圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存8,730 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 42 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.400" (10.16mm) | 0.335" (8.50mm) | 0.835" (21.21mm) | 0.100" (2.54mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存2,376 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 15 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.400" (10.16mm) | 0.613" (15.57mm) | 1.113" (28.27mm) | 0.100" (2.54mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
BERGSTIK II 0.100" SNGL ST
|
封裝: - |
庫存8,100 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 32 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.150" (3.81mm) | 0.480" (12.19mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
BERGSTIK II 0.100" SNGL ST
|
封裝: - |
庫存6,966 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 30 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
|
|
3M |
CONN HEADER R/A 25POS GOLD SMD
|
封裝: - |
庫存4,824 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 25 | All | 1 | - | Surface Mount, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | - | - | 0.098" (2.50mm) | Square | Gold | Flash | Tin | Copper Alloy | Thermoplastic | - | -25°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 4POS 2MM VERT SMD
|
封裝: - |
庫存8,118 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 4 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | - | - | 0.060" (1.52mm) | Square | Gold | Flash | Tin | Copper Alloy | Thermoplastic | Pick and Place | -25°C ~ 105°C | - | UL94 V-0 | Black |
|
|
Sullins Connector Solutions |
CONN HEADER .100 DUAL R/A 70POS
|
封裝: - |
庫存3,906 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 70 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.318" (8.08mm) | 0.100" (2.54mm) | - | 0.240" (6.10mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -65°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Molex Connector Corporation |
CONN HEADER 42POS 2MM R/A GOLD
|
封裝: - |
庫存6,282 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 42 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.157" (4.00mm) | 0.102" (2.60mm) | - | 0.169" (4.30mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Phosphor Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | - | - | - | UL94 V-0 | Black |
|
|
|
TE Connectivity Aerospace, Defense and Marine |
2 ROW BOX PIN 110 POS R/A
|
封裝: - |
庫存5,346 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Shrouded - 3 Wall | 110 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | - | 0.180" (4.59mm) | 0.135" (3.43mm) | - | 0.330" (8.38mm) | Square | Gold | 50µin (1.27µm) | Tin-Lead | Brass | Polyester, Glass Filled | Mating Guide, Mounting Flange | - | - | - | Blue |
|
|
|
Samtec Inc. |
.100 X .100 EJECTOR HEADER ASSEM
|
封裝: - |
庫存7,002 |
|
Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 30 | 29 | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.225" (5.72mm) | - | - | 0.500" (12.70mm) | Square | Gold | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Lock, Keying Slot, Pick and Place | -55°C ~ 125°C | - | - | Black |
|
|
|
Samtec Inc. |
1MM MICRO TERMINAL STRIPS
|
封裝: - |
庫存4,320 |
|
Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 40 | All | 2 | 0.039" (1.00mm) | Surface Mount | Solder | - | 0.075" (1.90mm) | - | - | 0.059" (1.50mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide, End Shrouds | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
|
Sullins Connector Solutions |
CONN HEADER 1MM 48POS
|
封裝: - |
庫存3,544 |
|
Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 48 | All | 2 | 0.039" (1.00mm) | Surface Mount | Solder | Push-Pull | 0.075" (1.90mm) | - | - | 0.039" (1.00mm) | Square | Gold | 10µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide | -40°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Preci-Dip |
CONN HDR 48POS 0.100 SMD R/A AU
|
封裝: - |
庫存8,550 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 48 | All | 1 | - | Surface Mount, Right Angle | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.100" (2.54mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
|
Samtec Inc. |
.050'' X .050 TERMINAL STRIP
|
封裝: - |
庫存5,328 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
Samtec Inc. |
1MM SURFACE MOUNT STRIP
|
封裝: - |
庫存5,346 |
|
Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 31 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.065" (1.65mm) | - | - | 0.064" (1.63mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Preci-Dip |
CONN HDR 42POS 0.100 SMD
|
封裝: - |
庫存2,016 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 42 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.141" (3.60mm) | - | - | 0.110" (2.79mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
|
Samtec Inc. |
.050'' X .050 TERMINAL STRIP
|
封裝: - |
庫存4,590 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Molex, LLC |
4.2MM WTB RAHDR W/O MNTFLG
|
封裝: - |
庫存5,022 |
|
Male Pin | 0.165" (4.20mm) | Board to Cable/Wire | Shrouded - 4 Wall | 20 | All | 2 | 0.165" (4.20mm) | Through Hole, Right Angle | Solder | Locking Ramp | - | 0.130" (3.30mm) | - | 0.394" (10.00mm) | Square | Tin | 100µin (2.54µm) | Tin | Brass | Polyamide (PA46), Nylon 4/6 | Mounting Flange | - | - | UL94 V-0 | Beige |
|
|
Samtec Inc. |
CONN HEADER 20POS .100" DBL SMD
|
封裝: - |
庫存2,232 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 20 | All | 2 | 0.100" (2.54mm) | Surface Mount, Right Angle | Solder | - | 0.230" (5.84mm) | - | - | 0.240" (6.10mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
BERGSTIK
|
封裝: - |
庫存4,680 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 28 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Tin | 78.7µin (2.00µm) | Tin | Phosphor Bronze | Thermoplastic | - | - | - | UL94 V-0 | Black |
|
|
|
Samtec Inc. |
.050 X .050 C.L. LOW PROFILE TER
|
封裝: - |
庫存2,844 |
|
Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 4 | All | 1 | - | Through Hole | Solder | - | 0.120" (3.05mm) | 0.090" (2.29mm) | 0.244" (6.20mm) | 0.034" (0.86mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
|
TE Connectivity AMP Connectors |
8POS MICRO MNL ASSY,R/A,THRU
|
封裝: - |
庫存8,298 |
|
Male Pin | 0.118" (3.00mm) | Board to Cable/Wire | Shrouded - 4 Wall | 8 | All | 2 | 0.118" (3.00mm) | Through Hole, Right Angle | Solder | Locking Ramp | - | - | - | 0.290" (7.37mm) | Square | Tin | 100µin (2.54µm) | Tin | Brass | Polyamide (PA), Nylon | Board Lock | -40°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
Samtec Inc. |
SMT .050'' STRIPS
|
封裝: - |
庫存5,148 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 2 | All | 1 | - | Surface Mount | Solder | - | 0.335" (8.51mm) | - | - | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
Amphenol FCI |
CONN BERGSTIK II SR STR RET
|
封裝: - |
庫存8,424 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 2 | All | 1 | - | Through Hole | Press-Fit, Solder | Push-Pull | 0.318" (8.08mm) | 0.120" (3.05mm) | 0.538" (13.67mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | - | - | - | UL94 V-0 | Black |
|
|
Souriau |
SMS PIN HEADER BOARDMOUNT
|
封裝: - |
庫存6,876 |
|
Male Pin | 0.200" (5.08mm) | Board to Cable/Wire | Shrouded - 4 Wall | 9 | All | 1 | - | Through Hole | Solder | Push-Pull | - | 0.157" (4.00mm) | - | 0.901" (22.89mm) | Circular | Gold | 29.5µin (0.75µm) | - | Copper Alloy | Thermoplastic, Glass Filled | Mounting Flange | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
JAE Electronics |
CONN RCPT 1.25MM 17POS SMD R/A
|
封裝: - |
庫存7,032 |
|
Male Pin | 0.049" (1.25mm) | Board to Cable/Wire | Shrouded - 4 Wall | 17 | All | 2 | 0.055" (1.40mm) | Surface Mount, Right Angle | Solder | Friction Lock | 0.094" (2.40mm) | - | - | 0.145" (3.70mm) | Square | Gold | - | Tin or Tin-Alloy | Copper Alloy | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention | -40°C ~ 80°C | - | UL94 V-0 | Black |
|
|
Samtec Inc. |
CONN HEADER 22POS .100 DL R/A AU
|
封裝: - |
庫存7,548 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 22 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | - | 0.230" (5.84mm) | 0.090" (2.29mm) | - | 0.219" (5.56mm) | Square | Gold | 30µin (0.76µm) | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
|
|
TE Connectivity AMP Connectors |
CONN HEADER R/A .100 15POS 15AU
|
封裝: - |
庫存16,908 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Shrouded - 4 Wall | 15 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.240" (6.10mm) | 0.110" (2.79mm) | - | 0.214" (5.44mm) | Square | Gold | 15µin (0.38µm) | Tin | Phosphor Bronze | Thermoplastic | - | -65°C ~ 105°C | - | UL94 V-0 | Black |
