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嵌入式 - 現場可編程閘陣列 (FPGA)

記錄 33,582
頁  292/1,200
圖片
零件編號
製造商
描述
封裝
庫存
數量
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot EP20K200RC240-2X
Altera

IC FPGA 174 I/O 240RQFP

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 174
  • Number of Gates: 526000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-RQFP (32x32)
封裝: 240-BQFP
庫存7,788
8320
106496
174
526000
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
240-BQFP
240-RQFP (32x32)
EPF6024AQC240-2N
Altera

IC FPGA 199 I/O 240QFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 1960
  • Total RAM Bits: -
  • Number of I/O: 199
  • Number of Gates: 24000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BQFP
庫存7,360
1960
-
199
24000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
240-BQFP
240-PQFP (32x32)
A54SX08A-PQ208I
Microsemi Corporation

IC FPGA 130 I/O 208QFP

  • Number of LABs/CLBs: 768
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: 130
  • Number of Gates: 12000
  • Voltage - Supply: 2.25 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
封裝: 208-BFQFP
庫存2,928
-
-
130
12000
2.25 V ~ 5.25 V
Surface Mount
-40°C ~ 85°C (TA)
208-BFQFP
208-PQFP (28x28)
A1010B-1PLG44C
Microsemi Corporation

IC FPGA 34 I/O 44PLCC

  • Number of LABs/CLBs: 295
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: 34
  • Number of Gates: 1200
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封裝: 44-LCC (J-Lead)
庫存2,496
-
-
34
1200
4.5 V ~ 5.5 V
Surface Mount
0°C ~ 70°C (TA)
44-LCC (J-Lead)
44-PLCC (16.59x16.59)
A1240A-PG132M
Microsemi Corporation

IC FPGA 104 I/O 132CPGA

  • Number of LABs/CLBs: 684
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: 104
  • Number of Gates: 4000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Operating Temperature: -55°C ~ 125°C (TC)
  • Package / Case: 132-BCPGA
  • Supplier Device Package: 132-CPGA (34.54x34.54)
封裝: 132-BCPGA
庫存5,200
-
-
104
4000
4.5 V ~ 5.5 V
Through Hole
-55°C ~ 125°C (TC)
132-BCPGA
132-CPGA (34.54x34.54)
LFE2M20SE-5F484C
Lattice Semiconductor Corporation

IC FPGA 304 I/O 484FBGA

  • Number of LABs/CLBs: 2375
  • Number of Logic Elements/Cells: 19000
  • Total RAM Bits: 1246208
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FPBGA (23x23)
封裝: 484-BBGA
庫存4,736
19000
1246208
304
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FPBGA (23x23)
XC4044XL-3BG432I
Xilinx Inc.

IC FPGA 320 I/O 432MBGA

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 320
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
封裝: 432-LBGA, Metal
庫存3,280
3800
51200
320
44000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XC4036XL-1HQ240I
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 193
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
封裝: 240-BFQFP Exposed Pad
庫存4,976
3078
41472
193
36000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XC4006E-1TQ144C
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

  • Number of LABs/CLBs: 256
  • Number of Logic Elements/Cells: 608
  • Total RAM Bits: 8192
  • Number of I/O: 113
  • Number of Gates: 6000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
封裝: 144-LQFP
庫存5,328
608
8192
113
6000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
AT40K20AL-1CQC
Microchip Technology

IC FPGA 20K GATES 160QFP

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 1024
  • Total RAM Bits: 8192
  • Number of I/O: 130
  • Number of Gates: 30000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
封裝: 160-BQFP
庫存5,168
1024
8192
130
30000
3 V ~ 3.6 V
Surface Mount
0°C ~ 70°C
160-BQFP
160-PQFP (28x28)
5SGXMBBR3H43I4N
Altera

IC FPGA 600 I/O 1760HBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 65561600
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-HBGA (45x45)
封裝: 1760-BBGA, FCBGA
庫存4,976
952000
65561600
600
-
0.82 V ~ 0.88 V
Surface Mount
-40°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-HBGA (45x45)
EP2S60F484C5
Altera

IC FPGA 334 I/O 484FBGA

  • Number of LABs/CLBs: 3022
  • Number of Logic Elements/Cells: 60440
  • Total RAM Bits: 2544192
  • Number of I/O: 334
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA, FCBGA
庫存7,344
60440
2544192
334
-
1.15 V ~ 1.25 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA, FCBGA
484-FBGA (23x23)
EP4CE15F17C8
Altera

IC FPGA 165 I/O 256FBGA

  • Number of LABs/CLBs: 963
  • Number of Logic Elements/Cells: 15408
  • Total RAM Bits: 516096
  • Number of I/O: 165
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FBGA (17x17)
封裝: 256-LBGA
庫存5,200
15408
516096
165
-
1.15 V ~ 1.25 V
Surface Mount
0°C ~ 85°C (TJ)
256-LBGA
256-FBGA (17x17)
M7AFS600-1FG484
Microsemi Corporation

IC FPGA 172 I/O 484FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 110592
  • Number of I/O: 172
  • Number of Gates: 600000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
封裝: 484-BGA
庫存5,920
-
110592
172
600000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 70°C (TA)
484-BGA
484-FPBGA (23x23)
AGL1000V2-FG256I
Microsemi Corporation

IC FPGA 177 I/O 256FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 24576
  • Total RAM Bits: 147456
  • Number of I/O: 177
  • Number of Gates: 1000000
  • Voltage - Supply: 1.14 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FPBGA (17x17)
封裝: 256-LBGA
庫存2,928
24576
147456
177
1000000
1.14 V ~ 1.575 V
Surface Mount
-40°C ~ 85°C (TA)
256-LBGA
256-FPBGA (17x17)
EP20K160EFC484-3AA
Intel

IC FPGA

  • Number of LABs/CLBs: 640
  • Number of Logic Elements/Cells: 6400
  • Total RAM Bits: 81920
  • Number of I/O: 316
  • Number of Gates: 404000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
封裝: 484-BBGA
庫存5,264
6400
81920
316
404000
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
EP3C40F324C8
Intel

IC FPGA 195 I/O 324FBGA

  • Number of LABs/CLBs: 2475
  • Number of Logic Elements/Cells: 39600
  • Total RAM Bits: 1161216
  • Number of I/O: 195
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
封裝: 324-BGA
庫存4,208
39600
1161216
195
-
1.15 V ~ 1.25 V
Surface Mount
0°C ~ 85°C (TJ)
324-BGA
324-FBGA (19x19)
5SGSED6N2F45I3N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 220000
  • Number of Logic Elements/Cells: 583000
  • Total RAM Bits: 54553600
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封裝: 1932-BBGA, FCBGA
庫存4,800
583000
54553600
840
-
0.82 V ~ 0.88 V
Surface Mount
-40°C ~ 100°C (TJ)
1932-BBGA, FCBGA
1932-FBGA, FC (45x45)
5SGXEA7N2F40C3N
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存5,760
622000
59939840
600
-
0.82 V ~ 0.88 V
Surface Mount
0°C ~ 85°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
hot EP4SGX180FF35C4N
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: 7030
  • Number of Logic Elements/Cells: 175750
  • Total RAM Bits: 13954048
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存6,544
175750
13954048
564
-
0.87 V ~ 0.93 V
Surface Mount
0°C ~ 85°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
5SGXMA7N1F40C1N
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封裝: 1517-BBGA, FCBGA
庫存5,280
622000
59939840
600
-
0.87 V ~ 0.93 V
Surface Mount
0°C ~ 85°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
EP2S90F780C5N
Intel

IC FPGA 534 I/O 780FBGA

  • Number of LABs/CLBs: 4548
  • Number of Logic Elements/Cells: 90960
  • Total RAM Bits: 4520488
  • Number of I/O: 534
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA
庫存4,192
90960
4520488
534
-
1.15 V ~ 1.25 V
Surface Mount
0°C ~ 85°C (TJ)
780-BBGA
780-FBGA (29x29)
10AX027E3F29E2LG
Intel

780-PIN FBGA

  • Number of LABs/CLBs: 101620
  • Number of Logic Elements/Cells: 270000
  • Total RAM Bits: 17870848
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封裝: 780-BBGA, FCBGA
庫存3,184
270000
17870848
360
-
0.87 V ~ 0.93 V
Surface Mount
0°C ~ 100°C (TJ)
780-BBGA, FCBGA
780-FBGA (29x29)
5AGXMA3D6F31C6N
Intel

IC FPGA 416 I/O 896FBGA

  • Number of LABs/CLBs: 7362
  • Number of Logic Elements/Cells: 156000
  • Total RAM Bits: 11746304
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
封裝: 896-BBGA, FCBGA
庫存7,344
156000
11746304
416
-
1.07 V ~ 1.13 V
Surface Mount
0°C ~ 85°C (TJ)
896-BBGA, FCBGA
896-FBGA (31x31)
XC7S6-2CPGA196I
Xilinx Inc.

XC7S6-2CPGA196I

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 6000
  • Total RAM Bits: 184320
  • Number of I/O: 100
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 196-TFBGA, CSBGA
  • Supplier Device Package: 196-CSPBGA (8x8)
封裝: 196-TFBGA, CSBGA
庫存9,684
6000
184320
100
-
0.95 V ~ 1.05 V
Surface Mount
-40°C ~ 100°C (TJ)
196-TFBGA, CSBGA
196-CSPBGA (8x8)
5AGXBA7D4F35C5G
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 11460
  • Number of Logic Elements/Cells: 242000
  • Total RAM Bits: 15470592
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
封裝: 1152-BBGA, FCBGA
庫存2,064
242000
15470592
544
-
1.07V ~ 1.13V
Surface Mount
0°C ~ 85°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
T120F576C3
Efinix, Inc.

IC FPGA 278 I/O 576FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 112128
  • Total RAM Bits: 5536768
  • Number of I/O: 278
  • Number of Gates: -
  • Voltage - Supply: 1.15V ~ 1.25V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 576-VFBGA
  • Supplier Device Package: 576-FBGA (16x16)
封裝: -
庫存4,434
112128
5536768
278
-
1.15V ~ 1.25V
Surface Mount
0°C ~ 85°C (TJ)
576-VFBGA
576-FBGA (16x16)
XC4004A-6TQ144I
AMD

FPGA, 144 CLBS, 3200 GATES

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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