圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存8,604 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 31 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.475" (12.07mm) | 0.120" (3.05mm) | 0.695" (17.65mm) | 0.100" (2.54mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存7,218 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 26 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.318" (8.08mm) | 0.520" (13.21mm) | 0.938" (23.83mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Molex, LLC |
MINIFIT HEADER V/PEGS V-2 4CKT
|
封裝: - |
庫存4,266 |
|
Male Pin | 0.165" (4.20mm) | Board to Cable/Wire | Shrouded - 4 Wall | 4 | All | 1 | - | Through Hole | Solder | Locking Ramp | - | 0.138" (3.50mm) | - | 0.504" (12.80mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Polyamide (PA66), Nylon 6/6 | Board Lock | - | - | UL94 V-2 | Natural |
||
TE Connectivity AMP Connectors |
CONN HEADER 7POS R/A HPI T/H
|
封裝: - |
庫存6,480 |
|
Male Pin | 0.098" (2.50mm) | Board to Cable/Wire | Shrouded - 4 Wall | 7 | All | 1 | - | Through Hole, Right Angle | Solder | Locking Ramp | - | 0.138" (3.50mm) | - | 0.193" (4.90mm) | Square | Tin | - | Tin | Copper Alloy | Thermoplastic | - | -40°C ~ 105°C | - | UL94 V-2 | Ivory |
||
Samtec Inc. |
CONN HEADER 40POS SNGL 2MM SMD
|
封裝: - |
庫存8,838 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 40 | All | 1 | - | Surface Mount | Solder | - | 0.126" (3.20mm) | - | - | 0.059" (1.50mm) | Square | Gold | 30µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
CONN HEADER 84POS .100" DL GOLD
|
封裝: - |
庫存2,448 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 84 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | - | 0.105" (2.67mm) | 0.095" (2.41mm) | 0.300" (7.62mm) | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Sullins Connector Solutions |
CONN HEADER 14POS.100 SGL
|
封裝: - |
庫存4,932 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 14 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Thermoplastic, Polyester | - | - | - | UL94 V-0 | Black |
||
Sullins Connector Solutions |
CONN HEADER 5POS .100 SGL SMD
|
封裝: - |
庫存2,088 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 5 | All | 1 | - | Surface Mount | Solder | Push-Pull | 0.318" (8.08mm) | - | - | 0.100" (2.54mm) | Square | Tin-Lead | 100µin (2.54µm) | Tin-Lead | Phosphor Bronze | Polyamide (PA9T), Nylon 9T | - | -65°C ~ 125°C | - | UL94 V-0 | Black |
||
TE Connectivity Aerospace, Defense and Marine |
CONN HEADER PIN 30POS R/A GOLD
|
封裝: - |
庫存2,970 |
|
Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 30 | All | 2 | 0.150" (3.81mm) | Board Edge, Straddle Mount | Solder | Push-Pull | 0.140" (3.56mm) | - | - | - | Square | Gold | 50µin (1.27µm) | Tin-Lead | - | Liquid Crystal Polymer (LCP), Glass Filled | Card Extender, Mating Guide | - | - | - | Gray |
||
Samtec Inc. |
2MM EJECTOR HEADER
|
封裝: - |
庫存7,092 |
|
Male Pin | 0.079" (2.00mm) | Board to Cable/Wire | Shrouded - 4 Wall | 26 | 25 | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.120" (3.05mm) | - | - | 0.370" (9.40mm) | Square | Gold | 30µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Lock, Keying Slot | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 78POS 1.27MM SMD
|
封裝: - |
庫存8,640 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 78 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | - | - | 0.075" (1.90mm) | Circular | Tin | - | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
TE Connectivity AMP Connectors |
CONN HEADER 50POS VERT GOLD .100
|
封裝: - |
庫存4,392 |
|
Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 50 | All | 2 | 0.100" (2.54mm) | Through Hole | Press-Fit, Solder | Push-Pull | - | - | - | - | Square | Gold | 8µin (0.20µm) | Tin | Phosphor Bronze | Thermoplastic, Polyester | Keying Slot | - | - | UL94 V-0 | Black |
||
Samtec Inc. |
.100 X .100 EJECTOR HEADER ASSEM
|
封裝: - |
庫存8,280 |
|
Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 50 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Latch Lock/Eject Hooks | 0.225" (5.72mm) | 0.120" (3.05mm) | - | 0.500" (12.70mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | - | - | Black |
||
Samtec Inc. |
2MM EJECTOR HEADER
|
封裝: - |
庫存2,754 |
|
Male Pin | 0.079" (2.00mm) | Board to Cable/Wire | Shrouded - 4 Wall | 30 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.120" (3.05mm) | - | - | 0.370" (9.40mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Sullins Connector Solutions |
CONN HEADER .100 DUAL STR 50POS
|
封裝: - |
庫存3,096 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 50 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.320" (8.13mm) | 0.650" (16.51mm) | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Polybutylene Terephthalate (PBT) | - | -65°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
CONN HEADER 30POS DUAL .05" T/H
|
封裝: - |
庫存5,022 |
|
Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 30 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | - | 0.120" (3.05mm) | 0.090" (2.29mm) | 0.244" (6.20mm) | 0.034" (0.86mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
1MM SURFACE MOUNT STRIP
|
封裝: - |
庫存8,208 |
|
Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 27 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.065" (1.65mm) | - | - | 0.098" (2.50mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
TE Connectivity AMP Connectors |
CONN HEADR 20POS DL R/A 30AU SMD
|
封裝: - |
庫存8,046 |
|
Male Pin | 0.118" (3.00mm) | Board to Cable/Wire | Shrouded - 4 Wall | 20 | All | 2 | 0.118" (3.00mm) | Surface Mount, Right Angle | Solder | Locking Ramp | - | - | - | 0.290" (7.37mm) | Square | Gold | 30µin (0.76µm) | Tin | Brass | Polyamide (PA), Nylon | Board Lock | -40°C ~ 105°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 50POS 0.100 T/H R/A
|
封裝: - |
庫存5,436 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 50 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.195" (4.95mm) | 0.126" (3.20mm) | - | 0.200" (5.08mm) | Circular | Tin | - | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
SMT .050'' STRIPS
|
封裝: - |
庫存3,528 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 31 | All | 1 | - | Surface Mount | Solder | - | 0.405" (10.29mm) | - | - | 0.100" (2.54mm) | Square | Tin | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 25POS 0.100 T/H R/A
|
封裝: - |
庫存6,858 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 25 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.195" (4.95mm) | 0.126" (3.20mm) | - | 0.100" (2.54mm) | Circular | Gold | 29.5µin (0.75µm) | Tin | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Molex, LLC |
KK 100 HDR POL RTAN 27POS TIN
|
封裝: - |
庫存4,356 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Shrouded - 1 Wall | 27 | All | 1 | - | Through Hole, Right Angle | Kinked Pin, Solder | Push-Pull | 0.295" (7.49mm) | 0.135" (3.43mm) | - | 0.284" (7.20mm) | Square | Tin | 100µin (2.54µm) | Tin | - | Polyamide (PA), Nylon, Glass Filled | - | - | - | UL94 V-0 | Black |
||
Molex, LLC |
KK 100 HDR POL VERT 10POS
|
封裝: - |
庫存2,826 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Shrouded - 1 Wall | 10 | All | 1 | - | Through Hole | Kinked Pin, Solder | Push-Pull | 0.295" (7.49mm) | 0.135" (3.43mm) | 0.555" (14.10mm) | 0.337" (8.56mm) | Square | Gold | 15µin (0.38µm) | Tin | - | Polyamide (PA), Nylon, Glass Filled | - | - | - | UL94 V-0 | Black |
||
Preci-Dip |
CONN HDR 4POS 2.54MM T/H GOLD
|
封裝: - |
庫存7,920 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 4 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.126" (3.20mm) | 0.846" (21.50mm) | 0.110" (2.79mm) | Circular | Gold | 10µin (0.25µm) | Gold | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
3M |
CONN HEADER 5POS .100" GOLD
|
封裝: - |
庫存3,114 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 5 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.428" (10.87mm) | 0.100" (2.54mm) | 0.628" (15.95mm) | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Gold | Copper Alloy | Polycyclohexylenedimethylene Terephthalate (PCT) | - | -40°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
4.2MM WTB HTEMP RA HDR W/OFLG -
|
封裝: - |
庫存6,732 |
|
Male Pin | - | Board to Cable/Wire | Shrouded - 4 Wall | 2 | All | 2 | 0.165" (4.20mm) | Through Hole, Right Angle | Solder | Locking Ramp | - | 0.130" (3.30mm) | - | 0.394" (10.00mm) | Square | Tin | 100µin (2.54µm) | Tin | Brass | Polyamide (PA46), Nylon 4/6 | - | - | - | UL94 V-0 | Beige |
||
Amphenol FCI |
BERGSTIK II DR STRAIGHT RET
|
封裝: - |
庫存4,230 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 4 | All | 2 | 0.100" (2.54mm) | Through Hole | Kinked Pin, Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
TE Connectivity AMP Connectors |
CONN HEADER VERT .100 80POS 30AU
|
封裝: - |
庫存4,356 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 80 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.318" (8.08mm) | 0.125" (3.18mm) | 0.533" (13.55mm) | 0.090" (2.29mm) | Circular | Gold | 30µin (0.76µm) | Gold | Phosphor Bronze | Thermoplastic | - | -65°C ~ 105°C | - | UL94 V-0 | Black |