頁 759 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF6S19060NR1	NXP	FET RF 68V 1.93GHZ TO270-4 Transistor Type: LDMOS Frequency: 1.93GHz Gain: 16dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 610mA Power - Output: 12W Voltage - Rated: 68V Package / Case: TO-270AB Supplier Device Package: TO-270 WB-4	封裝: TO-270AB	庫存5,248
2PC1815GR,412	NXP	TRANS NPN 50V 0.15A TO-92 Transistor Type: NPN Current - Collector (Ic) (Max): 150mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 300mV @ 10mA, 100mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 6V Power - Max: 500mW Frequency - Transition: 80MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA)	庫存4,656
TDA8356/N6,112	NXP	IC DC COUPLED V-DEFL 9-SIL Type: - Applications: - Mounting Type: Through Hole Package / Case: 9-SIP Supplier Device Package: 9-SIL	封裝: 9-SIP	庫存5,312
MC34708VKR2	NXP	IC POWER MANAGEMENT 206MAPBGA Applications: General Purpose Current - Supply: - Voltage - Supply: 1.8 V ~ 4.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 206-LFBGA Supplier Device Package: 206-MAPBGA (8x8)	封裝: 206-LFBGA	庫存15,000
MPC17529EP	NXP	IC MOTOR DRIVER PAR 24QFN Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (4) Interface: Parallel Technology: CMOS Step Resolution: - Applications: Battery Powered Current - Output: 700mA Voltage - Supply: 2.7 V ~ 5.6 V Voltage - Load: 2 V ~ 6.8 V Operating Temperature: -20°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN-EP (4x4)	封裝: 24-VFQFN Exposed Pad	庫存5,712
74LVC169BQ,115	NXP	IC SYNC 4BIT BIN COUNT 16DHVQFN Logic Type: Binary Counter Direction: Up, Down Number of Elements: 1 Number of Bits per Element: 4 Reset: - Timing: Synchronous Count Rate: 150MHz Trigger Type: Positive Edge Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-DHVQFN (2.5x3.5)	封裝: 16-VFQFN Exposed Pad	庫存7,568
MPC8536CVTAULA	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存7,552
MC68EN360VR25VL	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存6,048
MC9S12T64MPKE16	NXP	IC MCU 16BIT 64KB FLASH 80LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.25 V ~ 2.75 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封裝: 80-LQFP	庫存6,128
MC908QC8MDRE	NXP	IC MCU 8BIT 8KB FLASH 28TSSOP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	封裝: 28-TSSOP (0.173", 4.40mm Width)	庫存6,096
MCHC908JK8CPE	NXP	IC MCU 8BIT 8KB FLASH 20DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LED, LVD, POR, PWM Number of I/O: 15 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 13x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	封裝: 20-DIP (0.300", 7.62mm)	庫存21,228
SPC5516GBMLQ66	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存2,032
MKM33Z128CLH5R	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, WDT Number of I/O: 38 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 6x16b, 4x24b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存2,832
MPC5121YVY400B	NXP	IC MCU 32BIT ROMLESS 516FPBGA Core Processor: e300 Core Size: 32-Bit Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Number of I/O: 147 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	封裝: 516-BBGA	庫存9,696
TDA8763M/3/C4,118	NXP	IC ADC HIGH SPEED LOW PWR 28SSOP Number of Bits: 10 Sampling Rate (Per Second): 30M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: Sigma-Delta Reference Type: Internal Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Mounting Type: -	封裝: 28-SSOP (0.209", 5.30mm Width)	庫存7,440
MPX53GP	NXP	SENSOR GAUGE PRESSURE 7 PSI MAX Pressure Type: Vented Gauge Operating Pressure: 7.25 PSI (50 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 60 mV (3V) Accuracy: -0.6% ~ 0.4% Voltage - Supply: 3 V ~ 6 V Port Size: Male - 0.19" (4.93mm) Tube Port Style: Barbed Features: - Termination Style: PCB Maximum Pressure: 25.38 PSI (175 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 6-SIP Module Supplier Device Package: -	封裝: 6-SIP Module	庫存13,692
MMA1211EGR2	NXP	ACCELEROMETER 169G ANALOG 16SOIC Type: Analog Axis: Z Acceleration Range: ±169g Sensitivity (LSB/g): - Sensitivity (mV/g): 13.33 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存6,714
TDA9898HN/V2,518	NXP	IC IF PROCESSOR MULTISTD 48HVQFN Function: IF Processor Frequency: - RF Type: ATV, DVB, FM Secondary Attributes: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封裝: 48-VFQFN Exposed Pad	庫存5,508
1322XNSK-DBG	NXP	KIT NETWORK STARTER 1322X Type: Transceiver; 802.15.4 (ZigBee?) Frequency: 2.4GHz For Use With/Related Products: MC1322x Supplied Contents: 3 Boards	封裝: -	庫存2,178
FS32V234BMN1VUB	NXP	ISP GPU NO CSE 800MHZ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,304
LS1020ASE7KQB	NXP	LS1 32BIT ARM SOC 1GHZ DDR3/4 Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (3) SATA: SATA 3Gbps (1) USB: USB 2.0 (1), USB 3.0 + PHY Voltage - I/O: - Operating Temperature: 0°C ~ 105°C Security Features: - Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	封裝: 525-FBGA, FCBGA	庫存5,920
SPC5604CF2CLL6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存6,576
SPC5603BF2MLH6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存5,232
LPC55S14JBD100E	NXP	IC MCU 32BIT 128KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	封裝: -	庫存210
MRF24301HR5	NXP	RF MOSFET LDMOS NI780 Transistor Type: LDMOS Frequency: 2.4GHz ~ 2.5GHz Gain: 13.5dB Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: 300W Voltage - Rated: - Package / Case: SOT-957A Supplier Device Package: NI-780H-2L	封裝: -	Request a Quote
PMEG4030ER-DG-B2-1	NXP	PMEG4030ER/DG/B2,1 Diode Type: - Voltage - DC Reverse (Vr) (Max): - Current - Average Rectified (Io): - Voltage - Forward (Vf) (Max) @ If: - Speed: - Reverse Recovery Time (trr): - Current - Reverse Leakage @ Vr: - Capacitance @ Vr, F: - Mounting Type: - Package / Case: - Supplier Device Package: - Operating Temperature - Junction: -	封裝: -	Request a Quote
MC9S08AW16CPUER	NXP	IC MCU 8BIT 16KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote
LPC2136FBD64-01EL	NXP	IC MCU 16/32B 256KB FLASH 64LQFP Core Processor: ARM7® Core Size: 16/32-Bit Speed: 60MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 47 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 16x10b SAR; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: -	庫存840

MRF6S19060NR1

NXP

FET RF 68V 1.93GHZ TO270-4

Transistor Type: LDMOS
Frequency: 1.93GHz
Gain: 16dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 610mA
Power - Output: 12W
Voltage - Rated: 68V
Package / Case: TO-270AB
Supplier Device Package: TO-270 WB-4

封裝: TO-270AB

庫存5,248

2PC1815GR,412

NXP

TRANS NPN 50V 0.15A TO-92

Transistor Type: NPN
Current - Collector (Ic) (Max): 150mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 6V
Power - Max: 500mW
Frequency - Transition: 80MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA)

庫存4,656

TDA8356/N6,112

NXP

IC DC COUPLED V-DEFL 9-SIL

Type: -
Applications: -
Mounting Type: Through Hole
Package / Case: 9-SIP
Supplier Device Package: 9-SIL

封裝: 9-SIP

庫存5,312

MC34708VKR2

NXP

IC POWER MANAGEMENT 206MAPBGA

Applications: General Purpose
Current - Supply: -
Voltage - Supply: 1.8 V ~ 4.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 206-LFBGA
Supplier Device Package: 206-MAPBGA (8x8)

封裝: 206-LFBGA

庫存15,000

MPC17529EP

NXP

IC MOTOR DRIVER PAR 24QFN

Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Function: Driver - Fully Integrated, Control and Power Stage
Output Configuration: Half Bridge (4)
Interface: Parallel
Technology: CMOS
Step Resolution: -
Applications: Battery Powered
Current - Output: 700mA
Voltage - Supply: 2.7 V ~ 5.6 V
Voltage - Load: 2 V ~ 6.8 V
Operating Temperature: -20°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-QFN-EP (4x4)

封裝: 24-VFQFN Exposed Pad

庫存5,712

74LVC169BQ,115

NXP

IC SYNC 4BIT BIN COUNT 16DHVQFN

Logic Type: Binary Counter
Direction: Up, Down
Number of Elements: 1
Number of Bits per Element: 4
Reset: -
Timing: Synchronous
Count Rate: 150MHz
Trigger Type: Positive Edge
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Supplier Device Package: 16-DHVQFN (2.5x3.5)

封裝: 16-VFQFN Exposed Pad

庫存7,568

MPC8536CVTAULA

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存7,552

MC68EN360VR25VL

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存6,048

MC9S12T64MPKE16

NXP

IC MCU 16BIT 64KB FLASH 80LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 16MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.25 V ~ 2.75 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封裝: 80-LQFP

庫存6,128

MC908QC8MDRE

NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 24
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

封裝: 28-TSSOP (0.173", 4.40mm Width)

庫存6,096

MCHC908JK8CPE

NXP

IC MCU 8BIT 8KB FLASH 20DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Number of I/O: 15
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 13x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

封裝: 20-DIP (0.300", 7.62mm)

庫存21,228

SPC5516GBMLQ66

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 66MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 111
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存2,032

MKM33Z128CLH5R

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Number of I/O: 38
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 6x16b, 4x24b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存2,832

MPC5121YVY400B

NXP

IC MCU 32BIT ROMLESS 516FPBGA

Core Processor: e300
Core Size: 32-Bit
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Number of I/O: 147
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

封裝: 516-BBGA

庫存9,696

TDA8763M/3/C4,118

NXP

IC ADC HIGH SPEED LOW PWR 28SSOP

Number of Bits: 10
Sampling Rate (Per Second): 30M
Number of Inputs: 1
Input Type: Single Ended
Data Interface: Parallel
Configuration: ADC
Ratio - S/H:ADC: -
Number of A/D Converters: 1
Architecture: Sigma-Delta
Reference Type: Internal
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP
Mounting Type: -

封裝: 28-SSOP (0.209", 5.30mm Width)

庫存7,440

MPX53GP

NXP

SENSOR GAUGE PRESSURE 7 PSI MAX

Pressure Type: Vented Gauge
Operating Pressure: 7.25 PSI (50 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 60 mV (3V)
Accuracy: -0.6% ~ 0.4%
Voltage - Supply: 3 V ~ 6 V
Port Size: Male - 0.19" (4.93mm) Tube
Port Style: Barbed
Features: -
Termination Style: PCB
Maximum Pressure: 25.38 PSI (175 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 6-SIP Module
Supplier Device Package: -

封裝: 6-SIP Module

庫存13,692

MMA1211EGR2

NXP

ACCELEROMETER 169G ANALOG 16SOIC

Type: Analog
Axis: Z
Acceleration Range: ±169g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 13.33
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存6,714

TDA9898HN/V2,518

NXP

IC IF PROCESSOR MULTISTD 48HVQFN

Function: IF Processor
Frequency: -
RF Type: ATV, DVB, FM
Secondary Attributes: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封裝: 48-VFQFN Exposed Pad

庫存5,508

1322XNSK-DBG

NXP

KIT NETWORK STARTER 1322X

Type: Transceiver; 802.15.4 (ZigBee?)
Frequency: 2.4GHz
For Use With/Related Products: MC1322x
Supplied Contents: 3 Boards

封裝: -

庫存2,178

FS32V234BMN1VUB

NXP

ISP GPU NO CSE 800MHZ

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,304

LS1020ASE7KQB

NXP

LS1 32BIT ARM SOC 1GHZ DDR3/4

Core Processor: ARM® Cortex®-A7
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (3)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (1), USB 3.0 + PHY
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C
Security Features: -
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

封裝: 525-FBGA, FCBGA

庫存5,920

SPC5604CF2CLL6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存6,576

SPC5603BF2MLH6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存5,232

LPC55S14JBD100E

NXP

IC MCU 32BIT 128KB FLSH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

封裝: -

庫存210

MRF24301HR5

NXP

RF MOSFET LDMOS NI780

Transistor Type: LDMOS
Frequency: 2.4GHz ~ 2.5GHz
Gain: 13.5dB
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: 300W
Voltage - Rated: -
Package / Case: SOT-957A
Supplier Device Package: NI-780H-2L

封裝: -

Request a Quote

PMEG4030ER-DG-B2-1

NXP

PMEG4030ER/DG/B2,1

Diode Type: -
Voltage - DC Reverse (Vr) (Max): -
Current - Average Rectified (Io): -
Voltage - Forward (Vf) (Max) @ If: -
Speed: -
Reverse Recovery Time (trr): -
Current - Reverse Leakage @ Vr: -
Capacitance @ Vr, F: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -
Operating Temperature - Junction: -

封裝: -

Request a Quote

MC9S08AW16CPUER

NXP

IC MCU 8BIT 16KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

Request a Quote

LPC2136FBD64-01EL

NXP

IC MCU 16/32B 256KB FLASH 64LQFP

Core Processor: ARM7®
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 47
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 16x10b SAR; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

庫存840