頁 99 - IC、電晶體用插槽 | 連接器、互連元件

D84032B-46

Harwin Inc.

CONN SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封裝: -

庫存4,122

-

916788-1

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 462POS TIN

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 462 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

封裝: -

庫存8,604

462 (19 x 19)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Liquid Crystal Polymer (LCP)

-

AR32-HZL/07-TT

Assmann WSW Components

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Polyester
Operating Temperature: -40°C ~ 105°C

封裝: -

庫存2,862

32 (2 x 16)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Thermoplastic, Polyester

-40°C ~ 105°C

A14-LCG

Assmann WSW Components

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: Through Hole
Features: Open Frame
Termination: -
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封裝: -

庫存7,074

14 (2 x 7)

0.100" (2.54mm)

Gold

-

Through Hole

Open Frame

-

0.100" (2.54mm)

Gold

-

169-PRS17053-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存4,482

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

196-PRS14001-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存3,762

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

546-87-420-19-111147

Preci-Dip

CONN SOCKET PGA 420POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 420 (19 x 19)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Bronze
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,230

420 (19 x 19)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin

-

Bronze

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

40-3572-16

Aries Electronics

CONN IC DIP SOCKET ZIF 40POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存7,056

40 (2 x 20)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled

-

614-83-279-19-081112

Preci-Dip

CONN SOCKET PGA 279POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 279 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,898

279 (19 x 19)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

44-6574-11

Aries Electronics

CONN IC DIP SOCKET ZIF 44POS TIN

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 44 (2 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存3,454

44 (2 x 22)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

517-87-420-19-111111

Preci-Dip

CONN SOCKET PGA 420POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 420 (19 x 19)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,956

420 (19 x 19)

0.050" (1.27mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.050" (1.27mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

546-83-168-17-101135

Preci-Dip

CONN SOCKET PGA 168POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 168 (17 x 17)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Bronze
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,176

168 (17 x 17)

0.050" (1.27mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin

-

Bronze

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

126-93-432-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,496

32 (2 x 16)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

116-93-636-41-006000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 36POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,002

36 (2 x 18)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

126-93-316-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,816

16 (2 x 8)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

146-93-624-41-012000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,586

24 (2 x 12)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

32-3554-10

Aries Electronics

CONN IC DIP SOCKET ZIF 32POS TIN

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存6,264

32 (2 x 16)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

18-6501-20

Aries Electronics

CONN IC DIP SOCKET 18POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存6,570

18 (2 x 9)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin

200µin (5.08µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

08-2501-31

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,626

8 (2 x 4)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Phosphor Bronze

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Gold

10µin (0.25µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 125°C

07-0511-10

Aries Electronics

CONN SOCKET SIP 7POS TIN

Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存2,610

7 (1 x 7)

0.100" (2.54mm)

Tin

50µin (1.27µm)

Phosphor Bronze

Through Hole

-

Solder

0.100" (2.54mm)

Tin

50µin (1.27µm)

Phosphor Bronze

Polyamide (PA46), Nylon 4/6, Glass Filled

-55°C ~ 105°C

146-83-432-41-036101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,830

32 (2 x 16)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

146-83-320-41-036101

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Press-Fit
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,208

20 (2 x 10)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Press-Fit

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-87-308-41-012101

Preci-Dip

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,114

8 (2 x 4)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

614-87-306-31-012101

Preci-Dip

CONN IC DIP SOCKET 325POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 325 (18 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,644

325 (18 x 18)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

117-43-652-41-005000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 52POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 52 (2 x 26)
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,534

52 (2 x 26)

0.070" (1.78mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.070" (1.78mm)

Tin

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

110-47-316-41-105000

Mill-Max Manufacturing Corp.

STANDRD SOLDER TAIL DIP SOCKET

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,344

16 (2 x 8)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

210-83-308-41-101000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 300µin (7.62µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,212

8 (2 x 4)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

300µin (7.62µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C

115-93-316-41-001000

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass Alloy
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存9,144

16 (2 x 8)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

200µin (5.08µm)

Brass Alloy

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 125°C