圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
SOCKET W/EMBOSS 52MM GF RPGA989
|
封裝: - |
庫存4,752 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Amphenol FCI |
CONN SOCKET SIP 22POS GOLD
|
封裝: - |
庫存2,304 |
|
22 (1 x 22) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
||
Assmann WSW Components |
CONN SOCKET PLCC 32POS TIN
|
封裝: - |
庫存7,596 |
|
32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 150µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存6,300 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 24POS
|
封裝: - |
庫存2,250 |
|
24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST
|
封裝: - |
庫存5,238 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Preci-Dip |
CONN SOCKET PGA 365POS GOLD
|
封裝: - |
庫存8,550 |
|
365 (17 x 17) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 40POS GOLD
|
封裝: - |
庫存8,424 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 48POS GOLD
|
封裝: - |
庫存4,482 |
|
48 (2 x 24) | 0.070" (1.78mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070" (1.78mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS TIN
|
封裝: - |
庫存8,604 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 36POS GOLD
|
封裝: - |
庫存8,442 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass Alloy | Thermoplastic | - |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 24POS GOLD
|
封裝: - |
庫存4,968 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 32POS GOLD
|
封裝: - |
庫存7,488 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
封裝: - |
庫存8,676 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN SOCKET SIP 31POS GOLD
|
封裝: - |
庫存3,114 |
|
31 (1 x 31) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 18POS GOLD
|
封裝: - |
庫存3,618 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 16POS GOLD
|
封裝: - |
庫存2,196 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
封裝: - |
庫存8,784 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Aries Electronics |
CONN IC DIP SOCKET 24POS GOLD
|
封裝: - |
庫存2,376 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET 10POS GOLD
|
封裝: - |
庫存2,034 |
|
10 (2 x 5) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
||
Preci-Dip |
CONN IC DIP SOCKET 52POS GOLD
|
封裝: - |
庫存6,030 |
|
52 (2 x 26) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
封裝: - |
庫存4,266 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
||
Preci-Dip |
CONN IC DIP SOCKET 36POS GOLD
|
封裝: - |
庫存4,464 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD
|
封裝: - |
庫存8,982 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Assmann WSW Components |
CONN IC DIP SOCKET 18POS GOLD
|
封裝: - |
庫存3,384 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
||
Preci-Dip |
CONN IC DIP SOCKET 8POS GOLD
|
封裝: - |
庫存4,014 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET 28POS GOLD
|
封裝: - |
庫存17,640 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
||
Keystone Electronics |
CONN TRANSIST TO-3 3POS TIN
|
封裝: - |
庫存30,252 |
|
3 (Oval) | - | Tin | - | Brass | Chassis Mount | Closed Frame | Solder | - | Tin | - | Brass | Polybutylene Terephthalate (PBT) | - |