頁 21 - 3M 產品 - 背板連接器 - 專用 | 黑森爾電子
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3M 產品 - 背板連接器 - 專用

記錄 735
頁  21/27
圖片
零件編號
製造商
描述
封裝
庫存
數量
Connector Type
Connector Style
Number of Positions
Number of Positions Loaded
Pitch
Number of Rows
Number of Columns
Mounting Type
Termination
Contact Layout, Typical
Features
Contact Finish
Contact Finish Thickness
Color
HDC-R100-41P1-TG30
3M

CONN HEADER 100POS R/A 4ROW GOLD

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 100
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存4,212
Receptacle, Female Sockets
High Density (HDC, HDI, HPC)
100
All
0.100" (2.54mm)
4
-
Through Hole
Press-Fit
-
-
Gold
30µin (0.76µm)
Black
HDC-P180-41S1-TG30
3M

CONN HEADER 180POS R/A 4ROW GOLD

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 180
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存5,850
Header, Male Pins
High Density (HDC, HDI, HPC)
180
All
0.100" (2.54mm)
4
-
Board Edge, Through Hole, Right Angle
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-P128-41S1-TG30
3M

CONN HEADER 128POS R/A 4ROW GOLD

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 128
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存3,996
Header, Male Pins
High Density (HDC, HDI, HPC)
128
All
0.100" (2.54mm)
4
-
Board Edge, Through Hole, Right Angle
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-H348-32S1-TG30
3M

CONN HEADER 348POS 3ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 348
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 3
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存2,646
Header, Male Pins
High Density (HDC, HDI, HPC)
348
All
0.100" (2.54mm)
3
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-H300-41P2-TG15
3M

CONN HEADER 300POS 4ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 300
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: -
  • Color: Black
封裝: -
庫存4,932
Header, Male Pins
High Density (HDC, HDI, HPC)
300
All
0.100" (2.54mm)
4
-
Through Hole
Press-Fit
-
-
Gold
-
Black
HDC-H180-41S1-TR
3M

CONN HEADER 180POS 4ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 180
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存7,668
Header, Male Pins
High Density (HDC, HDI, HPC)
180
All
0.100" (2.54mm)
4
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-H165-31S1-TR
3M

CONN HEADER 165POS 3ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 165
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 3
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,048
Header, Male Pins
High Density (HDC, HDI, HPC)
165
All
0.100" (2.54mm)
3
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-H165-31S1-TG30
3M

CONN HEADER 165POS 3ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 165
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 3
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存8,910
Header, Male Pins
High Density (HDC, HDI, HPC)
165
All
0.100" (2.54mm)
3
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-H160-41P2-GG30
3M

CONN HEADER 160POS 4ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 160
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存4,518
Header, Male Pins
High Density (HDC, HDI, HPC)
160
All
0.100" (2.54mm)
4
-
Through Hole
Press-Fit
-
-
Gold
30µin (0.76µm)
Black
HDC-H128-41S1-TG30
3M

CONN HEADER 128POS 4ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 128
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存7,830
Header, Male Pins
High Density (HDC, HDI, HPC)
128
All
0.100" (2.54mm)
4
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-H102-31P1-TG30
3M

CONN HEADER 102POS 3ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 102
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 3
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,030
Header, Male Pins
High Density (HDC, HDI, HPC)
102
All
0.100" (2.54mm)
3
-
Through Hole
Press-Fit
-
-
Gold
30µin (0.76µm)
Black
HDC-H080-41S1-TG30
3M

CONN HEADER 80POS 4ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 80
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存7,434
Header, Male Pins
High Density (HDC, HDI, HPC)
80
All
0.100" (2.54mm)
4
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-H080-41P1-TG30
3M

CONN HEADER 80POS 4ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 80
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存5,202
Header, Male Pins
High Density (HDC, HDI, HPC)
80
All
0.100" (2.54mm)
4
-
Through Hole
Press-Fit
-
-
Gold
30µin (0.76µm)
Black
HDC-H060-41S1-TG30
3M

CONN HEADER 60POS 4ROW VERT

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 60
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存4,680
Header, Male Pins
High Density (HDC, HDI, HPC)
60
All
0.100" (2.54mm)
4
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
MP2-SP08-41M2-TR30
3M

CONN PWR SKT 2-FB 8POS 4ROW R/A

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Blade Sockets
  • Connector Style: Blade Power
  • Number of Positions: 8
  • Number of Positions Loaded: All
  • Pitch: -
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Solder
  • Contact Layout, Typical: 8 Power
  • Features: Board Guide, Board Lock, Spacer
  • Contact Finish: Gold
  • Contact Finish Thickness: 3µin (0.08µm)
  • Color: Beige
封裝: -
庫存3,598
Receptacle, Female Blade Sockets
Blade Power
8
All
-
4
-
Board Edge, Through Hole, Right Angle
Solder
8 Power
Board Guide, Board Lock, Spacer
Gold
3µin (0.08µm)
Beige
MP2-HP10-5GP1-TR30
3M

CONN HEADER 2-FB 10POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Header, Male Blades
  • Connector Style: Blade Power
  • Number of Positions: 10
  • Number of Positions Loaded: All
  • Pitch: 0.236" (6.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: 10 Power
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Beige
封裝: -
庫存8,640
Header, Male Blades
Blade Power
10
All
0.236" (6.00mm)
5
-
Through Hole
Press-Fit
10 Power
-
Gold
30µin (0.76µm)
Beige
MP2-H060-51P1-S-TR30
3M

CONN HEADER 2-FB 60POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: Futurebus+?
  • Number of Positions: 60
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: Board Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 3µin (0.08µm)
  • Color: Beige
封裝: -
庫存6,102
Header, Male Pins
Futurebus+?
60
All
0.079" (2.00mm)
5
-
Through Hole
Press-Fit
-
Board Guide
Gold
3µin (0.08µm)
Beige
MP2-S060-51M1-C-TG
3M

CONN SOCKET 2-FB 60POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: Futurebus+?
  • Number of Positions: 60
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Board Guide, Board Lock, Spacer
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Beige
封裝: -
庫存8,208
Receptacle, Female Sockets
Futurebus+?
60
All
0.079" (2.00mm)
5
-
Board Edge, Through Hole, Right Angle
Solder
-
Board Guide, Board Lock, Spacer
Gold
30µin (0.76µm)
Beige
MP2-R090-51P1-TR30
3M

CONN INV SOCKET 2-FB 90POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: Futurebus+?
  • Number of Positions: 90
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: Inverse
  • Contact Finish: Gold
  • Contact Finish Thickness: 3µin (0.08µm)
  • Color: Beige
封裝: -
庫存3,562
Receptacle, Female Sockets
Futurebus+?
90
All
0.079" (2.00mm)
5
-
Through Hole
Press-Fit
-
Inverse
Gold
3µin (0.08µm)
Beige
MP2-SS090-51P1-TR30
3M

CONN SOCKET 2-FB 90POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: Futurebus+?
  • Number of Positions: 90
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: Board Guide, Cap, Spacer
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Beige
封裝: -
庫存4,662
Receptacle, Female Sockets
Futurebus+?
90
All
0.079" (2.00mm)
5
-
Board Edge, Through Hole, Right Angle
Press-Fit
-
Board Guide, Cap, Spacer
Gold
30µin (0.76µm)
Beige
HDC-H240-41S1-TG30
3M

CONN HEADER 240PS 4ROW VERT GOLD

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 240
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存4,356
Header, Male Pins
High Density (HDC, HDI, HPC)
240
All
0.100" (2.54mm)
4
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
HDC-R160-41P1-TG30
3M

CONN SOCKET 160POS 4ROW R/A GOLD

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 160
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存2,988
Receptacle, Female Sockets
High Density (HDC, HDI, HPC)
160
All
0.100" (2.54mm)
4
-
Through Hole
Press-Fit
-
-
Gold
30µin (0.76µm)
Black
MP2-S150G-51M2-C-TR30
3M

CONN SOCKET INVERSE 120POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: Futurebus+?
  • Number of Positions: 120
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Board Guide, Board Lock, Spacer
  • Contact Finish: Gold
  • Contact Finish Thickness: 3µin (0.08µm)
  • Color: Beige
封裝: -
庫存5,328
Receptacle, Female Sockets
Futurebus+?
120
All
0.079" (2.00mm)
5
-
Board Edge, Through Hole, Right Angle
Solder
-
Board Guide, Board Lock, Spacer
Gold
3µin (0.08µm)
Beige
MP2-SS240-51S1-TG30
3M

CONN SOCKET 2-FB 240POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: Futurebus+?
  • Number of Positions: 240
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Board Guide, Spacer
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Beige
封裝: -
庫存2,898
Receptacle, Female Sockets
Futurebus+?
240
All
0.079" (2.00mm)
5
-
Board Edge, Through Hole, Right Angle
Solder
-
Board Guide, Spacer
Gold
30µin (0.76µm)
Beige
HDC-H240-31S1-TG30
3M

CONN HEADER 240PS 3ROW VERT GOLD

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 240
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 3
  • Number of Columns: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: -
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存2,358
Header, Male Pins
High Density (HDC, HDI, HPC)
240
All
0.100" (2.54mm)
3
-
Through Hole
Solder
-
-
Gold
30µin (0.76µm)
Black
MP2-S240-51S1-C-TG30
3M

CONN SOCKET INVERSE 240POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: Futurebus+?
  • Number of Positions: 240
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Board Guide, Spacer
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Beige
封裝: -
庫存4,698
Receptacle, Female Sockets
Futurebus+?
240
All
0.079" (2.00mm)
5
-
Board Edge, Through Hole, Right Angle
Solder
-
Board Guide, Spacer
Gold
30µin (0.76µm)
Beige
MP2-P240-51M1-TG30
3M

CONN INV HEADER 2-FB 240POS 5ROW

  • Connector Usage: Backplane
  • Connector Type: Header, Male Pins
  • Connector Style: Futurebus+?
  • Number of Positions: 240
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Board Guide, Inverse
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Beige
封裝: -
庫存5,220
Header, Male Pins
Futurebus+?
240
All
0.079" (2.00mm)
5
-
Board Edge, Through Hole, Right Angle
Solder
-
Board Guide, Inverse
Gold
30µin (0.76µm)
Beige
MP2-S240G-51P1-TR30
3M

CONN SCKT 240PS GUIDE FINGR 5ROW

  • Connector Usage: Backplane
  • Connector Type: Receptacle, Female Sockets
  • Connector Style: Futurebus+?
  • Number of Positions: 240
  • Number of Positions Loaded: All
  • Pitch: 0.079" (2.00mm)
  • Number of Rows: 5
  • Number of Columns: -
  • Mounting Type: Board Edge, Through Hole, Right Angle
  • Termination: Press-Fit
  • Contact Layout, Typical: -
  • Features: Board Guide, Cap, Spacer
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Beige
封裝: -
庫存4,536
Receptacle, Female Sockets
Futurebus+?
240
All
0.079" (2.00mm)
5
-
Board Edge, Through Hole, Right Angle
Press-Fit
-
Board Guide, Cap, Spacer
Gold
30µin (0.76µm)
Beige