圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Harwin Inc. |
CONN FPC BOTTOM 45POS 0.50MM R/A
|
封裝: - |
庫存5,526 |
|
Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Tapered | Copper Alloy | Tin | Thermoplastic | Thermoplastic | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC TOP 6POS 1.00MM R/A
|
封裝: - |
庫存7,074 |
|
Through Hole, Right Angle | Contacts, Top | 6 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.118" (3.00mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA66), Nylon 6/6 | Polyester | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
TE Connectivity AMP Connectors |
CONN FPC BOTTOM 45POS 0.30MM R/A
|
封裝: - |
庫存8,892 |
|
Surface Mount, Right Angle | Contacts, Bottom | 45 | 0.012" (0.30mm) | Solder | 0.20mm | 0.039" (1.00mm) | Flip Lock | Tapered | Copper Alloy | Gold | Thermoplastic | Thermoplastic | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | - |
||
Amphenol FCI |
CONN FFC BOTTOM 17POS 1.00MM R/A
|
封裝: - |
庫存6,030 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.039" (1.00mm) | Solder | 0.30mm, 0.33mm | 0.106" (2.70mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Alloy | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | - | - | UL94 V-0 |
||
JST Sales America Inc. |
CONN FFC TOP 22POS 1.00MM R/A
|
封裝: - |
庫存8,028 |
|
Surface Mount, Right Angle | Contacts, Top | 22 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | - | Straight | Phosphor Bronze | Tin | Polyamide (PA6T), Nylon 6T | - | Low Insertion Force (LIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
JST Sales America Inc. |
CONN FFC TOP 6POS 1.00MM R/A
|
封裝: - |
庫存14,652 |
|
Surface Mount, Right Angle | Contacts, Top | 6 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | - | Straight | Phosphor Bronze | Tin | Polyamide (PA6T), Nylon 6T | - | Low Insertion Force (LIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
JST Sales America Inc. |
CONN FFC VERT 11POS 1.00MM SMD
|
封裝: - |
庫存3,222 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 11 | 0.039" (1.00mm) | Solder | 0.30mm | 0.201" (5.10mm) | - | Straight | Phosphor Bronze | Tin | Polyamide (PA6T), Nylon 6T | - | Low Insertion Force (LIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Amphenol FCI |
CONN FPC BOTTOM 6POS 0.50MM R/A
|
封裝: - |
庫存6,192 |
|
Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.020" (0.50mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock, Backlock | Notched | Copper Alloy | Gold | Thermoplastic | Thermoplastic | Solder Retention, Zero Insertion Force (ZIF) | 50V | -55°C ~ 85°C | UL94 V-0 |
||
Amphenol FCI |
CONN FFC FPC TOP 4POS 0.50MM R/A
|
封裝: - |
庫存2,808 |
|
Surface Mount, Right Angle | Contacts, Top | 4 | 0.020" (0.50mm) | Solder | 0.30mm, 0.33mm | 0.071" (1.80mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -55°C ~ 105°C | UL94 V-0 |
||
Molex Connector Corporation |
CONN FFC VERT 11POS 1.25MM PCB
|
封裝: - |
庫存3,078 |
|
Through Hole | Contacts, Vertical, 1 Sided | 11 | 0.049" (1.25mm) | Solder | 0.30mm | 0.386" (9.80mm) | Slide Lock | Straight | Phosphor Bronze | Tin-Lead | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FFC FPC VERT 8POS 1MM PCB
|
封裝: - |
庫存4,590 |
|
Through Hole | Contacts, Vertical, 2 Sided | 8 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.228" (5.80mm) | - | Straight | Phosphor Bronze | Solder Plating | Polybutylene Terephthalate (PBT) | - | Low Insertion Force (LIF) | 50V | -30°C ~ 70°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC BOTTOM 57POS 0.30MM R/A
|
封裝: - |
庫存2,556 |
|
Surface Mount, Right Angle | Contacts, Bottom | 57 | 0.012" (0.30mm) | Solder | 0.20mm | 0.075" (1.90mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Low Insertion Force (LIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FPC VERT 80 POS 0.50MM SMD
|
封裝: - |
庫存7,056 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 80 (40 Loaded) | 0.020" (0.50mm) | Solder | 0.30mm | 0.228" (5.80mm) | Flip Lock | Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) | - | 50V | -40°C ~ 105°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FFC BOTTOM 28POS 0.50MM R/A
|
封裝: - |
庫存2,052 |
|
Surface Mount, Right Angle | Contacts, Bottom | 28 | 0.020" (0.50mm) | Solder | 0.30mm | 0.037" (0.95mm) | Flip Lock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Halogen Free | Liquid Crystal Polymer (LCP), Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -55°C ~ 85°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FPC 27POS 0.30MM R/A
|
封裝: - |
庫存4,842 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 27 | 0.012" (0.30mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock, Backlock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP) | Polyamide (PA), Nylon | - | 30V | -55°C ~ 85°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FPC TOP 31POS 0.30MM R/A
|
封裝: - |
庫存8,118 |
|
Surface Mount, Right Angle | Contacts, Top | 31 | 0.012" (0.30mm) | Solder | 0.12mm | 0.065" (1.65mm) | Flip Lock, Backlock | Notched | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Halogen Free | Polyamide (PA), Nylon | Zero Insertion Force (ZIF) | 30V | -55°C ~ 85°C | - |
||
Hirose Electric Co Ltd |
CONN FFC BOTTOM 30POS 1.00MM R/A
|
封裝: - |
庫存7,020 |
|
Surface Mount, Right Angle | Contacts, Bottom | 30 (15 Loaded) | 0.039" (1.00mm) | Solder | 0.30mm | 0.100" (2.54mm) | Rotary Lock | Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP), Halogen Free | - | - | - | UL94 V-0 |
||
Molex, LLC |
CONN FPC 41POS .3MM SMD R/A
|
封裝: - |
庫存2,790 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 41 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 16POS 0.50MM SMD
|
封裝: - |
庫存2,376 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 16 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Amphenol FCI |
CONN FPC BOTTOM 13POS 1.00MM R/A
|
封裝: - |
庫存7,830 |
|
Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.039" (1.00mm) | Solder | 0.33mm | 0.106" (2.70mm) | Slide Lock | Notched | Phosphor Bronze | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 100V | -55°C ~ 105°C | UL94 V-0 |
||
TE Connectivity AMP Connectors |
CONN FFC FPC TOP 2POS 2.54MM R/A
|
封裝: - |
庫存4,464 |
|
Through Hole, Right Angle | Contacts, Top | 2 | 0.100" (2.54mm) | Solder | 0.13mm ~ 0.38mm | 0.190" (4.83mm) | - | - | Phosphor Bronze | Tin | Polyester Thermoplastic, Glass Filled | - | - | 250V | -55°C ~ 105°C | UL94 V-0 |
||
Amphenol FCI |
CONN FFC BOTTOM 13POS 0.50MM R/A
|
封裝: - |
庫存3,366 |
|
Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.020" (0.50mm) | Solder | 0.30mm, 0.33mm | 0.071" (1.80mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled, Halogen Free | Polyphenylene Sulfide (PPS), Glass Filled, Halogen Free | Solder Retention, Zero Insertion Force (ZIF) | 50V | -55°C ~ 105°C | UL94 V-0 |
||
Amphenol FCI |
CONN FPC BOTTOM 23POS 0.30MM R/A
|
封裝: - |
庫存2,052 |
|
Surface Mount, Right Angle | Contacts, Bottom | 23 | 0.012" (0.30mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock | Notched | Copper Alloy | Gold | Thermoplastic, Halogen Free | Thermoplastic | Solder Retention, Zero Insertion Force (ZIF) | 30V | -55°C ~ 85°C | UL94 V-0 |
||
Amphenol FCI |
CONN FFC FPC VERT 13POS 1MM PCB
|
封裝: - |
庫存8,064 |
|
Through Hole | Contacts, Vertical, 1 Sided | 13 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.232" (5.90mm) | - | Straight or Tapered | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | - | 100V | -55°C ~ 85°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FFC BOTTOM 15POS 0.50MM R/A
|
封裝: - |
庫存6,426 |
|
Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight | Phosphor Bronze | Gold | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Samtec Inc. |
CONN FFC BOTTOM 40POS 0.50MM R/A
|
封裝: - |
庫存9,312 |
|
Surface Mount, Right Angle | Contacts, Bottom | 40 | 0.020" (0.50mm) | Solder | - | 0.079" (2.00mm) | Slide Lock | - | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) | Solder Retention, Zero Insertion Force (ZIF) | - | -55°C ~ 105°C | - |
||
Molex, LLC |
CONN FFC VERT 12POS 0.50MM SMD
|
封裝: - |
庫存6,030 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.154" (3.90mm) | Slide Lock | Straight, Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC BOTTOM 12POS 0.50MM R/A
|
封裝: - |
庫存28,170 |
|
Surface Mount, Right Angle | Contacts, Bottom | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |