NXP 產品

MRF8S26120HSR5

NXP

FET RF 65V 2.69GHZ NI780S

• Transistor Type: LDMOS
• Frequency: 2.69GHz
• Gain: 15.6dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 900mA
• Power - Output: 28W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

封裝: NI-780S

LD6806TD/18P,125

NXP

IC REG LINEAR 1.8V 200MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

封裝: SC-74A, SOT-753

MC13783JVK5

NXP

IC PWR MGT AUD CIRCUIT 247MAPBGA

• Applications: Handheld/Mobile Devices
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 247-TFBGA
• Supplier Device Package: 247-MAPBGA (10x10)

封裝: 247-TFBGA

74ABT899A,602

NXP

IC 9BIT DUAL LATCH TXRX 28PLCC

• Logic Type: Parity Generator/Checker
• Supply Voltage: 4.5 V ~ 5.5 V
• Number of Bits: 9
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (11.51x11.51)

封裝: 28-LCC (J-Lead)

SSTUA32S865ET/G,51

NXP

IC REG BUFFER 28BIT 160TFBGA

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-TFBGA (9x13)

封裝: 160-TFBGA

HEC4001BT,112

NXP

IC GATE NOR 4CH 2-INP 14-SO

• Logic Type: NOR Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 3 V ~ 15 V
• Current - Quiescent (Max): 1µA
• Current - Output High, Low: 3.4mA, 3.4mA
• Logic Level - Low: 1.5 V ~ 4 V
• Logic Level - High: 3.5 V ~ 11 V
• Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

封裝: 14-SOIC (0.154", 3.90mm Width)

74LVT16244BEV,157

NXP

IC BUFF DVR TRI-ST 16BIT 56VFBGA

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFBGA
• Supplier Device Package: 56-VFBGA (4.5x7)

封裝: 56-VFBGA

74ABT2244D,112

NXP

IC BUFF/DVR TRI-ST DUAL 20SOIC

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 12mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SO

封裝: 20-SOIC (0.295", 7.50mm Width)

UJA1079ATW/3V3/WD,

NXP

IC SBC LIN 3.3V 32HTSSOP

• Applications: Automotive
• Interface: SPI Serial
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

NX3L4357GM,115

NXP

IC ANALOG SWITCH SP3T 10XQFN

• Switch Circuit: SP3T
• Multiplexer/Demultiplexer Circuit: 3:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 90 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 40ns, 20ns
• -3db Bandwidth: 60MHz
• Charge Injection: 15pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.55x2)

封裝: 10-XFQFN

SC8245ARZU466D

NXP

IC MPU MPC82XX 466MHZ 352TBGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 466MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 352-LBGA
• Supplier Device Package: 352-TBGA (35x35)

封裝: 352-LBGA

P2020NXE2HFC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

MC68302EH16CR2

NXP

IC MPU M683XX 16MHZ 132QFP

• Core Processor: M68000
• Number of Cores/Bus Width: 1 Core, 8/16-Bit
• Speed: 16MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

封裝: 132-BQFP Bumpered

MPC8271VRMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

封裝: 516-BBGA

MC908QC16CDTE

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 12
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

MK53DX256ZCLQ10

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 94
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 41x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

MM908E624ACDWB

NXP

IC TRPL SWITCH MCU/LIN 54-SOIC

• Applications: Automotive Mirror Control
• Core Processor: HC08
• Program Memory Type: FLASH (16 kB)
• Controller Series: 908E
• RAM Size: 512 x 8
• Interface: SCI, SPI
• Number of I/O: 16
• Voltage - Supply: 5.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 54-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 54-SOIC

封裝: 54-BSSOP (0.295", 7.50mm Width)

TDA9965AHL/C3,118

NXP

CCD CAMERA INTERFACE 48LQFP

• Type: CCD (Charged Coupled Device)
• Number of Channels: -
• Resolution (Bits): 12 b
• Sampling Rate (Per Second): 40M
• Data Interface: Serial
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -20°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

PCKV857DGV,112

NXP

IC CLK BUF DDR 190MHZ 1CIRC

• PLL: Yes
• Main Purpose: Memory, DDR, SDRAM
• Input: SSTL-2
• Output: SSTL-2
• Number of Circuits: 1
• Ratio - Input:Output: 1:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 190MHz
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 48-TSSOP

封裝: 48-TFSOP (0.173", 4.40mm Width)

ASL3417SHNY

NXP

ENHANCED THREE CHANNEL LED BUCK

• Type: -
• Topology: -
• Internal Switch(s): -
• Number of Outputs: -
• Voltage - Supply (Min): -
• Voltage - Supply (Max): -
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

SPC5645BAVLT1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z4d
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 177
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 160K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 33x10b, 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-TQFP (28x28)

封裝: 208-LQFP

SPC5602CACLL4

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

MC9S08QL4CTJ

NXP

IC MCU 8BIT 4KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LINbus, SCI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

LS1027ASE7NQA

NXP

IC MPU QORIQ 1.3GHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.3GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

封裝: -

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LS1028ASE7NQA

NXP

IC MPU QORIQ 1.3GHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.3GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

封裝: -

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LPC5512JBD100K

NXP

IC MCU 32BIT 64KB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 64
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP Exposed Pad
• Supplier Device Package: 100-HLQFP (14x14)

封裝: -

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PCF2113EU-2-F4-026

NXP

IC LCD CTLR/DRIVER UNCASED

• Display Type: -
• Configuration: -
• Interface: -
• Digits or Characters: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

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MC32PF4210A2ESR2

NXP

PF4210

• Applications: Audio, Video
• Current - Supply: -
• Voltage - Supply: 2.8V ~ 4.5V
• Operating Temperature: 0°C ~ 85°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN-EP (8x8)

封裝: -

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