頁 65 - Aries Electronics 產品

零件編號	製造商	描述	封裝	庫存
257-PRS20013-12	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 125°C	封裝: -	庫存6,678
181-PRS15006-12	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 125°C	封裝: -	庫存3,546
48-6508-31	Aries Electronics	CONN IC DIP SOCKET 48POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	封裝: -	庫存8,280
28-6573-16	Aries Electronics	CONN IC DIP SOCKET ZIF 28POS TIN Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	封裝: -	庫存2,250
40-0508-31	Aries Electronics	CONN SOCKET SIP 40POS GOLD Type: SIP Number of Positions or Pins (Grid): 40 (1 x 40) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 125°C	封裝: -	庫存3,150
42-6571-10	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS TIN Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	封裝: -	庫存4,896
30-6820-90C	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 30 (2 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存4,176
16-C195-30	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存3,402
20-7906-10	Aries Electronics	CONN SOCKET SIP 20POS TIN Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,730
20-71056-10	Aries Electronics	CONN SOCKET SIP 20POS TIN Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,244
10-81250-210C	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存7,164
08-8240-310C	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,820
04-71000-10	Aries Electronics	CONN SOCKET SIP 4POS TIN Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存3,744
02-7425-10	Aries Electronics	CONN SOCKET SIP 2POS TIN Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存4,860
20-3513-11	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存7,542
08-2503-20	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存7,218
24-0518-10H	Aries Electronics	CONN SOCKET SIP 24POS GOLD Type: SIP Number of Positions or Pins (Grid): 24 (1 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存6,696
15-0518-11	Aries Electronics	CONN SOCKET SIP 15POS GOLD Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存2,790
24-6518-10T	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存5,526
06-3518-00	Aries Electronics	CONN IC DIP SOCKET 6POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 6 (2 x 3) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存3,204
04-0518-11	Aries Electronics	CONN SOCKET SIP 4POS GOLD Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存6,192
80-PGM15059-10	Aries Electronics	CONN SOCKET PGA GOLD Type: PGA Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,946
24-6518-10	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存13,092
32-537-20	Aries Electronics	CONN SCKT INSERT PLATE FOR PLCC Accessory Type: Insert Plate For Use With/Related Products: PLCC Sockets Number of Pins: 32 Body Material: Polyphenylene Sulfide (PPS), Glass Filled Body Finish: - Color: Black Features: -	封裝: -	庫存8,874
38-3625-51	Aries Electronics	625 DIP HDR SCRW MACH CONTACT Connector Type: DIP, DIL - Header Contact Type: Forked Number of Positions: 38 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.300" (7.62mm) Mounting Type: Through Hole Termination: Wire Wrap Features: - Contact Finish: Gold Contact Finish Thickness: 10µin (0.25µm) Color: Black	封裝: -	庫存6,858
24-6625-51	Aries Electronics	625 DIP HDR SCRW MACH CONTACT Connector Type: DIP, DIL - Header Contact Type: Forked Number of Positions: 24 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.600" (15.24mm) Mounting Type: Through Hole Termination: Wire Wrap Features: - Contact Finish: Gold Contact Finish Thickness: 10µin (0.25µm) Color: Black	封裝: -	庫存5,256
19-0625-51	Aries Electronics	0625 PIN-LINE HDR SCRW MACH CONT Connector Type: Header Strip Contact Type: Forked Number of Positions: 19 Pitch: 0.100" (2.54mm) Number of Rows: 1 Row Spacing: - Mounting Type: Through Hole Termination: Wire Wrap Features: - Contact Finish: Gold Contact Finish Thickness: 10µin (0.25µm) Color: Black	封裝: -	庫存3,600
16-675-191	Aries Electronics	675 DIP PROGRAM HEADER Connector Type: Header Contact Type: Male Pin Number of Positions: 16 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.300" (7.62mm) Mounting Type: Through Hole Termination: Solder Features: Programmable Contact Finish: Gold Contact Finish Thickness: - Color: Black	封裝: -	庫存7,296

257-PRS20013-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存6,678

181-PRS15006-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存3,546

48-6508-31

Aries Electronics

CONN IC DIP SOCKET 48POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,280

28-6573-16

Aries Electronics

CONN IC DIP SOCKET ZIF 28POS TIN

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存2,250

40-0508-31

Aries Electronics

CONN SOCKET SIP 40POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 40 (1 x 40)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,150

42-6571-10

Aries Electronics

CONN IC DIP SOCKET ZIF 42POS TIN

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存4,896

30-6820-90C

Aries Electronics

CONN IC DIP SOCKET 30POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 30 (2 x 15)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存4,176

16-C195-30

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存3,402

20-7906-10

Aries Electronics

CONN SOCKET SIP 20POS TIN

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,730

20-71056-10

Aries Electronics

CONN SOCKET SIP 20POS TIN

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,244

10-81250-210C

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存7,164

08-8240-310C

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,820

04-71000-10

Aries Electronics

CONN SOCKET SIP 4POS TIN

Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存3,744

02-7425-10

Aries Electronics

CONN SOCKET SIP 2POS TIN

Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存4,860

20-3513-11

Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存7,542

08-2503-20

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存7,218

24-0518-10H

Aries Electronics

CONN SOCKET SIP 24POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存6,696

15-0518-11

Aries Electronics

CONN SOCKET SIP 15POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存2,790

24-6518-10T

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存5,526

06-3518-00

Aries Electronics

CONN IC DIP SOCKET 6POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存3,204

04-0518-11

Aries Electronics

CONN SOCKET SIP 4POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存6,192

80-PGM15059-10

Aries Electronics

CONN SOCKET PGA GOLD

Type: PGA
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,946

24-6518-10

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存13,092

32-537-20

Aries Electronics

CONN SCKT INSERT PLATE FOR PLCC

Accessory Type: Insert Plate
For Use With/Related Products: PLCC Sockets
Number of Pins: 32
Body Material: Polyphenylene Sulfide (PPS), Glass Filled
Body Finish: -
Color: Black
Features: -

封裝: -

庫存8,874

38-3625-51

Aries Electronics

625 DIP HDR SCRW MACH CONTACT

Connector Type: DIP, DIL - Header
Contact Type: Forked
Number of Positions: 38
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.300" (7.62mm)
Mounting Type: Through Hole
Termination: Wire Wrap
Features: -
Contact Finish: Gold
Contact Finish Thickness: 10µin (0.25µm)
Color: Black

封裝: -

庫存6,858

24-6625-51

Aries Electronics

625 DIP HDR SCRW MACH CONTACT

Connector Type: DIP, DIL - Header
Contact Type: Forked
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.600" (15.24mm)
Mounting Type: Through Hole
Termination: Wire Wrap
Features: -
Contact Finish: Gold
Contact Finish Thickness: 10µin (0.25µm)
Color: Black

封裝: -

庫存5,256

19-0625-51

Aries Electronics

0625 PIN-LINE HDR SCRW MACH CONT

Connector Type: Header Strip
Contact Type: Forked
Number of Positions: 19
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Mounting Type: Through Hole
Termination: Wire Wrap
Features: -
Contact Finish: Gold
Contact Finish Thickness: 10µin (0.25µm)
Color: Black

封裝: -

庫存3,600

16-675-191

Aries Electronics

675 DIP PROGRAM HEADER

Connector Type: Header
Contact Type: Male Pin
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.300" (7.62mm)
Mounting Type: Through Hole
Termination: Solder
Features: Programmable
Contact Finish: Gold
Contact Finish Thickness: -
Color: Black

封裝: -

庫存7,296