頁 174 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF6S9060NBR1	NXP	FET RF 68V 880MHZ TO-272-2 Transistor Type: LDMOS Frequency: 880MHz Gain: 21.4dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 450mA Power - Output: 14W Voltage - Rated: 68V Package / Case: TO-272BC Supplier Device Package: TO-272-2	封裝: TO-272BC	庫存6,176
LD6815TD/12P,125	NXP	IC REG LINEAR 1.2V 150MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA (Typ) Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	封裝: SC-74A, SOT-753	庫存4,656
MC10XS3535DHFK	NXP	IC SWITCH HIGH SIDE TRPL 24QFN Switch Type: General Purpose Number of Outputs: 6 Ratio - Input:Output: 1:6 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 7 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): - Rds On (Typ): 10 mOhm (Max), 35 mOhm (Max) Input Type: - Features: Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 24-PowerQFN Supplier Device Package: 24-PQFN (12x12)	封裝: 24-PowerQFN	庫存6,400
TEA1716T/2,518	NXP	IC MULTICHIP CTLR PFC/HBC 24SOIC Mode: Discontinuous Conduction (DCM) Frequency - Switching: - Current - Startup: - Voltage - Supply: 70 ~ 276 VAC Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存19,992
M86296G12	NXP	IC C2K 900MHZ 16CH VOIP 625BGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,056
UJA1069TW24/5V0,51	NXP	IC LIN FAIL-SAFE 24-HTSSOP Applications: Automotive Interface: LIN (Local Interconnect Network) Voltage - Supply: 5V Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad Supplier Device Package: 24-HTSSOP Mounting Type: Surface Mount	封裝: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad	庫存6,160
MC33989PEG	NXP	IC SYSTEM BASE W/CAN 28SOIC Applications: Automotive Interface: CAN Voltage - Supply: 5.5 V ~ 18 V Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC Mounting Type: Surface Mount	封裝: 28-SOIC (0.295", 7.50mm Width)	庫存6,240
T2080NXE7MQB	NXP	IC SOC 64BIT 8X1.2GHZ 896FCBGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 896-FBGA, FCBGA Supplier Device Package: 896-FCPBGA (25x25)	封裝: 896-FBGA, FCBGA	庫存4,880
MPC8548ECPXATGB	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存3,872
KMPC8547EVUATG	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存6,896
MPC8347ZUAGD	NXP	IC MPU MPC83XX 400MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	封裝: 672-LBGA	庫存2,336
KMPC8349VVAJF	NXP	IC MPU MPC83XX 533MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	封裝: 672-LBGA	庫存2,640
SPC5674KFF0VMS2R	NXP	IC MCU 32BIT 1.5MB FLASH 473BGA Core Processor: e200z7d Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V Data Converters: A/D 34x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	封裝: 473-LFBGA	庫存4,432
P80C552EFA/08,518	NXP	IC MCU 8BIT ROMLESS 68PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 40 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.23x24.23)	封裝: 68-LCC (J-Lead)	庫存2,176
P89LPC935FHN,151	NXP	IC MCU 8BIT 8KB FLASH 28HVQFN Core Processor: 8051 Core Size: 8-Bit Speed: 12MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x8b; D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-VQFN Exposed Pad Supplier Device Package: 28-HVQFN (6x6)	封裝: 28-VQFN Exposed Pad	庫存2,176
MC908KX2MDWER	NXP	IC MCU 8BIT 2KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存6,672
LPC2364FBD100,551	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 72MHz Connectivity: CAN, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 34K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存25,182
MM908E622ACEK	NXP	IC HALF-BRIDGE QUAD 54-SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	封裝: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	庫存5,808
MSC8157ESVT1000A	NXP	IC DSP 6-CORE DGTL 783FCBGA Type: SC3850 Six Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 6.375MB Voltage - I/O: 1.0V, 1.5V, 2.5V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存5,072
KMI16/1/V3PX	NXP	MAGNET SWITCH SPEC PURP SOT477B Function: Special Purpose Technology: Magnetoresistive Polarization: - Sensing Range: - Test Condition: - Voltage - Supply: 4.5 V ~ 16 V Current - Supply (Max): 14mA Current - Output (Max): 20mA Output Type: Open Collector Features: Amplified Output, Temperature Compensated Operating Temperature: -40°C ~ 150°C (TA) Package / Case: 3-SIP Module Supplier Device Package: SOT477B	封裝: 3-SIP Module	庫存7,110
SAA6581T/V1,512	NXP	IC DEMODULATOR RDS/RBDS 16SOIC Function: Demodulator, Filter LO Frequency: 4.332MHz, 8.664MHz RF Frequency: - P1dB: - Gain: 20dB Noise Figure: - Current - Supply: 6mA Voltage - Supply: 4 V ~ 5.5 V Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存7,650
MW6IC2240NBR1	NXP	IC PWR AMP RF 28V 4.5W TO-272-16 Frequency: 2.11GHz ~ 2.17GHz P1dB: - Gain: 28dB Noise Figure: - RF Type: Cellular, W-CDMA Voltage - Supply: 28V Current - Supply: 210mA Test Frequency: - Package / Case: TO-272-16 Variant, Flat Leads Supplier Device Package: TO-272 WB-16	封裝: TO-272-16 Variant, Flat Leads	庫存43,020
S908AZ60AE2MFUE	NXP	8-BIT MCU HC08 CORE 8MHZ 60KB Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 52 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 15x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-QFP	庫存2,752
SPC5605BF1MLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存7,184
SPC5673FAMVR2R	NXP	IC MCU 32BIT 3MB FLASH 416BBGA Core Processor: e200z7 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	封裝: -	Request a Quote
LPC55S26JEV98K	NXP	IC MCU 32BIT 256KB FLASH 98VFBGA Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 98-VFBGA Supplier Device Package: 98-VFBGA (7x7)	封裝: -	庫存3,366
MC56F81766MLF	NXP	32-BIT DSC, 56800EX CORE, 128KB Type: Digital Signal Controllers Interface: I2C, LINbus, QSCI, QSPI Clock Rate: 100MHz Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: -	Request a Quote
S9S12ZVL32AMLCR	NXP	S12Z CPU, 32K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 6x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: -	Request a Quote

MRF6S9060NBR1

NXP

FET RF 68V 880MHZ TO-272-2

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 21.4dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 450mA
Power - Output: 14W
Voltage - Rated: 68V
Package / Case: TO-272BC
Supplier Device Package: TO-272-2

封裝: TO-272BC

庫存6,176

LD6815TD/12P,125

NXP

IC REG LINEAR 1.2V 150MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Current - Output: 150mA
Current - Quiescent (Iq): -
Current - Supply (Max): 35µA ~ 150µA
PSRR: 75dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Transient Voltage
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

封裝: SC-74A, SOT-753

庫存4,656

MC10XS3535DHFK

NXP

IC SWITCH HIGH SIDE TRPL 24QFN

Switch Type: General Purpose
Number of Outputs: 6
Ratio - Input:Output: 1:6
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 7 V ~ 20 V
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Current - Output (Max): -
Rds On (Typ): 10 mOhm (Max), 35 mOhm (Max)
Input Type: -
Features: Watchdog Timer
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 24-PowerQFN
Supplier Device Package: 24-PQFN (12x12)

封裝: 24-PowerQFN

庫存6,400

TEA1716T/2,518

NXP

IC MULTICHIP CTLR PFC/HBC 24SOIC

Mode: Discontinuous Conduction (DCM)
Frequency - Switching: -
Current - Startup: -
Voltage - Supply: 70 ~ 276 VAC
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存19,992

M86296G12

NXP

IC C2K 900MHZ 16CH VOIP 625BGA

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,056

UJA1069TW24/5V0,51

NXP

IC LIN FAIL-SAFE 24-HTSSOP

Applications: Automotive
Interface: LIN (Local Interconnect Network)
Voltage - Supply: 5V
Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
Supplier Device Package: 24-HTSSOP
Mounting Type: Surface Mount

封裝: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad

庫存6,160

MC33989PEG

NXP

IC SYSTEM BASE W/CAN 28SOIC

Applications: Automotive
Interface: CAN
Voltage - Supply: 5.5 V ~ 18 V
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC
Mounting Type: Surface Mount

封裝: 28-SOIC (0.295", 7.50mm Width)

庫存6,240

T2080NXE7MQB

NXP

IC SOC 64BIT 8X1.2GHZ 896FCBGA

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 896-FBGA, FCBGA
Supplier Device Package: 896-FCPBGA (25x25)

封裝: 896-FBGA, FCBGA

庫存4,880

MPC8548ECPXATGB

NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存3,872

KMPC8547EVUATG

NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存6,896

MPC8347ZUAGD

NXP

IC MPU MPC83XX 400MHZ 672TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 672-LBGA
Supplier Device Package: 672-TBGA (35x35)

封裝: 672-LBGA

庫存2,336

KMPC8349VVAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 672-LBGA
Supplier Device Package: 672-TBGA (35x35)

封裝: 672-LBGA

庫存2,640

SPC5674KFF0VMS2R

NXP

IC MCU 32BIT 1.5MB FLASH 473BGA

Core Processor: e200z7d
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

封裝: 473-LFBGA

庫存4,432

P80C552EFA/08,518

NXP

IC MCU 8BIT ROMLESS 68PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 16MHz
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 40
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (24.23x24.23)

封裝: 68-LCC (J-Lead)

庫存2,176

P89LPC935FHN,151

NXP

IC MCU 8BIT 8KB FLASH 28HVQFN

Core Processor: 8051
Core Size: 8-Bit
Speed: 12MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x8b; D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-VQFN Exposed Pad
Supplier Device Package: 28-HVQFN (6x6)

封裝: 28-VQFN Exposed Pad

庫存2,176

MC908KX2MDWER

NXP

IC MCU 8BIT 2KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 2KB (2K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存6,672

LPC2364FBD100,551

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 72MHz
Connectivity: CAN, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 34K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 6x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存25,182

MM908E622ACEK

NXP

IC HALF-BRIDGE QUAD 54-SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 12
Voltage - Supply: 9 V ~ 16 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

封裝: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

庫存5,808

MSC8157ESVT1000A

NXP

IC DSP 6-CORE DGTL 783FCBGA

Type: SC3850 Six Core
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Clock Rate: 1GHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 6.375MB
Voltage - I/O: 1.0V, 1.5V, 2.5V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存5,072

KMI16/1/V3PX

NXP

MAGNET SWITCH SPEC PURP SOT477B

Function: Special Purpose
Technology: Magnetoresistive
Polarization: -
Sensing Range: -
Test Condition: -
Voltage - Supply: 4.5 V ~ 16 V
Current - Supply (Max): 14mA
Current - Output (Max): 20mA
Output Type: Open Collector
Features: Amplified Output, Temperature Compensated
Operating Temperature: -40°C ~ 150°C (TA)
Package / Case: 3-SIP Module
Supplier Device Package: SOT477B

封裝: 3-SIP Module

庫存7,110

SAA6581T/V1,512

NXP

IC DEMODULATOR RDS/RBDS 16SOIC

Function: Demodulator, Filter
LO Frequency: 4.332MHz, 8.664MHz
RF Frequency: -
P1dB: -
Gain: 20dB
Noise Figure: -
Current - Supply: 6mA
Voltage - Supply: 4 V ~ 5.5 V
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存7,650

MW6IC2240NBR1

NXP

IC PWR AMP RF 28V 4.5W TO-272-16

Frequency: 2.11GHz ~ 2.17GHz
P1dB: -
Gain: 28dB
Noise Figure: -
RF Type: Cellular, W-CDMA
Voltage - Supply: 28V
Current - Supply: 210mA
Test Frequency: -
Package / Case: TO-272-16 Variant, Flat Leads
Supplier Device Package: TO-272 WB-16

封裝: TO-272-16 Variant, Flat Leads

庫存43,020

S908AZ60AE2MFUE

NXP

8-BIT MCU HC08 CORE 8MHZ 60KB

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 52
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 15x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-QFP

庫存2,752

SPC5605BF1MLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 77
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 7x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存7,184

SPC5673FAMVR2R

NXP

IC MCU 32BIT 3MB FLASH 416BBGA

Core Processor: e200z7
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封裝: -

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LPC55S26JEV98K

NXP

IC MCU 32BIT 256KB FLASH 98VFBGA

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 98-VFBGA
Supplier Device Package: 98-VFBGA (7x7)

封裝: -

庫存3,366

MC56F81766MLF

NXP

32-BIT DSC, 56800EX CORE, 128KB

Type: Digital Signal Controllers
Interface: I2C, LINbus, QSCI, QSPI
Clock Rate: 100MHz
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: -

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S9S12ZVL32AMLCR

NXP

S12Z CPU, 32K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 6x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: -

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