圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存4,320 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存3,508 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 16 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存5,472 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 20 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存3,598 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 14 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存5,292 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 24 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | Guide Pin | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存7,902 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存3,400 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 20 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | Guide Pin | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存2,448 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 19 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存8,820 |
|
Male Pin | - | Board to Cable/Wire | Shrouded - 4 Wall | 16 | All | 3 | - | Through Hole | Solder | Threaded | - | 0.090" (2.29mm) | - | 0.344" (8.75mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Polyphenylene Sulfide (PPS) | - | -55°C ~ 125°C | - | - | Black |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存6,300 |
|
Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Unshrouded | 23 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存5,598 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 12 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存7,182 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存6,966 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存6,156 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 17 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | Guide Pin | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存7,704 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存2,538 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 23 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | Guide Pin | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存6,858 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 11 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存6,606 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 20 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | Guide Pin | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存7,740 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 20 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存7,704 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 24 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存6,552 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 24 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存3,834 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 38 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | Guide Pin | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存8,280 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存7,938 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 6 | All | 1 | - | Through Hole | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | Guide Pin | -55°C ~ 150°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存2,952 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存6,786 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存2,520 |
|
- | 0.050" (1.27mm) | Board to Cable/Wire | - | - | All | 1 | - | - | Solder | - | - | - | - | - | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | - | -55°C ~ 125°C | - | - | - |
||
ITT Cannon, LLC |
MICRO
|
封裝: - |
庫存3,006 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Unshrouded | 16 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | - | - | - | 0.100" (2.54mm) | Circular | Gold | 50µin (1.27µm) | - | Copper Alloy | Diallyl Phthalate (DAP) | Guide Pin | -55°C ~ 150°C | - | - | - |