頁 722 - NXP 產品 | 黑森爾電子
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NXP 產品

記錄 26,590
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BUK9609-55A,118
NXP

MOSFET N-CH 55V 75A D2PAK

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 55V
  • Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
  • Vgs(th) (Max) @ Id: 2V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 60nC @ 5V
  • Input Capacitance (Ciss) (Max) @ Vds: 4633pF @ 25V
  • Vgs (Max): ±15V
  • FET Feature: -
  • Power Dissipation (Max): 211W (Tc)
  • Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: D2PAK
  • Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
封裝: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
庫存3,680
PSMN5R8-30LL,115
NXP

MOSFET N-CH 30V QFN3333

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 30V
  • Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
  • Vgs(th) (Max) @ Id: 2.15V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 24nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds: 1316pF @ 15V
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 55W (Tc)
  • Rds On (Max) @ Id, Vgs: 5.8 mOhm @ 10A, 10V
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: 8-DFN3333 (3.3x3.3)
  • Package / Case: 8-VDFN Exposed Pad
封裝: 8-VDFN Exposed Pad
庫存7,696
MRF8S26120HSR3
NXP

FET RF 65V 2.69GHZ NI780S

  • Transistor Type: LDMOS
  • Frequency: 2.69GHz
  • Gain: 15.6dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 900mA
  • Power - Output: 28W
  • Voltage - Rated: 65V
  • Package / Case: NI-780S
  • Supplier Device Package: NI-780S
封裝: NI-780S
庫存7,776
hot MRF6S27015GNR1
NXP

FET RF 68V 2.6GHZ TO270-2 GW

  • Transistor Type: LDMOS
  • Frequency: 2.6GHz
  • Gain: 14dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 160mA
  • Power - Output: 3W
  • Voltage - Rated: 68V
  • Package / Case: TO-270-2 Gull Wing
  • Supplier Device Package: TO-270-2 GULL
封裝: TO-270-2 Gull Wing
庫存11,100
hot MC34912G5AC
NXP

IC SYSTEM BASIS CHIP LIN 32-LQFP

  • Applications: System Basis Chip
  • Current - Supply: 4.5mA
  • Voltage - Supply: 5.5 V ~ 18 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存6,080
MC34845BEPR2
NXP

IC LED DRVR RGLTR DIM 2.6A 24QFN

  • Type: DC DC Regulator
  • Topology: Step-Up (Boost)
  • Internal Switch(s): Yes
  • Number of Outputs: 6
  • Voltage - Supply (Min): 5V
  • Voltage - Supply (Max): 21V
  • Voltage - Output: 8 V ~ 60 V
  • Current - Output / Channel: 2.6A (Switch)
  • Frequency: 300kHz
  • Dimming: PWM
  • Applications: Backlight
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-UFQFN Exposed Pad
  • Supplier Device Package: 24-QFN-EP (4x4)
封裝: 24-UFQFN Exposed Pad
庫存3,728
hot MPC8569EVJAQLJB
NXP

IC MPU MPC85XX 1.067GHZ 783BGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.067GHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
  • RAM Controllers: DDR2, DDR3, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (8), 1 Gbps (4)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.0V, 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封裝: 783-BBGA, FCBGA
庫存9,060
LS1024ASN7MLA
NXP

IC PROCESSOR DUAL CORE

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: GbE (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1), USB 3.0 + PHY
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: Secure Boot, TrustZone?
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
封裝: 625-BFBGA, FCBGA
庫存3,152
MPC8313CZQAGDC
NXP

IC MPU MPC83XX 400MHZ 516BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA Exposed Pad
  • Supplier Device Package: 516-TEPBGA (27x27)
封裝: 516-BBGA Exposed Pad
庫存4,752
hot LS1024ASE7MLA
NXP

IC PROCESSOR DUAL CORE 625BGA

  • Core Processor: ARM? Cortex?-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: GbE (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1), USB 3.0 + PHY
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: Secure Boot, TrustZone?
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
封裝: 625-BFBGA, FCBGA
庫存5,152
PC9S08QE64CLH
NXP

IC MCU 8BIT 64KB FLASH 64LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 50MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存6,512
P89C662HBA/00,512
NXP

IC MCU 8BIT 32KB FLASH 44PLCC

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 33MHz
  • Connectivity: I2C, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封裝: 44-LCC (J-Lead)
庫存2,640
S908AB32AE2CFUE
NXP

IC MCU 8BIT 32KB FLASH 64QFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI, SPI
  • Peripherals: POR, PWM
  • Number of I/O: 51
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-QFP
  • Supplier Device Package: 64-QFP (14x14)
封裝: 64-QFP
庫存6,512
MC9S08AW32MFUE
NXP

IC MCU 8BIT 32KB FLASH 64QFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-QFP
  • Supplier Device Package: 64-QFP (14x14)
封裝: 64-QFP
庫存3,760
hot MC9S08QG4CFFER
NXP

IC MCU 8BIT 4KB FLASH 16QFN

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-VQFN Exposed Pad
  • Supplier Device Package: 16-QFN-EP (5x5)
封裝: 16-VQFN Exposed Pad
庫存29,700
DSPB56364AF100
NXP

IC DSP 24BIT AUD 100MHZ 100-LQFP

  • Type: Audio Processor
  • Interface: Host Interface, I2C, SAI, SPI
  • Clock Rate: 100MHz
  • Non-Volatile Memory: ROM (24 kB)
  • On-Chip RAM: 11.25kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 3.30V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存5,712
PCK942CBD,151
NXP

IC CLK BUFFER 1:18 250MHZ 32LQFP

  • Type: Fanout Buffer (Distribution)
  • Number of Circuits: 1
  • Ratio - Input:Output: 1:18
  • Differential - Input:Output: No/No
  • Input: LVCMOS, LVTTL
  • Output: LVCMOS
  • Frequency - Max: 250MHz
  • Voltage - Supply: 2.375 V ~ 3.465 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存6,800
MF3D4201DUD/00V
NXP

MIFARE DESFIRE EV2

  • Type: RFID Reader
  • Frequency: 13.56MHz
  • Standards: ISO 14443
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 70°C
  • Package / Case: Die
  • Supplier Device Package: Die
封裝: Die
庫存8,748
JN5148/Z01,515
NXP

IC RF TXRX+MCU 802.15.4 56-VFQFN

  • Type: TxRx + MCU
  • RF Family/Standard: 802.15.4
  • Protocol: Zigbee?
  • Modulation: O-QPSK
  • Frequency: 2.4GHz
  • Data Rate (Max): 667kbps
  • Power - Output: 2.75dBm
  • Sensitivity: -96.5dBm
  • Memory Size: 128kB ROM, 128kB RAM
  • Serial Interfaces: I2C, JTAG, SPI, UART
  • GPIO: 21
  • Voltage - Supply: 2 V ~ 3.6 V
  • Current - Receiving: 17.5mA
  • Current - Transmitting: 15mA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 56-VFQFN Exposed Pad
封裝: 56-VFQFN Exposed Pad
庫存2,430
BGU8004X
NXP

IC MMIC AMP LNA WLCSP6

  • Frequency: 1.559GHz ~ 1.61GHz
  • P1dB: -
  • Gain: 19dB
  • Noise Figure: 0.6dB
  • RF Type: Galileo, GLONASS, GPS
  • Voltage - Supply: 1.5 V ~ 3.1 V
  • Current - Supply: 7.5mA
  • Test Frequency: -
  • Package / Case: 6-XFBGA, WLCSP
  • Supplier Device Package: 6-WLCSP (0.65x0.44)
封裝: 6-XFBGA, WLCSP
庫存2,682
MCIMX6Y1DVK05AA
NXP

528MHZETHERNET X1 USB OTG X1

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: Multimedia; NEON™ MPE
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: Electrophoretic, LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.8V, 3.3V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
  • Package / Case: 272-LFBGA
  • Supplier Device Package: 272-MAPBGA (9x9)
封裝: 272-LFBGA
庫存8,256
SPC5604BK0VLQ4
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 123
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 36x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: 144-LQFP
庫存3,792
NX30P6093AUKAZ
NXP

HIGH-VOLTAGE I2C CONTROLLED OVER

  • Switch Type: USB Switch
  • Number of Outputs: 1
  • Ratio - Input:Output: 1:1
  • Output Configuration: -
  • Output Type: P-Channel
  • Interface: I2C
  • Voltage - Load: 2.8V ~ 20V
  • Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
  • Current - Output (Max): 5.6A
  • Rds On (Typ): 16mOhm
  • Input Type: Non-Inverting
  • Features: Slew Rate Controlled
  • Fault Protection: Over Temperature, Over Voltage, UVLO
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 20-UFBGA, WLCSP
  • Supplier Device Package: 20-WLCSP (2.16x1.7)
封裝: -
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MKM35Z512VLL7
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit Single-Core
  • Speed: 75MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: DMA, LCD, RNG, WDT
  • Number of I/O: 72
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: A/D 12x16b SAR
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: -
庫存270
MIMXRT1062DVL6B
NXP

IC MCU 32BIT EXT MEM 196LFBGA

  • Core Processor: ARM® Cortex®-M7
  • Core Size: 32-Bit Single-Core
  • Speed: 600MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
  • Number of I/O: 127
  • Program Memory Size: -
  • Program Memory Type: External Program Memory
  • EEPROM Size: -
  • RAM Size: 1M x 8
  • Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
  • Data Converters: A/D 20x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 196-LFBGA
  • Supplier Device Package: 196-LFBGA (10x10)
封裝: -
庫存1,440
LPC11E68JBD64K
NXP

IC MCU 32BIT 256KB FLASH 64LQFP

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Number of I/O: 50
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 36K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
  • Data Converters: A/D 10x12b SAR
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: -
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LPC54016JET100E
NXP

IC MCU 32BIT ROMLESS 100TFBGA

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit Single-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
  • Number of I/O: 64
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 360K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
封裝: -
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FC32K118LFT0VLHR
NXP

S32K118, M0+, FLASH 256K, RAM 25

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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