圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Amphenol FCI |
CONN SOCKET SIP 8POS TIN
|
封裝: - |
庫存7,956 |
|
8 (1 x 8) | 0.100" (2.54mm) | Tin | 150µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
|
Preci-Dip |
CONN SOCKET PGA 528POS GOLD
|
封裝: - |
庫存3,204 |
|
528 (21 x 21) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS GLD
|
封裝: - |
庫存2,196 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 36POS TIN
|
封裝: - |
庫存3,546 |
|
36 (2 x 18) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole, Bottom Entry; Through Board | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS GLD
|
封裝: - |
庫存8,820 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
|
|
Aries Electronics |
CONN SOCKET SIP 39POS TIN
|
封裝: - |
庫存4,500 |
|
39 (1 x 39) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 28POS GOLD
|
封裝: - |
庫存7,146 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 26POS GOLD
|
封裝: - |
庫存6,300 |
|
26 (2 x 13) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 17POS TIN
|
封裝: - |
庫存7,812 |
|
17 (1 x 17) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 11POS TIN
|
封裝: - |
庫存6,138 |
|
11 (1 x 11) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Aries Electronics |
CONN SOCKET SIP 10POS TIN
|
封裝: - |
庫存3,598 |
|
10 (1 x 10) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Samtec Inc. |
ADAPTOR PLUG
|
封裝: - |
庫存6,048 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Aries Electronics |
CONN SOCKET SIP 9POS TIN
|
封裝: - |
庫存7,488 |
|
9 (1 x 9) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
|
|
Samtec Inc. |
ADAPTOR PLUG
|
封裝: - |
庫存8,838 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 16POS TIN
|
封裝: - |
庫存7,362 |
|
16 (2 x 8) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
|
Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD
|
封裝: - |
庫存4,068 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
Preci-Dip |
CONN IC DIP SOCKET 32POS GOLD
|
封裝: - |
庫存7,794 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
Mill-Max Manufacturing Corp. |
CONN SOCKET SIP 12POS GOLD
|
封裝: - |
庫存4,950 |
|
12 (1 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
|
Aries Electronics |
CONN IC DIP SOCKET 8POS GOLD
|
封裝: - |
庫存4,122 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
|
Preci-Dip |
CONN SOCKET PGA 40POS GOLD
|
封裝: - |
庫存3,508 |
|
40 (11 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
|
Molex, LLC |
CONN CAMERA SOCKET 32POS GOLD
|
封裝: - |
庫存5,364 |
|
32 (4 x 8) | 0.035" (0.90mm) | Gold | 3µin (0.08µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035" (0.90mm) | Gold | Flash | Copper Alloy | Plastic | - |
|
|
|
Aries Electronics |
CONN SOCKET SIP 12POS GOLD
|
封裝: - |
庫存5,400 |
|
12 (1 x 12) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
|
Samtec Inc. |
SURFACE MOUNT DIP SOCKETS
|
封裝: - |
庫存3,006 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
Assmann WSW Components |
CONN IC DIP SOCKET 8POS GOLD
|
封裝: - |
庫存8,766 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
|
|
|
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS TIN
|
封裝: - |
庫存5,562 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
|
|
Preci-Dip |
CONN IC DIP SOCKET 8POS GOLD
|
封裝: - |
庫存6,768 |
|
8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
Mill-Max Manufacturing Corp. |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存15,552 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
Amphenol FCI |
CONN IC DIP SOCKET 16POS TIN
|
封裝: - |
庫存116,790 |
|
16 (2 x 8) | 0.100" (2.54mm) | Tin | 100µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 100µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 105°C |
