頁 139 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PDTC114YK,115	NXP	TRANS PREBIAS NPN 250MW SMT3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 10k Resistor - Emitter Base (R2) (Ohms): 47k DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存6,928
PDTA115TE,115	NXP	TRANS PREBIAS PNP 150MW SC75 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 100k Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 150mW Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	封裝: SC-75, SOT-416	庫存2,736
BFR505,215	NXP	TRANS NPN 15V 9GHZ SOT-23 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 15V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.2dB ~ 2.1dB @ 900MHz Gain: - Power - Max: 150mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V Current - Collector (Ic) (Max): 18mA Operating Temperature: 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存5,392
NE57810S,518	NXP	IC DDR TERMINATION SPAK-5 Applications: Converter, DDR Voltage - Input: 1.6 V ~ 3.6 V Number of Outputs: 1 Voltage - Output: - Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: SPak-5 (5 leads + Tab) Supplier Device Package: 5-SPAK	封裝: SPak-5 (5 leads + Tab)	庫存5,472
TDA3608TH/N3C,512	NXP	IC MULT VOLT REG W/SWITCH 20HSOP Applications: Processor Current - Supply: 500µA Voltage - Supply: 9.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	封裝: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	庫存7,824
UBA2015T/1,118	NXP	IC LAMP DVR FLUORES 600V 20-SOIC Type: CFL/TL Controller Frequency: - Voltage - Supply: 11.9 V ~ 13.8 V Current - Supply: 1.7mA Current - Output Source/Sink: - Dimming: No Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存6,800
74HCT670D,652	NXP	IC 4X4 REGISTER FILE 3ST 16SOIC Logic Type: Register File Output Type: Tri-State Number of Elements: 1 Number of Bits per Element: 4 Function: Universal Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存4,352
74LV574N,112	NXP	IC D-TYPE POS TRG SNGL 20DIP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 70MHz Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 16mA, 16mA Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Iq): 20µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm)	封裝: 20-DIP (0.300", 7.62mm)	庫存4,080
TDA9886HN/V4,518	NXP	IC IF-PLL I2C-BUS DEMOD 32-HVQFN Type: Demodulator Applications: TV Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存3,408
MC7448HX1600LC	NXP	IC MPU MPC74XX 1.6GHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.6GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	封裝: 360-BCBGA, FCCBGA	庫存2,720
P1012NXN2DFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存4,672
SPC5516EBMLQ66	NXP	IC MCU 32BIT 1MB FLASH 144LQFP Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存5,488
MC56F84567VLL	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 80MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b, 8x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存4,752
MC9S08AC60CFUER	NXP	IC MCU 8BIT 60KB FLASH 64QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-QFP	庫存5,984
LPC1114FBD48/323,1	NXP	IC MCU 32BIT 48KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 42 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存15,672
TDA8763AM/4/C4,118	NXP	IC ADC 10BIT HS 28-SSOP Number of Bits: 10 Sampling Rate (Per Second): 40M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: Sigma-Delta Reference Type: External Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Mounting Type: -	封裝: 28-SSOP (0.209", 5.30mm Width)	庫存2,080
JN5168-001-M03Z	NXP	RF TXRX MODULE 802.15.4 U.FL ANT RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: O-QPSK Frequency: 2.4GHz Data Rate: - Power - Output: 2.5dBm Sensitivity: -95dBm Serial Interfaces: I2C, SPI, UART Antenna Type: Not Included, U.FL Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Voltage - Supply: 2 V ~ 3.6 V Current - Receiving: 17mA Current - Transmitting: 15.3mA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Package / Case: 27-SMD Module	封裝: 27-SMD Module	庫存22,392
MC33493MOD315EV	NXP	BOARD EVAL MC33493 TANGO Type: Transmitter Frequency: 315MHz For Use With/Related Products: MC33493 Supplied Contents: Board	封裝: -	庫存5,706
MC33FS6510NAER2	NXP	SYSTEM BASIS CHIP DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP Exposed Pad	庫存5,616
MC34PF1510A3EPR2	NXP	PF1510 Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	封裝: 40-VFQFN Exposed Pad	庫存4,912
MC25XS6300BEK	NXP	IC SWITCH HIGH SIDE 32SOIC Switch Type: - Number of Outputs: - Ratio - Input:Output: - Output Configuration: - Output Type: - Interface: - Voltage - Load: - Voltage - Supply (Vcc/Vdd): - Current - Output (Max): - Rds On (Typ): - Input Type: - Features: - Fault Protection: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,584
S912ZVML64F3VKH	NXP	S12Z CORE 128K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP-EP (10x10)	封裝: 64-LQFP Exposed Pad	庫存2,400
LS1017ASN7PQA	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: USB 3.0 (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	封裝: -	Request a Quote
PCA9460BUKZ	NXP	POWER MANAGE IC (PMIC) FOR I.MX Applications: Microcontroller, MCU Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 42-UFBGA, WLCSP Supplier Device Package: 42-WLCSP (2.86x2.46)	封裝: -	Request a Quote
TJA1027T-20-2Z	NXP	IC TRANSCEIVER 1/1 8SO Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: 175 mV Data Rate: - Voltage - Supply: 5V ~ 18V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: -	Request a Quote
SAF4000EL-101S201K	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
FS32K148UAT0VLLT	NXP	IC MCU 32BIT 2MB FLASH 100LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 112MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Number of I/O: 89 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: -	Request a Quote
MIMX8MN5DVPIZAA	NXP	IC MPU I.MX8MN 1.4GHZ 306TFBGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Ethernet: GbE SATA: - USB: USB 2.0 OTG + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Package / Case: 306-TFBGA Supplier Device Package: 306-TFBGA (11x11)	封裝: -	庫存288

PDTC114YK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 10k
Resistor - Emitter Base (R2) (Ohms): 47k
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存6,928

PDTA115TE,115

NXP

TRANS PREBIAS PNP 150MW SC75

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 100k
Resistor - Emitter Base (R2) (Ohms): -
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 150mW
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

封裝: SC-75, SOT-416

庫存2,736

BFR505,215

NXP

TRANS NPN 15V 9GHZ SOT-23

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 15V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 2.1dB @ 900MHz
Gain: -
Power - Max: 150mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Current - Collector (Ic) (Max): 18mA
Operating Temperature: 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存5,392

NE57810S,518

NXP

IC DDR TERMINATION SPAK-5

Applications: Converter, DDR
Voltage - Input: 1.6 V ~ 3.6 V
Number of Outputs: 1
Voltage - Output: -
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: SPak-5 (5 leads + Tab)
Supplier Device Package: 5-SPAK

封裝: SPak-5 (5 leads + Tab)

庫存5,472

TDA3608TH/N3C,512

NXP

IC MULT VOLT REG W/SWITCH 20HSOP

Applications: Processor
Current - Supply: 500µA
Voltage - Supply: 9.5 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 20-HSOP

封裝: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

庫存7,824

UBA2015T/1,118

NXP

IC LAMP DVR FLUORES 600V 20-SOIC

Type: CFL/TL Controller
Frequency: -
Voltage - Supply: 11.9 V ~ 13.8 V
Current - Supply: 1.7mA
Current - Output Source/Sink: -
Dimming: No
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存6,800

74HCT670D,652

NXP

IC 4X4 REGISTER FILE 3ST 16SOIC

Logic Type: Register File
Output Type: Tri-State
Number of Elements: 1
Number of Bits per Element: 4
Function: Universal
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存4,352

74LV574N,112

NXP

IC D-TYPE POS TRG SNGL 20DIP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 70MHz
Max Propagation Delay @ V, Max CL: 17ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 16mA, 16mA
Voltage - Supply: 1 V ~ 5.5 V
Current - Quiescent (Iq): 20µA
Input Capacitance: 3.5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)

封裝: 20-DIP (0.300", 7.62mm)

庫存4,080

TDA9886HN/V4,518

NXP

IC IF-PLL I2C-BUS DEMOD 32-HVQFN

Type: Demodulator
Applications: TV
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存3,408

MC7448HX1600LC

NXP

IC MPU MPC74XX 1.6GHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.6GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BCBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

封裝: 360-BCBGA, FCCBGA

庫存2,720

P1012NXN2DFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存4,672

SPC5516EBMLQ66

NXP

IC MCU 32BIT 1MB FLASH 144LQFP

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 66MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 111
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存5,488

MC56F84567VLL

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 16x12b, 8x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存4,752

MC9S08AC60CFUER

NXP

IC MCU 8BIT 60KB FLASH 64QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-QFP

庫存5,984

LPC1114FBD48/323,1

NXP

IC MCU 32BIT 48KB FLASH 48LQFP

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 42
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存15,672

TDA8763AM/4/C4,118

NXP

IC ADC 10BIT HS 28-SSOP

Number of Bits: 10
Sampling Rate (Per Second): 40M
Number of Inputs: 1
Input Type: Single Ended
Data Interface: Parallel
Configuration: ADC
Ratio - S/H:ADC: -
Number of A/D Converters: 1
Architecture: Sigma-Delta
Reference Type: External
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP
Mounting Type: -

封裝: 28-SSOP (0.209", 5.30mm Width)

庫存2,080

JN5168-001-M03Z

NXP

RF TXRX MODULE 802.15.4 U.FL ANT

RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: O-QPSK
Frequency: 2.4GHz
Data Rate: -
Power - Output: 2.5dBm
Sensitivity: -95dBm
Serial Interfaces: I2C, SPI, UART
Antenna Type: Not Included, U.FL
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Voltage - Supply: 2 V ~ 3.6 V
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Package / Case: 27-SMD Module

封裝: 27-SMD Module

庫存22,392

MC33493MOD315EV

NXP

BOARD EVAL MC33493 TANGO

Type: Transmitter
Frequency: 315MHz
For Use With/Related Products: MC33493
Supplied Contents: Board

封裝: -

庫存5,706

MC33FS6510NAER2

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP Exposed Pad

庫存5,616

MC34PF1510A3EPR2

NXP

PF1510

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

封裝: 40-VFQFN Exposed Pad

庫存4,912

MC25XS6300BEK

NXP

IC SWITCH HIGH SIDE 32SOIC

Switch Type: -
Number of Outputs: -
Ratio - Input:Output: -
Output Configuration: -
Output Type: -
Interface: -
Voltage - Load: -
Voltage - Supply (Vcc/Vdd): -
Current - Output (Max): -
Rds On (Typ): -
Input Type: -
Features: -
Fault Protection: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,584

S912ZVML64F3VKH

NXP

S12Z CORE 128K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP-EP (10x10)

封裝: 64-LQFP Exposed Pad

庫存2,400

LS1017ASN7PQA

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: 1Gbps (1), 2.5Gbps (5)
SATA: SATA 6Gbps (1)
USB: USB 3.0 (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Secure Boot, TrustZone®
Package / Case: 448-BFBGA
Supplier Device Package: 448-FBGA (17x17)

封裝: -

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PCA9460BUKZ

NXP

POWER MANAGE IC (PMIC) FOR I.MX

Applications: Microcontroller, MCU
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 42-UFBGA, WLCSP
Supplier Device Package: 42-WLCSP (2.86x2.46)

封裝: -

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TJA1027T-20-2Z

NXP

IC TRANSCEIVER 1/1 8SO

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: 175 mV
Data Rate: -
Voltage - Supply: 5V ~ 18V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: -

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SAF4000EL-101S201K

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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FS32K148UAT0VLLT

NXP

IC MCU 32BIT 2MB FLASH 100LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 112MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 32x12b SAR; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

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MIMX8MN5DVPIZAA

NXP

IC MPU I.MX8MN 1.4GHZ 306TFBGA

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.4GHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Ethernet: GbE
SATA: -
USB: USB 2.0 OTG + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Package / Case: 306-TFBGA
Supplier Device Package: 306-TFBGA (11x11)

封裝: -

庫存288