圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Amphenol FCI |
HEADER BERGSTIK R/A
|
封裝: - |
庫存2,466 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 68 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.318" (8.08mm) | 0.080" (2.03mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
HEADER BERGSTIK R/A
|
封裝: - |
庫存6,930 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 30 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.195" (4.95mm) | - | 0.095" (2.41mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
HEADER BERGSTIK STR
|
封裝: - |
庫存5,580 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 2 | All | 1 | - | Through Hole | Kinked Pin, Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.467" (11.85mm) | 0.117" (2.97mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | Tin | Copper Alloy | Polyamide (PA), Nylon | - | - | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存6,012 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 58 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.160" (4.06mm) | 0.120" (3.05mm) | - | 0.190" (4.83mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
|
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存3,598 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 33 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.354" (9.00mm) | 0.118" (3.00mm) | 0.572" (14.53mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 34POS .100" GOLD
|
封裝: - |
庫存6,858 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Shrouded - 4 Wall | 34 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.235" (5.97mm) | 0.125" (3.18mm) | - | 0.350" (8.89mm) | Square | Gold | 10µin (0.25µm) | Tin | Copper Alloy | Polycyclohexylenedimethylene Terephthalate (PCT) | Keying Slot | -40°C ~ 105°C | - | UL94 V-0 | Black |
|
|
Sullins Connector Solutions |
CONN HEADER .100" SNGL R/A 8POS
|
封裝: - |
庫存7,308 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 8 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.420" (10.67mm) | - | 0.098" (2.50mm) | Square | Tin | - | Tin | Brass | Polybutylene Terephthalate (PBT) | - | -40°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
Amphenol FCI |
BERGSTIK II .100" SR STRAIGHT
|
封裝: - |
庫存2,610 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 36 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.695" (17.65mm) | 1.025" (26.04mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
Samtec Inc. |
CONN HEADER 20POS .100" DL GOLD
|
封裝: - |
庫存6,930 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 20 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | - | 0.230" (5.84mm) | 0.126" (3.20mm) | 0.456" (11.58mm) | 0.100" (2.54mm) | Square | Gold | 30µin (0.76µm) | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Sullins Connector Solutions |
CONN HEADER 15POS .100 SGL SMD
|
封裝: - |
庫存2,142 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 15 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.230" (5.84mm) | - | - | 0.100" (2.54mm) | Square | Tin-Lead | 100µin (2.54µm) | Tin-Lead | Phosphor Bronze | Polyamide (PA9T), Nylon 9T | - | -65°C ~ 125°C | - | UL94 V-0 | Black |
|
|
|
Molex Connector Corporation |
CONN HEADER 4POS 1.5MM VERT SMD
|
封裝: - |
庫存2,106 |
|
Male Pin | 0.059" (1.50mm) | Board to Cable/Wire | Shrouded - 4 Wall | 4 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.106" (2.70mm) | - | - | 0.199" (5.05mm) | Square | Tin-Lead | 100µin (2.54µm) | - | Brass Alloy | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | - | UL94 V-0 | Beige |
|
|
Sullins Connector Solutions |
CONN HEADER .100 SINGL STR 1POS
|
封裝: - |
庫存7,398 |
|
Male Pin | - | Board to Board or Cable | Unshrouded | 1 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.318" (8.08mm) | 0.420" (10.67mm) | 0.838" (21.29mm) | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Tin | Copper Alloy | Thermoplastic, Polyester | - | - | - | UL94 V-0 | Black |
|
|
Sullins Connector Solutions |
CONN HEADER 72POS 1MM DL AU SMD
|
封裝: - |
庫存4,536 |
|
Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 72 | All | 2 | 0.039" (1.00mm) | Surface Mount | Solder | Push-Pull | 0.065" (1.65mm) | - | - | 0.039" (1.00mm) | Square | Gold | 10µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide | -40°C ~ 125°C | - | UL94 V-0 | Black |
|
|
|
Samtec Inc. |
.100 X .100 EJECTOR HEADER ASSEM
|
封裝: - |
庫存2,934 |
|
Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 30 | 29 | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Latch Lock/Eject Hooks | 0.225" (5.72mm) | 0.090" (2.29mm) | - | 0.390" (9.91mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | - | - | Black |
|
|
|
Samtec Inc. |
SMT .050'' STRIPS
|
封裝: - |
庫存6,606 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 42 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | - | 0.190" (4.83mm) | - | - | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
|
Samtec Inc. |
.050 X .050 C.L. LOW PROFILE TER
|
封裝: - |
庫存2,862 |
|
Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 40 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | - | 0.065" (1.65mm) | - | - | 0.034" (0.86mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Pick and Place | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Samtec Inc. |
2MM EJECTOR HEADER
|
封裝: - |
庫存6,498 |
|
Male Pin | 0.079" (2.00mm) | Board to Cable/Wire | Shrouded - 4 Wall | 24 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.120" (3.05mm) | - | - | 0.370" (9.40mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Samtec Inc. |
.050 EJECTOR HEADER ASSEMBLY
|
封裝: - |
庫存6,228 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Shrouded - 4 Wall | 26 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.120" (3.05mm) | - | - | 0.325" (8.25mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP), Glass Filled | Keying Slot, Pick and Place | -55°C ~ 125°C | - | - | Black |
|
|
|
Samtec Inc. |
.050'' X .050 TERMINAL STRIP
|
封裝: - |
庫存2,196 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
Preci-Dip |
CONN HDR 72POS 2.54MM T/H
|
封裝: - |
庫存8,712 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 72 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.587" (14.91mm) | 0.118" (3.00mm) | 0.805" (20.44mm) | 0.100" (2.54mm) | Square | Tin | - | Tin | Brass | Polyamide (PA), Nylon, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Preci-Dip |
CONN HDR 20POS 1.27MM T/H R/A
|
封裝: - |
庫存6,660 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 20 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.118" (3.00mm) | 0.126" (3.20mm) | - | 0.174" (4.42mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
|
Samtec Inc. |
SMT .050'' STRIPS
|
封裝: - |
庫存5,904 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 15 | All | 1 | - | Surface Mount | Solder | - | 0.390" (9.91mm) | - | - | 0.100" (2.54mm) | Square | Gold | 30µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Molex, LLC |
CGRID SMT BKWY HDR 30 SAU 34CKT
|
封裝: - |
庫存7,164 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 34 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.320" (8.13mm) | - | - | 0.090" (2.29mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | - | - | UL94 V-0 | Black |
|
|
|
Molex Connector Corporation |
CONN HEADER 10POS 3MM RT ANG SMD
|
封裝: - |
庫存7,506 |
|
Male Pin | 0.118" (3.00mm) | Board to Cable/Wire | Shrouded - 4 Wall | 10 | All | 1 | - | Surface Mount, Right Angle | Solder | Locking Ramp | - | - | - | 0.172" (4.37mm) | Square | Tin | 60µin (1.52µm) | Tin | Brass | Liquid Crystal Polymer (LCP), Glass Filled | Board Lock | - | - | UL94 V-0 | Black |
|
|
|
Molex, LLC |
MINI-FIT JR LCP VERT. HDR PEGS
|
封裝: - |
庫存7,596 |
|
Male Pin | 0.165" (4.20mm) | Board to Cable/Wire | Shrouded - 4 Wall | 6 | All | 2 | 0.165" (4.20mm) | Through Hole | Solder | Locking Ramp | - | 0.144" (3.66mm) | - | 0.535" (13.60mm) | Square | Tin | 100µin (2.54µm) | Tin | Brass | Liquid Crystal Polymer (LCP), Glass Filled | Board Guide | - | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
BERGSTIK
|
封裝: - |
庫存2,646 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 11 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.230" (5.84mm) | - | - | 0.100" (2.54mm) | Square | Tin | 78.7µin (2.00µm) | Tin | Phosphor Bronze | Thermoplastic | - | - | - | UL94 V-0 | Black |
|
|
|
Molex, LLC |
CONN 2.0 W/B WAFER ASSY STR 2CKT
|
封裝: - |
庫存7,110 |
|
Male Pin | 0.079" (2.00mm) | Board to Cable/Wire | Shrouded - 3 Wall | 2 | All | 1 | - | Through Hole | Solder | Detent Lock | 0.130" (3.30mm) | 0.138" (3.50mm) | 0.331" (8.40mm) | 0.217" (5.51mm) | Square | Gold | - | - | Brass | Polyamide (PA66), Nylon 6/6 | - | - | - | UL94 V-0 | - |
|
|
Harwin Inc. |
05+05 DIL SMT MALE PIN HDR
|
封裝: - |
庫存8,232 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | - | - | 0.098" (2.50mm) | Square | Gold | Flash | - | Brass | Polyamide (PA6T), Nylon 6T | - | -40°C ~ 105°C | - | UL94 V-0 | Black |
