圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
SLIM-GRID HEADER, 12 CIRCUITS, T
|
封裝: - |
庫存6,930 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 12 | All | 2 | 0.050" (1.27mm) | Through Hole, Right Angle | Solder | Latch Holder | 0.120" (3.05mm) | 0.118" (3.00mm) | - | 0.213" (5.40mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Board Guide, Pick and Place | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK STR
|
封裝: - |
庫存6,264 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 7 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存5,580 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.615" (15.62mm) | 0.110" (2.79mm) | 0.825" (20.95mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存7,578 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 42 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.306" (7.77mm) | 0.350" (8.89mm) | 0.756" (19.20mm) | 0.100" (2.54mm) | Square | Tin | 100µin (2.54µm) | Tin | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存5,292 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 5 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.085" (2.16mm) | 0.415" (10.54mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
MINITEK
|
封裝: - |
庫存4,806 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Shrouded - 4 Wall | 34 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Latch Holder | 0.157" (4.00mm) | 0.098" (2.50mm) | - | 0.240" (6.10mm) | Square | Gold, GXT? | 8µin (0.20µm) | - | Copper Alloy | Liquid Crystal Polymer (LCP) | Keying Slot | - | - | UL94 V-0 | Cream |
||
Amphenol FCI |
BERGSTIK SMT
|
封裝: - |
庫存5,778 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.232" (5.90mm) | - | - | 0.100" (2.54mm) | Square | Gold, GXT? | 30µin (0.76µm) | Tin-Lead | Phosphor Bronze | Thermoplastic | Pick and Place | - | - | UL94 V-0 | Black |
||
Samtec Inc. |
CONN HEADER 4POS DL 1MM R/A SMD
|
封裝: - |
庫存3,528 |
|
Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 4 | All | 2 | 0.039" (1.00mm) | Surface Mount, Right Angle | Solder | - | 0.065" (1.65mm) | - | - | 0.125" (3.18mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
TE Connectivity AMP Connectors |
CONN HEADER 86POS R/A TIN
|
封裝: - |
庫存6,498 |
|
Tab | - | Board to Cable/Wire | Shrouded - 4 Wall | 86 | All | 3 | - | Through Hole, Right Angle | Solder | Latch Holder | 0.280" (7.11mm) | 0.157" (4.00mm) | - | 0.886" (22.50mm) | Rectangular | Tin | - | Tin | Copper Alloy | Polybutylene Terephthalate (PBT) | Mounting Flange | -30°C ~ 105°C | - | - | Natural |
||
Samtec Inc. |
.100 X .100 EJECTOR HEADER ASSEM
|
封裝: - |
庫存8,280 |
|
Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 50 | 49 | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.225" (5.72mm) | - | - | 0.500" (12.70mm) | Square | Gold | - | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Lock, Keying Slot | -55°C ~ 125°C | - | - | Black |
||
Samtec Inc. |
.050'' X .050 TERMINAL STRIP
|
封裝: - |
庫存4,446 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
Samtec Inc. |
.050 X .050 C.L. LOW PROFILE TER
|
封裝: - |
庫存5,148 |
|
Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 96 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | - | 0.120" (3.05mm) | - | - | 0.034" (0.86mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Pick and Place | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
.8MM MICRO TERMINAL STRIP
|
封裝: - |
庫存2,304 |
|
Male Pin | 0.031" (0.80mm) | Board to Board | Unshrouded | 50 | All | 2 | 0.047" (1.20mm) | Surface Mount | Solder | - | 0.075" (1.90mm) | - | - | 0.055" (1.40mm) | Square | Gold | 10µin (0.25µm) | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide, End Shrouds | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
1MM MICRO TERMINAL STRIPS
|
封裝: - |
庫存6,480 |
|
Male Pin | 0.039" (1.00mm) | Board to Board | Unshrouded | 50 | All | 2 | 0.039" (1.00mm) | Surface Mount | Solder | - | 0.075" (1.90mm) | - | - | 0.059" (1.50mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide, End Shrouds, Pick and Place | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
.050 X .050 C.L. LOW PROFILE TER
|
封裝: - |
庫存8,010 |
|
Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Unshrouded | 52 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | - | 0.075" (1.90mm) | 0.090" (2.29mm) | 0.199" (5.05mm) | 0.034" (0.86mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide, End Shrouds | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
SMT .050'' STRIPS
|
封裝: - |
庫存2,754 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | - | 0.230" (5.84mm) | - | - | 0.100" (2.54mm) | Square | Gold | 10µin (0.25µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Guide | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
Samtec Inc. |
.050 EJECTOR HEADER ASSEMBLY
|
封裝: - |
庫存7,704 |
|
Male Pin | 0.050" (1.27mm) | Board to Cable/Wire | Shrouded - 4 Wall | 10 | 9 | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Lock/Eject Hooks | 0.120" (3.05mm) | - | - | 0.325" (8.25mm) | Square | Gold | 3µin (0.08µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP), Glass Filled | Keying Slot, Pick and Place | -55°C ~ 125°C | - | - | Black |
||
TE Connectivity AMP Connectors |
CONN HEADR BRKWAY .100 23POS STR
|
封裝: - |
庫存3,348 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 23 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.318" (8.08mm) | 0.125" (3.18mm) | 0.533" (13.55mm) | 0.090" (2.29mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Thermoplastic | - | -65°C ~ 105°C | - | UL94 V-0 | Black |
||
Amphenol FCI |
BERGSTIK
|
封裝: - |
庫存8,514 |
|
Male Pin | 0.100" (2.54mm) | Board to Board or Cable | Unshrouded | 60 | All | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | 0.260" (6.60mm) | 0.104" (2.65mm) | 0.465" (11.81mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | Tin | Phosphor Bronze | Thermoplastic | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
CONN HEADER 18PS .100 DL R/A TIN
|
封裝: - |
庫存7,542 |
|
Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 2 Wall | 18 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Friction Lock | 0.197" (5.00mm) | 0.154" (3.91mm) | - | 0.307" (7.80mm) | Square | Tin | 78.7µin (2.00µm) | Tin | Phosphor Bronze | Polyester, Glass Filled | - | - | - | UL94 V-0 | Blue |
||
Amphenol FCI |
CONN HEADER 20PS .100 SMD GOLD
|
封裝: - |
庫存8,694 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 20 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.230" (5.84mm) | - | - | 0.084" (2.14mm) | Square | Gold, GXT? | 30µin (0.76µm) | Tin | Phosphor Bronze | Thermoplastic | Board Guide | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BERGSTIK
|
封裝: - |
庫存2,754 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.232" (5.90mm) | - | - | 0.100" (2.54mm) | Square | Tin | 78.7µin (2.00µm) | Tin | Phosphor Bronze | Thermoplastic | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BERGSTIK
|
封裝: - |
庫存7,650 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | - | 0.190" (4.83mm) | Square | Tin | 78.7µin (2.00µm) | Tin | Phosphor Bronze | Thermoplastic | - | - | - | UL94 V-0 | Black |
||
Samtec Inc. |
CONN HEADER 80POS DUAL .05"
|
封裝: - |
庫存5,958 |
|
Male Pin | 0.050" (1.27mm) | Board to Board or Cable | Shrouded - 4 Wall | 80 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | - | 0.139" (3.53mm) | 0.080" (2.03mm) | - | 0.290" (7.37mm) | Square | Gold | 30µin (0.76µm) | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Board Lock | -55°C ~ 125°C | - | UL94 V-0 | Black |
||
TE Connectivity AMP Connectors |
CONN HDR 6POS R/A KEY-XX TIN
|
封裝: - |
庫存15,840 |
|
Tab | 0.150" (3.81mm) | Board to Board or Cable | Shrouded - 4 Wall | 6 | All | 2 | 0.300" (7.62mm) | Through Hole, Right Angle | Solder | Detent Lock | - | 0.131" (3.33mm) | - | 0.668" (16.97mm) | Rectangular | Tin | 78.7µin (2.00µm) | Tin | Copper Alloy | Thermoplastic, Polyester, Glass Filled | Board Lock | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
TE Connectivity AMP Connectors |
CONN HEADER PIN 36POS VERT TIN
|
封裝: - |
庫存16,344 |
|
Male Pin | 0.197" (5.00mm) | Board to Board or Cable | Shrouded - 4 Wall | 36 | All | 4 | 0.197" (5.00mm) | Through Hole | Solder | Latch Lock | - | 0.181" (4.60mm) | - | 0.464" (11.79mm) | Circular | Tin | 150µin (3.81µm) | Tin | Brass | Polyamide (PA), Nylon | Mounting Flange | -55°C ~ 130°C | - | UL94 V-0 | Red |
||
Molex, LLC |
MICROFIT 3.0 SR RA SMT GOLD 4CKT
|
封裝: - |
庫存21,846 |
|
Male Pin | 0.118" (3.00mm) | Board to Cable/Wire | Shrouded - 4 Wall | 4 | All | 1 | - | Surface Mount, Right Angle | Solder | Locking Ramp | - | - | - | 0.172" (4.37mm) | Square | Gold | 30µin (0.76µm) | Tin | Brass | Liquid Crystal Polymer (LCP), Glass Filled | Solder Retention | - | - | UL94 V-0 | Black |
||
JST Sales America Inc. |
CONN HEADER VERT SMD 8POS ZE
|
封裝: - |
庫存29,208 |
|
Outer Shroud Contact | 0.059" (1.50mm) | Board to Cable/Wire | Shrouded - 4 Wall | 8 | All | 1 | - | Surface Mount | Solder | Locking Ramp | - | - | - | 0.295" (7.50mm) | Rectangular | Tin | - | Tin | Copper Alloy | Polyamide (PA), Nylon | Pick and Place, Solder Retention | -25°C ~ 85°C | - | UL94 V-0 | Natural |