圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Molex, LLC |
CONN FFC VERT 36POS 1.25MM PCB
|
封裝: - |
庫存8,424 |
|
Through Hole | Contacts, Vertical, 1 Sided | 36 | 0.049" (1.25mm) | Solder | 0.30mm | 0.295" (7.50mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
||
Amphenol FCI |
CONN CIC TOP 21POS 1.00MM R/A
|
封裝: - |
庫存7,650 |
|
Through Hole, Right Angle | Contacts, Top | 21 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.154" (3.90mm) | - | Tapered | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | - | 100V | -55°C ~ 85°C | UL94 V-0 |
||
Harwin Inc. |
CONN FPC BOTTOM 20POS 0.50MM R/A
|
封裝: - |
庫存4,536 |
|
Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Tapered | Copper Alloy | Tin | Thermoplastic | Thermoplastic | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC BOTTOM 17POS 0.30MM R/A
|
封裝: - |
庫存8,676 |
|
Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.012" (0.30mm) | Solder | 0.20mm | 0.041" (1.05mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA46), Nylon 4/6 | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Amphenol FCI |
CONN FPC TOP 20POS 0.50MM R/A
|
封裝: - |
庫存2,736 |
|
Surface Mount, Right Angle | Contacts, Top | 20 | 0.020" (0.50mm) | Solder | 0.33mm | 0.071" (1.80mm) | Slide Lock | Notched | Phosphor Bronze | Tin Alloy | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -55°C ~ 105°C | UL94 V-0 |
||
Amphenol FCI |
CONN FFC FPC RCPT 31POS 2.54MM
|
封裝: - |
庫存7,164 |
|
Free Hanging (In-Line) | Receptacle | 31 | 0.100" (2.54mm) | IDC | 0.33mm | - | Latch Lock | - | Copper Nickel Alloy | Tin | Thermoplastic | - | - | 500V | -65°C ~ 105°C | UL94 V-0 |
||
JST Sales America Inc. |
CONN FFC TOP 5POS 1.00MM R/A
|
封裝: - |
庫存2,052 |
|
Surface Mount, Right Angle | Contacts, Top | 5 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | - | Straight | Phosphor Bronze | Tin | Polyamide (PA6T), Nylon 6T | - | Low Insertion Force (LIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
JST Sales America Inc. |
CONN FFC VERT 18POS 1.00MM SMD
|
封裝: - |
庫存5,076 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 18 | 0.039" (1.00mm) | Solder | 0.30mm | 0.201" (5.10mm) | - | Straight | Phosphor Bronze | Tin | Polyamide (PA6T), Nylon 6T | - | Low Insertion Force (LIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
JAE Electronics |
CONN FPC VERT 20POS 0.50MM SMD
|
封裝: - |
庫存4,824 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.154" (3.90mm) | Slide Lock | Tapered | Copper Alloy | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Molex Connector Corporation |
CONN FFC BOTTOM 15POS 0.50MM R/A
|
封裝: - |
庫存5,652 |
|
Surface Mount, Right Angle | Contacts, Bottom | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FPC BOTTOM 21POS 0.30MM R/A
|
封裝: - |
庫存8,352 |
|
Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.012" (0.30mm) | Solder | 0.20mm | 0.071" (1.80mm) | Flip Lock | Tapered | Phosphor Bronze | Tin-Lead | Liquid Crystal Polymer (LCP) | - | Low Insertion Force (LIF), Zero Insertion Force (ZIF) | 30V | -40°C ~ 85°C | UL94 V-0 |
||
Molex Connector Corporation |
CONN FFC CIC RCPT 12POS 2.54MM
|
封裝: - |
庫存4,230 |
|
Free Hanging (In-Line) | Receptacle | 12 | 0.100" (2.54mm) | IDC | 0.13-0.28mm, 0.30mm | - | Latch Lock | Straight | Phosphor Bronze | Gold | Polyester, Glass Filled | - | - | 250V | -40°C ~ 105°C | UL94 V-0 |
||
Omron Electronics Inc-EMC Div |
CONN FPC 6POS 0.50MM R/A
|
封裝: - |
庫存5,058 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 6 | 0.020" (0.50mm) | Solder | 0.30mm | 0.083" (2.10mm) | Rotary Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Halogen Free | Liquid Crystal Polymer (LCP), Halogen Free | - | 50V | -30°C ~ 85°C | UL94 V-0 |
||
Samtec Inc. |
1MM SINGLE ROW CONNECTOR
|
封裝: - |
庫存8,424 |
|
Surface Mount | Contacts, Vertical, 2 Sided | 14 | 0.039" (1.00mm) | Solder | 0.30mm | 0.204" (5.18mm) | - | - | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP) | - | Low Insertion Force (LIF), Solder Retention | - | -55°C ~ 105°C | - |
||
Molex Connector Corporation |
CONN FPC BOTTOM 41POS 0.30MM R/A
|
封裝: - |
庫存8,514 |
|
Surface Mount, Right Angle | Contacts, Bottom | 41 | 0.012" (0.30mm) | Solder | 0.20mm | - | Flip Lock | Tapered | Copper Alloy | Gold | Polymer, Glass Filled | Polymer, Glass Filled | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
||
Panasonic Electric Works |
CONN FPC 25POS 0.30MM R/A
|
封裝: - |
庫存7,704 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 25 | 0.012" (0.30mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) | - | 50V | -55°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FFC VERT 18POS 0.50MM SMD
|
封裝: - |
庫存2,880 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
JST Sales America Inc. |
CONN FPC BOTTOM 10POS 0.50MM R/A
|
封裝: - |
庫存5,130 |
|
Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.051" (1.30mm) | Flip Lock | Tabbed or Tapered | Copper Alloy | Gold | Plastic | Plastic | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FFC BOTTOM 12POS 0.50MM R/A
|
封裝: - |
庫存5,562 |
|
Surface Mount, Right Angle | Contacts, Bottom | 12 | 0.020" (0.50mm) | Solder | 0.20mm | 0.036" (0.90mm) | Flip Lock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Halogen Free | Liquid Crystal Polymer (LCP), Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -55°C ~ 85°C | UL94 V-0 |
||
Amphenol FCI |
CONN FFC BOTTOM 60POS 0.50MM R/A
|
封裝: - |
庫存5,274 |
|
Surface Mount, Right Angle | Contacts, Bottom | 60 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Notched, Tapered | Copper Alloy | Gold | Thermoplastic | Thermoplastic | Zero Insertion Force (ZIF) | 50V | -55°C ~ 85°C | UL94 V-0 |
||
Molex, LLC |
CONN FPC 7POS .3MM SMD R/A
|
封裝: - |
庫存5,634 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 7 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Amphenol FCI |
CONN FFC FPC TOP 25POS 1MM R/A
|
封裝: - |
庫存8,856 |
|
Surface Mount, Right Angle | Contacts, Top | 25 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | - | Straight or Tapered | Phosphor Bronze | Tin | Polyamide (PA6T), Nylon 6T, Glass Filled | - | - | 100V | -55°C ~ 105°C | UL94 V-0 |
||
Molex, LLC |
1.0 FPC ZIF BTM CONT EMBT PKG 8C
|
封裝: - |
庫存3,186 |
|
Surface Mount, Right Angle | Contacts, Bottom | 8 | 0.039" (1.00mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Straight, Tabbed | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | - | -40°C ~ 85°C | UL94 V-0 |
||
Hirose Electric Co Ltd |
CONN FPC BOTTOM 33POS 0.30MM R/A
|
封裝: - |
庫存8,730 |
|
Surface Mount, Right Angle | Contacts, Bottom | 33 | 0.012" (0.30mm) | Solder | 0.20mm | 0.039" (1.00mm) | Flip Lock | Tabbed | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Halogen Free | Polyamide (PA), Nylon | Zero Insertion Force (ZIF) | 30V | -55°C ~ 85°C | UL94 HB |
||
Molex, LLC |
CONN FFC BOTTOM 22POS 0.50MM R/A
|
封裝: - |
庫存7,578 |
|
Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
||
Omron Electronics Inc-EMC Div |
CONN FPC 14POS 0.50MM R/A
|
封裝: - |
庫存17,880 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 14 | 0.020" (0.50mm) | Solder | 0.30mm | 0.083" (2.10mm) | Rotary Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Halogen Free | Liquid Crystal Polymer (LCP), Halogen Free | - | 50V | -30°C ~ 85°C | UL94 V-0 |
||
TE Connectivity AMP Connectors |
CONN FPC VERT 5POS 1.00MM SMD
|
封裝: - |
庫存26,712 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 5 | 0.039" (1.00mm) | Solder | 0.30mm | 0.217" (5.50mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA9T), Nylon 9T | Polyamide (PA9T), Nylon 9T | Zero Insertion Force (ZIF) | 125V | -20°C ~ 85°C | UL94 V-0 |
||
Amphenol FCI |
CONN FPC BOTTOM 50POS 0.50MM R/A
|
封裝: - |
庫存19,152 |
|
Surface Mount, Right Angle | Contacts, Bottom | 50 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA9T), Nylon 9T, Glass Filled | Thermoplastic, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -55°C ~ 85°C | UL94 V-0 |