processor: ARM Cortex-A9 (Dual Core)
Co-Processor: -
Speed: 800MHz
Flash Size: 4GB
RAM Size: 1GB
Connector Type: 360 Pin
Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm)
Operating Temperature: 0°C ~ 70°C

封裝: -

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ARM Cortex-A9 (Dual Core)

-

800MHz

4GB

1GB

360 Pin

2.910" L x 1.650" W (74.00mm x 42.00mm)

0°C ~ 70°C

TE0803-04-3BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

封裝: -

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Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C