圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
3M |
CONN HEADER 2MM 26PS DL R/A 15AU
|
封裝: - |
庫存2,016 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 26 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 26PS DL R/A 30AU
|
封裝: - |
庫存8,316 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 26 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 26PS DL SMD 15AU
|
封裝: - |
庫存8,208 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 26 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 24PS DL T/H 30AU
|
封裝: - |
庫存6,354 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 24 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.130" (3.30mm) | 0.118" (3.00mm) | 0.307" (7.80mm) | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 24PS DL R/A 15AU
|
封裝: - |
庫存7,776 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 24 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 24PS DL SMD 30AU
|
封裝: - |
庫存2,430 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 22PS DL T/H 30AU
|
封裝: - |
庫存7,830 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 22 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | 0.329" (8.36mm) | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 22PS DL SMD 15AU
|
封裝: - |
庫存3,204 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 20PS DL T/H 15AU
|
封裝: - |
庫存2,610 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 20 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | 0.329" (8.36mm) | 0.060" (1.52mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 20PS DL T/H 30AU
|
封裝: - |
庫存2,322 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 20 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.130" (3.30mm) | 0.118" (3.00mm) | 0.307" (7.80mm) | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 20PS DL R/A 15AU
|
封裝: - |
庫存4,968 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 20 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 20PS DL SMD 15AU
|
封裝: - |
庫存2,988 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 20 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 20PS DL SMD 30AU
|
封裝: - |
庫存3,780 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 20 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 18PS DL R/A 30AU
|
封裝: - |
庫存8,964 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 18 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 18PS DL R/A 15AU
|
封裝: - |
庫存6,768 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 18 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.130" (3.30mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 16PS DL T/H 30AU
|
封裝: - |
庫存7,956 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 16 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | 0.329" (8.36mm) | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 16PS DL T/H 30AU
|
封裝: - |
庫存2,538 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 16 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.130" (3.30mm) | 0.118" (3.00mm) | 0.307" (7.80mm) | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 16PS DL R/A 15AU
|
封裝: - |
庫存2,322 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 16 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 16PS DL R/A 30AU
|
封裝: - |
庫存4,302 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 16 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 16PS DL SMD 15AU
|
封裝: - |
庫存4,338 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 16PS DL SMD 30AU
|
封裝: - |
庫存3,258 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 16PS DL SMD 30AU
|
封裝: - |
庫存5,382 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.130" (3.30mm) | - | - | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 14PS DL T/H 30AU
|
封裝: - |
庫存2,862 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 14 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | 0.329" (8.36mm) | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 14PS DL SMD 15AU
|
封裝: - |
庫存2,754 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 14 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 12PS DL T/H 30AU
|
封裝: - |
庫存2,394 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 12 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.130" (3.30mm) | 0.118" (3.00mm) | 0.307" (7.80mm) | 0.060" (1.52mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 12PS DL R/A 15AU
|
封裝: - |
庫存8,478 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 12 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.152" (3.86mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 12PS DL R/A 30AU
|
封裝: - |
庫存2,610 |
|
Male Pin | 0.079" (2.00mm) | Board to Board or Cable | Unshrouded | 12 | All | 2 | 0.079" (2.00mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.130" (3.30mm) | 0.118" (3.00mm) | - | 0.165" (4.20mm) | Square | Gold | 30µin (0.76µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
|
|
|
3M |
CONN HEADER 2MM 12PS DL SMD 15AU
|
封裝: - |
庫存6,102 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 12 | All | 2 | 0.079" (2.00mm) | Surface Mount | Solder | Push-Pull | 0.152" (3.86mm) | - | - | 0.060" (1.52mm) | Square | Gold | 15µin (0.38µm) | Tin-Lead | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
