頁 184 - Aries Electronics 產品

零件編號	製造商	描述	封裝	庫存
257-PRS20018-12	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 125°C	封裝: -	庫存3,490
42-6551-18	Aries Electronics	CONN IC DIP SOCKET ZIF 42POS Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 42 (2 x 21) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50µin (1.27µm) Contact Material - Mating: Beryllium Nickel Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Beryllium Nickel Housing Material: Polyetheretherketone (PEEK), Glass Filled Operating Temperature: -55°C ~ 250°C	封裝: -	庫存4,194
69-PLS11031-12	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 125°C	封裝: -	庫存4,842
66-PRS11054-12	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 125°C	封裝: -	庫存8,514
84-PGM11010-11H	Aries Electronics	CONN SOCKET PGA GOLD Type: PGA Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	封裝: -	庫存5,814
132-PGM14016-10	Aries Electronics	CONN SOCKET PGA GOLD Type: PGA Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存7,758
29-71250-10	Aries Electronics	CONN SOCKET SIP 29POS TIN Type: SIP Number of Positions or Pins (Grid): 29 (1 x 29) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存3,744
32-6508-202	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,532
18-81000-310C	Aries Electronics	CONN IC DIP SOCKET 18POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,100
16-0501-20	Aries Electronics	CONN SOCKET SIP 16POS TIN Type: SIP Number of Positions or Pins (Grid): 16 (1 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存4,788
26-0508-30	Aries Electronics	CONN SOCKET SIP 26POS GOLD Type: SIP Number of Positions or Pins (Grid): 26 (1 x 26) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6 Operating Temperature: -55°C ~ 105°C	封裝: -	庫存3,528
11-7400-10	Aries Electronics	CONN SOCKET SIP 11POS TIN Type: SIP Number of Positions or Pins (Grid): 11 (1 x 11) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,514
24-4518-11	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.4" (10.16mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存6,768
08-822-90C	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存7,020
14-81187-10	Aries Electronics	CONN IC DIP SOCKET 14POS TIN Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存6,408
14-0518-11	Aries Electronics	CONN SOCKET SIP 14POS GOLD Type: SIP Number of Positions or Pins (Grid): 14 (1 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存4,752
17-0518-10T	Aries Electronics	CONN SOCKET SIP 17POS GOLD Type: SIP Number of Positions or Pins (Grid): 17 (1 x 17) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存3,348
24-3518-10T	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存8,118
08-0513-10H	Aries Electronics	CONN SOCKET SIP 8POS GOLD Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存3,222
10-2513-10T	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD Type: DIP, 0.2" (5.08mm) Row Spacing Number of Positions or Pins (Grid): 10 (2 x 5) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存4,302
32-653000-11-RC	Aries Electronics	SOCKET ADAPTER PLCC TO 32DIP 0.6 Convert From (Adapter End): PLCC Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing Number of Pins: 32 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,668
08-350000-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 8DIP 0.3 Convert From (Adapter End): SOIC Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 8 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: Polyimide (PI)	封裝: -	庫存4,050
LM-40-10	Aries Electronics	SP200-SJ200 .040 SHRTNG PLG/JACK Type: - Gender: - Number of Positions or Pins (Grid): - Pitch: - Height: - Contact Finish: - Contact Finish Thickness: - Color: -	封裝: -	庫存4,806
10-6625-51	Aries Electronics	625 DIP HDR SCRW MACH CONTACT Connector Type: DIP, DIL - Header Contact Type: Forked Number of Positions: 10 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.600" (15.24mm) Mounting Type: Through Hole Termination: Wire Wrap Features: - Contact Finish: Gold Contact Finish Thickness: 10µin (0.25µm) Color: Black	封裝: -	庫存5,922
28-8625-10	Aries Electronics	625 DIP HDR SCRW MACH CONTACT Connector Type: DIP, DIL - Header Contact Type: Forked Number of Positions: 28 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.800" (20.32mm) Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Tin Contact Finish Thickness: 200µin (5.08µm) Color: Black	封裝: -	庫存7,200
28-8625-70	Aries Electronics	625 DIP HDR SCRW MACH CONTACT Connector Type: DIP, DIL - Header Contact Type: Post Number of Positions: 28 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.800" (20.32mm) Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Tin Contact Finish Thickness: 200µin (5.08µm) Color: Black	封裝: -	庫存3,978
25-0600-21	Aries Electronics	0600 STRIP-LINE HDR COINED CNTCT Connector Type: DIP, DIL - Header Contact Type: Post Number of Positions: 25 Pitch: 0.100" (2.54mm) Number of Rows: 1 Row Spacing: - Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Gold Contact Finish Thickness: 10µin (0.25µm) Color: Black	封裝: -	庫存4,824
04-0600-11	Aries Electronics	0600 STRIP-LINE HDR COINED CNTCT Connector Type: DIP, DIL - Header Contact Type: Forked Number of Positions: 4 Pitch: 0.100" (2.54mm) Number of Rows: 1 Row Spacing: - Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Gold Contact Finish Thickness: 10µin (0.25µm) Color: Black	封裝: -	庫存4,860

257-PRS20018-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存3,490

42-6551-18

Aries Electronics

CONN IC DIP SOCKET ZIF 42POS

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存4,194

69-PLS11031-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存4,842

66-PRS11054-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存8,514

84-PGM11010-11H

Aries Electronics

CONN SOCKET PGA GOLD

Type: PGA
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,814

132-PGM14016-10

Aries Electronics

CONN SOCKET PGA GOLD

Type: PGA
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存7,758

29-71250-10

Aries Electronics

CONN SOCKET SIP 29POS TIN

Type: SIP
Number of Positions or Pins (Grid): 29 (1 x 29)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存3,744

32-6508-202

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,532

18-81000-310C

Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,100

16-0501-20

Aries Electronics

CONN SOCKET SIP 16POS TIN

Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存4,788

26-0508-30

Aries Electronics

CONN SOCKET SIP 26POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 26 (1 x 26)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存3,528

11-7400-10

Aries Electronics

CONN SOCKET SIP 11POS TIN

Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,514

24-4518-11

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存6,768

08-822-90C

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存7,020

14-81187-10

Aries Electronics

CONN IC DIP SOCKET 14POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存6,408

14-0518-11

Aries Electronics

CONN SOCKET SIP 14POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存4,752

17-0518-10T

Aries Electronics

CONN SOCKET SIP 17POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存3,348

24-3518-10T

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存8,118

08-0513-10H

Aries Electronics

CONN SOCKET SIP 8POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存3,222

10-2513-10T

Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存4,302

32-653000-11-RC

Aries Electronics

SOCKET ADAPTER PLCC TO 32DIP 0.6

Convert From (Adapter End): PLCC
Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
Number of Pins: 32
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,668

08-350000-11-RC-P

Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

Convert From (Adapter End): SOIC
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 8
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: Polyimide (PI)

封裝: -

庫存4,050

LM-40-10

Aries Electronics

SP200-SJ200 .040 SHRTNG PLG/JACK

Type: -
Gender: -
Number of Positions or Pins (Grid): -
Pitch: -
Height: -
Contact Finish: -
Contact Finish Thickness: -
Color: -

封裝: -

庫存4,806

10-6625-51

Aries Electronics

625 DIP HDR SCRW MACH CONTACT

Connector Type: DIP, DIL - Header
Contact Type: Forked
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.600" (15.24mm)
Mounting Type: Through Hole
Termination: Wire Wrap
Features: -
Contact Finish: Gold
Contact Finish Thickness: 10µin (0.25µm)
Color: Black

封裝: -

庫存5,922

28-8625-10

Aries Electronics

625 DIP HDR SCRW MACH CONTACT

Connector Type: DIP, DIL - Header
Contact Type: Forked
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.800" (20.32mm)
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Tin
Contact Finish Thickness: 200µin (5.08µm)
Color: Black

封裝: -

庫存7,200

28-8625-70

Aries Electronics

625 DIP HDR SCRW MACH CONTACT

Connector Type: DIP, DIL - Header
Contact Type: Post
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.800" (20.32mm)
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Tin
Contact Finish Thickness: 200µin (5.08µm)
Color: Black

封裝: -

庫存3,978

25-0600-21

Aries Electronics

0600 STRIP-LINE HDR COINED CNTCT

Connector Type: DIP, DIL - Header
Contact Type: Post
Number of Positions: 25
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Gold
Contact Finish Thickness: 10µin (0.25µm)
Color: Black

封裝: -

庫存4,824

04-0600-11

Aries Electronics

0600 STRIP-LINE HDR COINED CNTCT

Connector Type: DIP, DIL - Header
Contact Type: Forked
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Gold
Contact Finish Thickness: 10µin (0.25µm)
Color: Black

封裝: -

庫存4,860