圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 2.1GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存6,416 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2.1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 2.1GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,360 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2.1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 16:1 24TSSOP
|
封裝: 24-TSSOP (0.173", 4.40mm Width) |
庫存3,376 |
|
1 | 16:1 | No/Yes | LVCMOS, LVTTL | LVDS, LVPECL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 16:1 24TSSOP
|
封裝: 24-TSSOP (0.173", 4.40mm Width) |
庫存4,848 |
|
1 | 16:1 | No/Yes | LVCMOS, LVTTL | LVDS, LVPECL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 3.2GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,984 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3.2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 3.2GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存7,520 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3.2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存7,968 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存6,528 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,056 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 2:1 2GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,328 |
|
1 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存3,552 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 2GHZ 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,696 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
封裝: 8-TSSOP (0.173", 4.40mm Width) |
庫存2,176 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
封裝: 8-TSSOP (0.173", 4.40mm Width) |
庫存4,208 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL, SSTL | CML | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 1.3GHZ 64TQFP
|
封裝: 64-TQFP Exposed Pad |
庫存3,648 |
|
8 | 2:1, 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 1.3GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 1.3GHZ 64TQFP
|
封裝: 64-TQFP Exposed Pad |
庫存5,584 |
|
8 | 2:1, 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 1.3GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 20TSSOP
|
封裝: 20-TSSOP (0.173", 4.40mm Width) |
庫存6,864 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 20TSSOP
|
封裝: 20-TSSOP (0.173", 4.40mm Width) |
庫存3,568 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 350MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存7,872 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存6,464 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,616 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存7,616 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存7,680 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
封裝: 16-VFQFN Exposed Pad |
庫存7,408 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
封裝: 20-TSSOP (0.173", 4.40mm Width) |
庫存4,464 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
封裝: 20-TSSOP (0.173", 4.40mm Width) |
庫存6,704 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 2GHZ 32TQFP
|
封裝: 32-LQFP |
庫存3,232 |
|
2 | 1:5 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 8:1 2.5GHZ 24TSSOP
|
封裝: 24-TSSOP (0.173", 4.40mm Width) |
庫存3,728 |
|
1 | 8:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2.5GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |